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11. 发明授权

US08585937B2 Glass thick film embedded passive material 有权
标题翻译：玻璃厚膜嵌入式无源材料
公开(公告)号：US08585937B2
公开(公告)日：2013-11-19
申请号：US13359105
申请日：2012-01-26
申请人： Nathan P. Lower , Ross K. Wilcoxon , Alan P. Boone , Nathaniel P. Wyckoff , Brandon C. Hamilton
发明人： Nathan P. Lower , Ross K. Wilcoxon , Alan P. Boone , Nathaniel P. Wyckoff , Brandon C. Hamilton
IPC分类号： H01B1/02 , H01B1/06
CPC分类号： H05K1/162 , H01L2924/0103 , H01L2924/01057 , H01L2924/01105 , H01L2924/014 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H05K1/167 , H05K2201/09763
摘要： A method for forming an embedded passive device module comprises depositing a first amount of an alkali silicate material, co-depositing an amount of embedded passive device material with the amount of alkali silicate material; and thermally processing the amount of alkali silicate material and the amount of embedded passive device material at a temperature sufficient to cure the amount of alkali silicate material and the amount of embedded passive device material and form a substantially moisture free substrate.
摘要翻译：一种用于形成嵌入式无源器件模块的方法，包括沉积第一量的碱金属硅酸盐材料，将一定量的嵌入的无源器件材料与一定量的碱金属硅酸盐材料共沉积; 并且在足以固化碱金属硅酸盐材料的量和嵌入的无源器件材料的量并形成基本上无水的衬底的温度下热处理碱金属硅酸盐材料的量和嵌入的无源器件材料的量。

12. 发明申请

US20100064695A1 Flexible flow channel for a modular liquid-cooled thermal spreader 有权
标题翻译：用于模块化液冷散热器的柔性流动通道
公开(公告)号：US20100064695A1
公开(公告)日：2010-03-18
申请号：US12283502
申请日：2008-09-12
申请人： Ross K. Wilcoxon , David W. Dlouhy , Nathan P. Lower , James R. Wooldridge
发明人： Ross K. Wilcoxon , David W. Dlouhy , Nathan P. Lower , James R. Wooldridge
IPC分类号： F25B21/02 , F28D15/00
CPC分类号： F28D15/00 , F04B17/00 , F04B19/006 , F28F3/12 , F28F2013/006 , F28F2250/08 , F28F2255/02 , H01L23/473 , H01L2224/16225 , H01L2224/73253 , H01L2924/00011 , H01L2924/00014 , H01L2924/01019 , H01L2924/09701 , H01L2924/3011 , H01L2224/0401
摘要： The present invention is a flexible liquid cooling loop for providing a thermal path between a heat source and a heat sink. The cooling loop includes a plurality of mechanically rigid tubing sections configured for being in thermal contact with the heat source and the heat sink. The cooling loop further includes a plurality of mechanically flexible tubing sections configured for connecting the mechanically rigid sections to form the loop. The loop is configured for containing a liquid. The liquid is configured for being circulated within the loop for promoting transfer of thermal energy from the heat source to the heat sink via the loop.
摘要翻译：本发明是用于在热源和散热器之间提供热路径的柔性液体冷却回路。冷却回路包括被配置为与热源和散热器热接触的多个机械刚性管段。冷却回路还包括多个机械柔性管部分，其被配置用于连接机械刚性部分以形成环。该回路配置为容纳液体。液体被配置为在回路内循环，以促进热能从热源经由回路传递到散热器。

13. 发明申请

US20080050512A1 Integrated circuit tampering protection and reverse engineering prvention coatings and methods 有权
标题翻译：集成电路篡改保护和逆向工程预防涂层和方法
公开(公告)号：US20080050512A1
公开(公告)日：2008-02-28
申请号：US11784932
申请日：2007-04-10
申请人： Nathan P. Lower , Alan P. Boone , Ross K. Wilcoxon
发明人： Nathan P. Lower , Alan P. Boone , Ross K. Wilcoxon
IPC分类号： B05D5/12
CPC分类号： H01L21/563 , H01L23/291 , H01L23/295 , H01L23/3128 , H01L23/573 , H01L24/48 , H01L24/73 , H01L2224/16225 , H01L2224/32225 , H01L2224/48227 , H01L2224/73203 , H01L2224/73204 , H01L2224/73265 , H01L2224/8192 , H01L2224/8592 , H01L2924/00011 , H01L2924/00014 , H01L2924/01004 , H01L2924/0102 , H01L2924/01068 , H01L2924/09701 , H01L2924/10253 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/0401 , H01L2224/45099
摘要： A method of protecting an electronics package is discussed along with devices formed by the method. The method involves providing at least one electronic component that requires protecting from tampering and/or reverse engineering. Further, the method includes mixing into a liquid glass material at least one of high durability micro-particles or high-durability nano-particles, to form a coating material. Further still, the method includes depositing the coating material onto the electronic component and curing the coating material deposited.
摘要翻译：与该方法形成的装置一起讨论保护电子封装的方法。该方法涉及提供至少一个电子部件，其需要防止篡改和/或逆向工程。此外，该方法包括将高耐久性微粒或高耐久性纳米粒子中的至少一种混合成液态玻璃材料，形成涂料。此外，该方法还包括将涂覆材料沉积到电子部件上并固化沉积的涂层材料。

14. 发明授权

US09196555B1 Integrated circuit protection and ruggedization coatings and methods 有权
标题翻译：集成电路保护和加固涂层及方法
公开(公告)号：US09196555B1
公开(公告)日：2015-11-24
申请号：US13287734
申请日：2011-11-02
申请人： Nathan P. Lower , Ross K. Wilcoxon , Alan P. Boone
发明人： Nathan P. Lower , Ross K. Wilcoxon , Alan P. Boone
IPC分类号： H01L23/28 , H01L23/24 , H01L23/48
CPC分类号： H01L23/24 , H01L23/291 , H01L23/3128 , H01L23/3731 , H01L23/48 , H01L24/16 , H01L24/48 , H01L24/85 , H01L25/0657 , H01L2224/13099 , H01L2224/48227 , H01L2224/8592 , H01L2924/00014 , H01L2924/01004 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/0102 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01068 , H01L2924/01074 , H01L2924/01082 , H01L2924/09701 , H01L2924/10253 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/00 , H01L2224/45099 , H01L2224/05599 , H01L2924/00012
摘要： An electronics package includes a substrate and at least one electronic component coupled to the substrate. The electronics package comprises an alkali silicate coating forming a hermetic seal around at least a portion of the at least one electronic component.
摘要翻译：电子封装包括衬底和耦合到衬底的至少一个电子部件。电子封装包括碱性硅酸盐涂层，其围绕所述至少一个电子部件的至少一部分形成气密密封。

15. 发明授权

US09177907B1 High performance deposited die attach 有权
标题翻译：高性能沉积芯片附着
公开(公告)号：US09177907B1
公开(公告)日：2015-11-03
申请号：US13438433
申请日：2012-04-03
申请人： Nathan P. Lower , Ross K. Wilcoxon , Nathaniel P. Wyckoff
发明人： Nathan P. Lower , Ross K. Wilcoxon , Nathaniel P. Wyckoff
IPC分类号： H01L21/50 , H01L23/522
CPC分类号： H01L21/50 , H01L23/13 , H01L23/522 , H01L24/06 , H01L24/29 , H01L24/32 , H01L24/81 , H01L24/83 , H01L24/85 , H01L24/92 , H01L24/97 , H01L2224/04026 , H01L2224/06183 , H01L2224/29011 , H01L2224/29147 , H01L2224/29155 , H01L2224/321 , H01L2224/32104 , H01L2224/32111 , H01L2224/81801 , H01L2224/83002 , H01L2224/831 , H01L2224/83801 , H01L2224/83907 , H01L2224/92 , H01L2224/92242 , H01L2224/92247 , H01L2224/97 , H01L2924/00014 , H01L2924/15151 , H01L2924/15153 , H01L2924/00012 , H01L2224/83 , H01L2224/81 , H01L21/304 , H01L2221/68381 , H01L2224/85 , H01L2221/68304 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
摘要： A method of manufacturing an integrated circuit device includes providing a substrate; forming at least one cavity in the substrate; positioning a die within the at least one cavity of the substrate; and depositing a die attach material around the die within the at least one cavity to mechanically bond the die to the substrate.
摘要翻译：一种制造集成电路器件的方法包括：提供衬底; 在所述基板中形成至少一个空腔; 将模具定位在所述衬底的所述至少一个空腔内; 以及在所述至少一个腔内在所述管芯附近沉积管芯附接材料以将所述管芯机械地结合到所述衬底。

16. 发明授权

US08581108B1 Method for providing near-hermetically coated integrated circuit assemblies 有权
公开(公告)号：US08581108B1
公开(公告)日：2013-11-12
申请号：US11732982
申请日：2007-04-05
申请人： Alan P. Boone , Nathan P. Lower , Ross K. Wilcoxon
发明人： Alan P. Boone , Nathan P. Lower , Ross K. Wilcoxon
IPC分类号： H05K1/16
CPC分类号： H05K3/0085 , H01L23/24 , H01L23/291 , H01L23/3128 , H01L23/3171 , H01L23/3731 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/85 , H01L25/0657 , H01L2224/0401 , H01L2224/04042 , H01L2224/05554 , H01L2224/13099 , H01L2224/16225 , H01L2224/29288 , H01L2224/29387 , H01L2224/32145 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48227 , H01L2224/48463 , H01L2224/48465 , H01L2224/4847 , H01L2224/73265 , H01L2224/85203 , H01L2224/85205 , H01L2224/85206 , H01L2224/8592 , H01L2924/00014 , H01L2924/09701 , H01L2924/10253 , H01L2924/14 , H01L2924/15311 , H01L2924/15787 , H01L2924/1579 , H01L2924/181 , Y10T29/4913 , Y10T29/49144 , Y10T29/49155 , H01L2924/00012 , H01L2924/00 , H01L2224/85399 , H01L2224/05599
摘要： The present invention is a method for providing an integrated circuit assembly, the integrated circuit assembly including an integrated circuit and a substrate. The method includes mounting the integrated circuit to the substrate. The method further includes, during assembly of the integrated circuit assembly, applying a low processing temperature, at least near-hermetic, glass-based coating directly to the integrated circuit and a localized interconnect interface, the interface being configured for connecting the integrated circuit to at least one of the substrate and a second integrated circuit of the assembly. The method further includes curing the coating. Further, the integrated circuit may be a device which is available for at least one of sale, lease and license to a general public, such as a Commercial off the Shelf (COTS) device. Still further, the coating may promote corrosion resistance and reliability of the integrated circuit assembly.

17. 发明授权

US08363189B2 Alkali silicate glass for displays 有权
标题翻译：用于显示器的碱性硅酸盐玻璃
公开(公告)号：US08363189B2
公开(公告)日：2013-01-29
申请号：US12493022
申请日：2009-06-26
申请人： James D. Sampica , Tracy J. Barnidge , Joseph L. Tchon , Nathan P. Lower , Ross K. Wilcoxon , Sandra S. Dudley
发明人： James D. Sampica , Tracy J. Barnidge , Joseph L. Tchon , Nathan P. Lower , Ross K. Wilcoxon , Sandra S. Dudley
IPC分类号： G02F1/1333
CPC分类号： G02F1/133504 , B32B17/10018 , B32B17/10174 , G02F1/13452 , G02F2001/133311 , G02F2201/50 , G02F2202/09 , G02F2202/28 , H01L51/525 , H01L2224/48091 , H01L2224/48227 , H01L2924/12044 , H01L2924/1461 , H01L2924/3025 , Y10T428/1064 , H01L2924/00014 , H01L2924/00
摘要： A display assembly comprises an electronic display element, a layer of material, and an alkali silicate glass material at least partially covering at least one of the electronic display element and the layer of material.
摘要翻译：显示组件包括至少部分地覆盖电子显示元件和材料层中的至少一个的电子显示元件，材料层和碱性硅酸盐玻璃材料。

18. 发明授权

US08205337B2 Fabrication process for a flexible, thin thermal spreader 有权
标题翻译：柔性薄型散热器的制造工艺
公开(公告)号：US08205337B2
公开(公告)日：2012-06-26
申请号：US12283563
申请日：2008-09-12
申请人： Nathan P. Lower , Ross K. Wilcoxon , James R. Wooldridge , David W. Dlouhy
发明人： Nathan P. Lower , Ross K. Wilcoxon , James R. Wooldridge , David W. Dlouhy
IPC分类号： H05K7/20
CPC分类号： H05K7/20 , H01L23/36 , H01L23/373 , H01L23/473 , H01L2224/16 , H01L2224/16225 , H01L2224/73253 , H01L2924/00011 , H01L2924/00014 , H01L2924/01019 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/09701 , H01L2924/16195 , H01L2924/3011 , Y10T29/49366 , Y10T29/49368 , Y10T29/49369 , H01L2224/0401
摘要： The present invention is a method for fabricating a thermal spreader. The method may include laminating a plurality of layer portions together to fabricate a mechanically flexible substrate. The method may further include providing an internal channel within the mechanically flexible substrate, the internal channel configured for containing an electrically-conductive liquid, the internal channel being further configured to allow for closed-loop flow of the electrically-conductive liquid within the internal channel. The method may further include integrating a pump with the mechanically flexible substrate. The method may further include fabricating a plurality of rigid metal inserts. The method may further include forming a plurality of extension portions on a surface of each rigid metal insert included in the plurality of rigid metal inserts. The method may further include connecting the plurality of rigid metal inserts to the mechanically flexible substrate.
摘要翻译：本发明是制造散热器的方法。该方法可以包括将多个层部分层叠在一起以制造机械柔性基底。所述方法还可以包括在所述机械柔性衬底内提供内部通道，所述内部通道被配置为容纳导电液体，所述内部通道进一步构造成允许所述导电液体在所述内部通道内的闭环流动。该方法还可以包括将泵与机械柔性衬底集成。该方法还可以包括制造多个刚性金属插入件。该方法还可以包括在包括在多个刚性金属插入件中的每个刚性金属插入件的表面上形成多个延伸部分。该方法还可以包括将多个刚性金属插入物连接到机械柔性基底。

19. 发明申请

US20120088338A1 INTEGRATED CIRCUIT TAMPERING PROTECTION AND REVERSE ENGINEERING PREVENTION COATINGS AND METHODS 有权
标题翻译：集成电路夯实保护和反向工程预防涂层和方法
公开(公告)号：US20120088338A1
公开(公告)日：2012-04-12
申请号：US13329068
申请日：2011-12-16
申请人： Nathan P. Lower , Alan P. Boone , Ross K. Wilcoxon
发明人： Nathan P. Lower , Alan P. Boone , Ross K. Wilcoxon
IPC分类号： H01L21/56
CPC分类号： H01L21/563 , H01L23/291 , H01L23/295 , H01L23/3128 , H01L23/573 , H01L24/48 , H01L24/73 , H01L2224/16225 , H01L2224/32225 , H01L2224/48227 , H01L2224/73203 , H01L2224/73204 , H01L2224/73265 , H01L2224/8192 , H01L2224/8592 , H01L2924/00011 , H01L2924/00014 , H01L2924/01004 , H01L2924/0102 , H01L2924/01068 , H01L2924/09701 , H01L2924/10253 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/0401 , H01L2224/45099
摘要： A method of protecting an electronics package is discussed along with devices formed by the method. The method involves providing at least one electronic component that requires protecting from tampering and/or reverse engineering. Further, the method includes mixing into a liquid glass material at least one of high durability micro-particles or high-durability nano-particles, to form a coating material. Further still, the method includes depositing the coating material onto the electronic component and curing the coating material deposited.
摘要翻译：与该方法形成的装置一起讨论保护电子封装的方法。该方法涉及提供至少一个电子部件，其需要防止篡改和/或逆向工程。此外，该方法包括将高耐久性微粒或高耐久性纳米粒子中的至少一种混合成液态玻璃材料，形成涂料。此外，该方法还包括将涂覆材料沉积到电子部件上并固化沉积的涂层材料。

20. 发明授权

US07915527B1 Hermetic seal and hermetic connector reinforcement and repair with low temperature glass coatings 有权
标题翻译：密封和密封连接器加固和修复与低温玻璃涂层
公开(公告)号：US07915527B1
公开(公告)日：2011-03-29
申请号：US11784158
申请日：2007-04-05
申请人： Nathan P. Lower , David M. Brower , Ross K. Wilcoxon
发明人： Nathan P. Lower , David M. Brower , Ross K. Wilcoxon
IPC分类号： H05K5/06 , H01L23/10
CPC分类号： H01R43/02 , H01L23/10 , H01L2924/0002 , H01L2924/01079 , H01R43/20 , H01L2924/00
摘要： The present invention is directed to low-cost, low-processing temperature, and simple reinforcement, repair, and corrosion protection for hermetically sealed modules and hermetic connectors. A thin layer of glass is applied over the module's seal or the connector' glass frit. The layer of glass comprises an alkali silicate glass. The layer of glass is produced from a material which is a low viscosity liquid at room temperature prior to curing and is cured at low temperatures (typically no more than about 160 degrees Celsius). Subsequent to curing, the layer of glass is intimately bonded to the seal, watertight, and is stable from about negative two-hundred forty-three degrees Celsius to at least about seven-hundred twenty-seven degrees Celsius. The glass layer provides corrosion protection, seals any existing leaks, and possesses good flexibility and adhesion. The resulting bond is hermetic with good aqueous durability and strength similar to that of monolithic structures.
摘要翻译：本发明涉及低成本，低加工温度，以及用于气密密封模块和密封连接器的简单加固，修复和防腐蚀保护。将一薄层玻璃涂在模块的密封或连接器的玻璃料上。该玻璃层包含碱性硅酸盐玻璃。玻璃层由固化前的室温下为低粘度液体的材料制成，并在低温（通常不超过约160摄氏度）下固化。在固化之后，玻璃层紧密地粘合到密封件上，防水，并且从大约负二百四十三摄氏度到至少约七百二十七摄氏度是稳定的。玻璃层提供腐蚀保护，密封任何现有的泄漏，并具有良好的柔韧性和粘附力。所得到的粘合剂具有良好的水性耐久性和强度，与单片结构相似。

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