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    • 4. 发明授权
    • Polishing composition
    • 抛光组成
    • US07666238B2
    • 2010-02-23
    • US11948705
    • 2007-11-30
    • Shigeo FujiiHiroyuki YoshidaToshiya HagiharaHiroaki Kitayama
    • Shigeo FujiiHiroyuki YoshidaToshiya HagiharaHiroaki Kitayama
    • B24D3/02C09C1/68C09G1/02C09K13/00
    • C09G1/02C09K3/1409C09K3/1463
    • A polishing composition comprising an abrasive and water, wherein the polishing composition has an index of degree of sedimentation of 80 or more and 100 or less; a process for producing a substrate comprising polishing a substrate to be polished using the above-mentioned composition; a process for preventing clogging of a polishing pad comprising applying the above-mentioned composition; a process for preventing clogging of a polishing pad comprising applying the above-mentioned composition to polishing with a polishing pad for a nickel-containing object to be polished; and a process for preventing clogging of a polishing pad comprising applying a composition comprising a hydrophilic polymer having two or more hydrophilic groups in its molecule and a molecular weight of 300 or more, or a compound capable of dissolving nickel hydroxide at a pH of 8.0, and water to polishing with a polishing pad for a nickel-containing object to be polished.
    • 一种抛光组合物,其包含研磨剂和水,其中所述抛光组合物的沉降度指数为80以上且100以下; 用于制造基材的方法,包括使用上述组合物抛光待抛光的基材; 防止抛光垫堵塞的方法,包括施加上述组合物; 一种用于防止抛光垫堵塞的方法,包括将上述组合物用抛光用的待研磨的含镍物体的抛光垫进行抛光; 以及防止抛光垫堵塞的方法,包括在其分子中施加包含其分子中具有两个或更多个亲水基团的亲水性聚合物和分子量为300以上的组合物或能够溶解氢氧化镍的化合物在pH为8.0的组合物, 和水用抛光用的抛光垫进行抛光。
    • 5. 发明申请
    • POLISHING COMPOSITION
    • 抛光组合物
    • US20080160881A1
    • 2008-07-03
    • US11948705
    • 2007-11-30
    • Shigeo FujiiHiroyuki YoshidaToshiya HagiharaHiroaki Kitayama
    • Shigeo FujiiHiroyuki YoshidaToshiya HagiharaHiroaki Kitayama
    • C09G1/02B24B1/00C09K3/14
    • C09G1/02C09K3/1409C09K3/1463
    • A polishing composition comprising an abrasive and water, wherein the polishing composition has an index of degree of sedimentation of 80 or more and 100 or less; a process for producing a substrate comprising polishing a substrate to be polished using the above-mentioned composition; a process for preventing clogging of a polishing pad comprising applying the above-mentioned composition; a process for preventing clogging of a polishing pad comprising applying the above-mentioned composition to polishing with a polishing pad for a nickel-containing object to be polished; and a process for preventing clogging of a polishing pad comprising applying a composition comprising a hydrophilic polymer having two or more hydrophilic groups in its molecule and a molecular weight of 300 or more, or a compound capable of dissolving nickel hydroxide at a pH of 8.0, and water to polishing with a polishing pad for a nickel-containing object to be polished.
    • 一种抛光组合物,其包含研磨剂和水,其中所述抛光组合物的沉降度指数为80以上且100以下; 一种生产基材的方法,包括使用上述组合物抛光待抛光的基材; 包括施加上述组合物的防止抛光垫堵塞的方法; 一种用于防止抛光垫堵塞的方法,包括将上述组合物用抛光用的待研磨的含镍物体的抛光垫进行抛光; 以及防止抛光垫堵塞的方法,其包括在其分子中施加包含其分子中具有两个或更多个亲水基团的亲水性聚合物和分子量为300以上的组合物或能够溶解氢氧化镍的化合物在pH为8.0的组合物, 和水用抛光用的抛光垫进行抛光。
    • 6. 发明申请
    • Polishing composition
    • 抛光组成
    • US20050208883A1
    • 2005-09-22
    • US11081560
    • 2005-03-17
    • Hiroyuki YoshidaYuichi HonmaShigeaki TakashinaToshiya Hagihara
    • Hiroyuki YoshidaYuichi HonmaShigeaki TakashinaToshiya Hagihara
    • B24B1/00B24B7/24B24B37/04B24D3/02C09G1/02C09K3/14
    • C09G1/02B24B37/044C09K3/1436C09K3/1463
    • The present invention relates to a polishing composition containing an aqueous medium and silica particles, wherein the silica particles in the polishing composition has a zeta potential of from −15 to 40 mV; a method for manufacturing a substrate including the step of polishing a substrate to be polished with a polishing composition containing an aqueous medium and silica particles, wherein the silica particles in the polishing composition has a zeta potential of from −15 to 40 mV; and a method for reducing scratches on a substrate to be polished with a polishing composition containing an aqueous medium and silica particles, including the step of adjusting a zeta potential of silica particles in the polishing composition to −15 to 40 mV. The polishing composition can be favorably used in polishing the substrate for precision parts, including substrates for magnetic recording media such as magnetic discs, optical discs and opto-magnetic discs; photomask substrates; optical lenses; optical mirrors; optical prisms; semiconductor substrates; and the like.
    • 本发明涉及含有水性介质和二氧化硅颗粒的抛光组合物,其中抛光组合物中的二氧化硅颗粒的ζ电位为-15至40mV; 一种基板的制造方法,其特征在于,包括使用含有水性介质和二氧化硅粒子的研磨用组合物研磨待研磨基板的工序,其中,研磨用组合物中的二氧化硅粒子的ζ电位为-15〜40mV, 以及包括将研磨用组合物中的二氧化硅粒子的ζ电位调整为-15〜40mV的步骤的减少含有水性介质和二氧化硅粒子的研磨用组合物的研磨用基板上的划痕的方法。 抛光组合物可以有利地用于抛光用于精密部件的基板,包括用于诸如磁盘,光盘和光磁盘的磁记录介质的基板; 光掩模基板; 光学镜片; 光学镜; 光学棱镜 半导体衬底; 等等。
    • 7. 发明授权
    • Image measuring apparatus
    • 图像测量仪
    • US09354433B2
    • 2016-05-31
    • US13398042
    • 2012-02-16
    • Hiroyuki Yoshida
    • Hiroyuki Yoshida
    • H04N5/232H04N7/18G02B21/00G01B11/24G02B21/36G03B3/10G03B13/36G03B15/02
    • G02B21/0016G01B11/24G02B21/365G03B3/10G03B13/36G03B15/02H04N5/23212
    • An image measuring apparatus includes: an imaging device of a rolling shutter type configured to image a work; a position control system configured to output a focusing position as information representing a position in a direction of a focusing axis by controlling an in-focus position of the imaging device; and a computing device configured to calculate, from image information acquired from the imaging device, contrast information corresponding to the image information, wherein the computing device divides an acquired image into a plurality of regions and corrects the contrast information corresponding to the image information based on a position of and the contrast information corresponding to each of the regions.
    • 一种图像测量装置包括:被配置为对工件进行成像的滚动快门类型的成像装置; 位置控制系统,被配置为通过控制成像装置的对焦位置来输出聚焦位置作为表示聚焦轴方向上的位置的信息; 以及计算装置,被配置为从从所述成像装置获取的图像信息中计算与所述图像信息相对应的对比度信息,其中,所述计算装置将获取的图像划分为多个区域,并且基于所述图像信息对应于所述图像信息来校正所述对比度信息 对应于每个区域的位置和对比度信息。