专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20110063812A1 ELECTRONIC DEVICE, METHOD OF MANUFACTURING ELECTRONIC DEVICE, AND ELECTRONIC EQUIPMENT 审中-公开
标题翻译：电子设备，制造电子设备的方法和电子设备
公开(公告)号：US20110063812A1
公开(公告)日：2011-03-17
申请号：US12853647
申请日：2010-08-10
申请人： Teru NAKANISHI , Nobuyuki Hayashi , Masaru Morita , Yasuhiro Yoneda
发明人： Teru NAKANISHI , Nobuyuki Hayashi , Masaru Morita , Yasuhiro Yoneda
IPC分类号： H05K7/02 , H05K3/30
CPC分类号： H05K3/3426 , G01R31/2853 , H01L23/3121 , H01L23/367 , H01L23/4006 , H01L23/49827 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/81 , H01L2224/03828 , H01L2224/111 , H01L2224/11334 , H01L2224/13011 , H01L2224/13099 , H01L2224/131 , H01L2224/73253 , H01L2224/81054 , H01L2224/8121 , H01L2224/81815 , H01L2924/0001 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/19041 , H05K3/3436 , H05K3/3484 , H05K2201/10257 , H05K2201/10265 , H05K2201/10984 , H05K2201/2036 , Y02P70/613 , Y10T29/4913
摘要： An electronic device includes a circuit board having a first electrode formed on a main surface thereof, a semiconductor device disposed toward the main surface of the circuit board, the semiconductor device having a second electrode formed on a surface thereof opposed to the main surface, and a connection member electrically connecting between the first and second electrodes. The connection member includes a hollow cylindrical member and a conductive member disposed within the hollow cylindrical member.
摘要翻译：电子设备包括：电路板，具有形成在其主表面上的第一电极，半导体器件设置在电路板的主表面上，该半导体器件具有形成在与主表面相对的表面上的第二电极，电连接在第一和第二电极之间的连接构件。连接构件包括中空圆柱形构件和设置在中空圆柱形构件内的导电构件。

2. 发明申请

US20110299255A1 SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE SAME, ELECTRONIC DEVICE, AND ELECTRONIC COMPONENT 有权
标题翻译：半导体器件，其制造方法，电子器件和电子元器件
公开(公告)号：US20110299255A1
公开(公告)日：2011-12-08
申请号：US13212467
申请日：2011-08-18
申请人： Teru NAKANISHI , Nobuyuki HAYASHI , Masaru MORITA , Yasuhiro YONEDA
发明人： Teru NAKANISHI , Nobuyuki HAYASHI , Masaru MORITA , Yasuhiro YONEDA
IPC分类号： H05K1/18 , H01L21/60
CPC分类号： H05K1/0296 , H01L23/13 , H01L23/49811 , H01L23/49822 , H01L23/49827 , H01L23/49833 , H01L23/4985 , H01L24/16 , H01L24/81 , H01L2224/0401 , H01L2224/05647 , H01L2224/1379 , H01L2224/13839 , H01L2224/13847 , H01L2224/16225 , H01L2224/16235 , H01L2224/81193 , H01L2224/81801 , H01L2924/01004 , H01L2924/01078 , H01L2924/01079 , H01L2924/12042 , H01L2924/15311 , H05K1/181 , H05K3/3436 , H05K2201/10287 , H05K2201/10378 , H05K2201/10424 , H05K2201/10719 , Y02P70/613 , H01L2924/00
摘要： A semiconductor device includes: a wiring board including a first electrode pad on a surface thereof; a circuit board disposed to stand on the wiring board, and including an interconnection connected to the first electrode pad; and a semiconductor package disposed to face the wiring board with the circuit board interposed therebetween, and including a second electrode pad on a surface thereof, the second electrode pad being connected to the interconnection.
摘要翻译：半导体器件包括：布线板，其表面上包括第一电极焊盘; 电路板，被布置成站立在所述布线板上，并且包括连接到所述第一电极焊盘的互连; 以及半导体封装，其设置成与所述布线板面对所述电路板，并且在其表面上包括第二电极焊盘，所述第二电极焊盘连接到所述互连。

3. 发明申请

US20120176759A1 ELECTRONIC DEVICE, INTERPOSER AND METHOD OF MANUFACTURING ELECTRONIC DEVICE 有权
标题翻译：电子设备，插接器和制造电子器件的方法
公开(公告)号：US20120176759A1
公开(公告)日：2012-07-12
申请号：US13331105
申请日：2011-12-20
申请人： Teru NAKANISHI , Nobuyuki Hayashi , Masaru Morita , Yasuhiro Yoneda
发明人： Teru NAKANISHI , Nobuyuki Hayashi , Masaru Morita , Yasuhiro Yoneda
IPC分类号： H05K7/06 , H05K1/03 , B23K31/02 , H05K1/11
CPC分类号： H01L23/49827 , H01L23/49816 , H01L2224/16 , H01L2924/09701 , H01L2924/15311 , H05K3/3436 , H05K2201/09136 , H05K2201/10378 , H05K2201/10992 , Y02P70/613
摘要： An electronic device includes a wiring board including a first electrode and a second electrode, a semiconductor device mounted on the wiring board and including a first terminal and a second terminal, an interposer provided between the wiring board and the semiconductor device, the interposer including a conductive pad and a sheet supporting the conductive pad, the conductive pad having a first surface on a side of the wiring board and a second surface on a side of the semiconductor device, a first solder connecting the first electrode positioned outside of an area in which the interposer is disposed with the first terminal positioned outside of the area, a second solder connecting the second electrode positioned inside of the area with the first surface of the conductive pad, and a third solder connecting the second terminal positioned inside of the area with the second surface of the conductive pad.
摘要翻译：一种电子设备，包括：第一电极和第二电极的布线板;安装在所述布线板上的半导体器件，包括第一端子和第二端子，所述插入器设置在所述布线板和所述半导体器件之间，所述插入器包括：所述导电焊盘和支撑所述导电焊盘的片材，所述导电焊盘具有在所述布线板的一侧上的第一表面和所述半导体器件的一侧上的第二表面;第一焊料，其将位于其中的所述第一电极的位于所述插入件与所述第一端子位于所述区域的外侧，所述第二焊料将位于所述区域内的所述第二电极与所述导电焊盘的所述第一表面连接;以及第三焊料，其将位于所述区域内的所述第二端子与导电垫的第二表面。

4. 发明申请

US20120014068A1 ELECTRONIC DEVICE 有权
标题翻译：电子设备
公开(公告)号：US20120014068A1
公开(公告)日：2012-01-19
申请号：US13103296
申请日：2011-05-09
申请人： Teru NAKANISHI , Nobuyuki HAYASHI , Masaru MORITA , Katsusada MOTOYOSHI , Yasuhiro YONEDA
发明人： Teru NAKANISHI , Nobuyuki HAYASHI , Masaru MORITA , Katsusada MOTOYOSHI , Yasuhiro YONEDA
IPC分类号： H05K7/20
CPC分类号： H01L23/473 , H01L23/10 , H01L23/40 , H01L23/552 , H01L2224/16225 , H01L2224/32225 , H01L2224/32245 , H01L2224/73204 , H01L2224/73253 , H01L2924/09701 , H01L2924/15311 , H01L2924/16195 , H01L2924/16251 , H01L2924/00
摘要： An electronic device includes an electronic component mounted on a substrate; a cooling system for cooling the electronic component; and a fastening structure for fastening the cooling system to the substrate. The fastening structure includes a first magnet provided to one of the substrate and the cooling system, a second magnetic material fixed to the other of the substrate and the cooling system and magnetically coupled with the first magnet, and a magnetic shield that covers a part or all of the first magnet except for a coupling face to be coupled with the second magnetic material.
摘要翻译：电子设备包括安装在基板上的电子部件; 用于冷却电子部件的冷却系统; 以及用于将冷却系统紧固到基板的紧固结构。所述紧固结构包括设置在所述基板和所述冷却系统中的一个上的第一磁体，固定到所述基板和所述冷却系统中的另一个的第二磁性材料，并且与所述第一磁体磁耦合;以及磁屏蔽，其覆盖部件或所有第一磁体除了与第二磁性材料耦合的耦合面之外。

5. 发明申请

US20100073146A1 Method Of Controlling Communication Frequencies Of Wireless Communication System, Controller Of The System, And Wireless Communication System 审中-公开
标题翻译：无线通信系统通信频率控制方法，系统控制器及无线通信系统
公开(公告)号：US20100073146A1
公开(公告)日：2010-03-25
申请号：US12626098
申请日：2009-11-25
申请人： Manabu KAI , Toru MANIWA , Kazunori YAMANAKA , Akihiko AKASEGAWA , Teru NAKANISHI
发明人： Manabu KAI , Toru MANIWA , Kazunori YAMANAKA , Akihiko AKASEGAWA , Teru NAKANISHI
IPC分类号： G08C19/00 , H04B15/00
CPC分类号： G06K7/0008 , G06K7/10069
摘要： The wireless communication system sets at least one of the multiple wireless frequencies as a reception frequency from the wireless tag, and controls the temperature of a superconducting filter in response to the selected reception frequency, thereby the pass band or the rejection band of the superconducting filter is controlled.
摘要翻译：无线通信系统将多个无线频率中的至少一个设置为来自无线标签的接收频率，并且响应于所选择的接收频率来控制超导滤波器的温度，从而超导滤波器的通带或阻带被控制。

6. 发明申请

US20080266033A1 HIGH FREQUENCY FILTER HAVING RESONANCE PATTERN OF MICROSTRIP LINE OR STRIP LINE STRUCTURE 有权
标题翻译：具有微带线或条状线结构的共振图案的高频滤波器
公开(公告)号：US20080266033A1
公开(公告)日：2008-10-30
申请号：US12108886
申请日：2008-04-24
申请人： Masatoshi ISHII , Kazunori YAMANAKA , John D. BANIECKI , Akihiko AKASEGAWA , Teru NAKANISHI
发明人： Masatoshi ISHII , Kazunori YAMANAKA , John D. BANIECKI , Akihiko AKASEGAWA , Teru NAKANISHI
IPC分类号： H01P1/203
CPC分类号： H01P1/20381
摘要： A resonance pattern (21) made of conductive material and having a circular plan shape is formed over the principal surface of a dielectric substrate. First and second virtual straight lines mutually crossing at a right angle are defined. A first input port (22) and a first output port (23) are electromagnetically coupled to the resonance pattern at two cross points between the first virtual straight line and an outer circumference line of the resonance pattern. A second input port (24) and a second output port (25) are electromagnetically coupled to the resonance pattern at two cross points between the second virtual straight line and the outer circumference line of the resonance pattern. A first inter-port waveguide (26) propagates a high frequency signal output to the first output port to the second input port.
摘要翻译：在电介质基板的主表面上形成由导电材料制成且具有圆形平面形状的共振图案（21）。定义了以直角相互交叉的第一和第二虚拟直线。第一输入端口（22）和第一输出端口（23）在谐振模式的第一虚拟直线和外周线之间的两个交叉点处电磁耦合到谐振模式。第二输入端口（24）和第二输出端口（25）在谐振模式的第二虚拟直线和外周线之间的两个交叉点处电磁耦合到谐振模式。第一端口间波导（26）将高频信号输出传播到第一输出端口到第二输入端口。

7. 发明申请

US20100105563A1 SUPERCONDUCTIVE FILTER WITH PLURALITY OF RESONATOR PATTERNS FORMED ON SURFACE OF DIELECTRIC SUBSTRATE 有权
标题翻译：具有多个形成在介质基板表面上的谐振器图案的超导滤波器
公开(公告)号：US20100105563A1
公开(公告)日：2010-04-29
申请号：US12606719
申请日：2009-10-27
申请人： Teru NAKANISHI , Akihiko AKASEGAWA , Kazunori YAMANAKA , Kazuaki KURIHARA
发明人： Teru NAKANISHI , Akihiko AKASEGAWA , Kazunori YAMANAKA , Kazuaki KURIHARA
IPC分类号： H01P1/20
CPC分类号： H01P1/20381
摘要： A superconductive filter includes a superconductive filter substrate having a dielectric substrate and a plurality of resonator patterns formed on a surface of the dielectric substrate, the plurality of resonator patterns including a superconductive material; a package accommodating the superconductive filter substrate; and an intermediate substrate disposed between an inner surface of the package and the superconductive filter substrate, and thermally coupling the package and the superconductive filter substrate wherein a difference between a degree of contraction of the intermediate substrate and the degree of contraction of the dielectric substrate is smaller than a difference between the degree of contraction of the dielectric substrate and the degree of contraction of the package, when the package, the intermediate substrate, and the dielectric substrate are cooled from room temperature to a critical temperature of the resonator patterns.
摘要翻译：超导滤波器包括具有电介质基板和形成在电介质基板的表面上的多个谐振器图案的超导滤波器基板，所述多个谐振器图案包括超导材料; 容纳超导滤波器基板的封装; 以及设置在所述封装的内表面和所述超导滤光器基板之间的中间基板，并且使所述封装和所述超导滤光器基板热耦合，其中所述中间基板的收缩程度与所述电介质基板的收缩程度之间的差为当封装，中间基板和电介质基板从室温冷却到谐振器图案的临界温度时，电介质基板的收缩程度和封装的收缩程度之间的差小于介电基板的收缩程度。

8. 发明申请

US20080297284A1 DUAL-MODE FILTER AND TUNING METHOD OF THE SAME 有权
标题翻译：双模滤波器及其调谐方法
公开(公告)号：US20080297284A1
公开(公告)日：2008-12-04
申请号：US12117322
申请日：2008-05-08
申请人： Masatoshi ISHII , Kazunori YAMANAKA , John D. BANIECKI , Akihiko AKASEGAWA , Teru NAKANISHI
发明人： Masatoshi ISHII , Kazunori YAMANAKA , John D. BANIECKI , Akihiko AKASEGAWA , Teru NAKANISHI
IPC分类号： H01P1/20
CPC分类号： H01P1/20381
摘要： A dual-mode filter capable of providing a high degree of design freedom and/or tunability is disclosed. The dual-mode filter includes a ring resonator; an input feeder and an output feeder disposed substantially orthogonal with respect to each other and with respect to the ring resonator so as to be electromagnetically coupled to the ring resonator; and a dual-mode generating line disposed inside the ring resonator in a manner so that the dual-mode generating line does not overlap with a line extending from the input feeder or a line extending from the output feeder.
摘要翻译：公开了能够提供高度设计自由度和/或可调性的双模式滤波器。双模滤波器包括环形谐振器; 输入馈送器和输出馈送器，其相对于彼此和相对于环形谐振器基本上正交地设置成电磁耦合到环形谐振器; 以及设置在环形谐振器内部的双模式发电线路，使得双模式发电线路不与从输入馈线或从输出馈线延伸的线路延伸的线路重叠。

9. 发明申请

US20080274899A1 SUPERCONDUCTING DISK RESONATOR 审中-公开
标题翻译：超级磁盘共振器
公开(公告)号：US20080274899A1
公开(公告)日：2008-11-06
申请号：US12039127
申请日：2008-02-28
申请人： Akihiko AKASEGAWA , Teru NAKANISHI , Keisuke SATO
发明人： Akihiko AKASEGAWA , Teru NAKANISHI , Keisuke SATO
IPC分类号： H01P1/203
CPC分类号： H01P7/08
摘要： A superconducting disk resonator is disclosed that includes a dielectric base substrate having dielectric anisotropy, a disk type superconducting resonator pattern that is formed on the dielectric base substrate with superconducting material, and a pair of signal input/output lines arranged on the dielectric base substrate and extending in a straight line towards the disk type superconducting resonator pattern. The direction of dielectric anisotropy of the dielectric base substrate is oriented at ±90 degrees with respect to an extending direction of the pair of signal input/output lines.
摘要翻译：公开了一种超导磁盘谐振器，其包括具有介电各向异性的电介质基底基板，在具有超导材料的电介质基底上形成的盘型超导谐振器图案和布置在电介质基底基板上的一对信号输入/输出线，沿着直线向盘型超导谐振器图案延伸。电介质基底基板的介电各向异性方向相对于一对信号输入/输出线的延伸方向取向为±90度。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式