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    • 14. 发明授权
    • Microscope and sample observation method
    • 显微镜和样品观察法
    • US07576910B2
    • 2009-08-18
    • US11979592
    • 2007-11-06
    • Hirotoshi TeradaIkuo ArataMasaharu TokiwaHiroshi TanabeShigeru SakamotoYoshio Isobe
    • Hirotoshi TeradaIkuo ArataMasaharu TokiwaHiroshi TanabeShigeru SakamotoYoshio Isobe
    • G02B21/00
    • G02B21/33G01N21/9501G01N21/956G01N21/95684G02B21/0016G02B21/362
    • For a semiconductor device S as an inspected object, there are provided an image acquisition part 1, an optical system 2 including an objective lens 20, and a solid immersion lens (SIL) 3 movable between an insertion position including an optical axis from the semiconductor device S to the objective lens 20 and a standby position off the optical axis. Then observation is carried out in two control modes consisting of a first mode in which the SIL 3 is located at the standby position and in which focusing and aberration correction are carried out based on a refractive index n0 and a thickness t0 of a substrate of the semiconductor device S, and a second mode in which the SIL 3 is located at the insertion position and in which focusing and aberration correction are carried out based on the refractive index n0 and thickness t0 of the substrate, and a refractive index n1, a thickness d1, and a radius of curvature R1 of SIL 3. This provides a microscope and a sample observation method capable of readily performing observation of the sample necessary for an analysis of microstructure or the like of the semiconductor device.
    • 对于作为检查对象的半导体装置S,提供了图像获取部分1,包括物镜20的光学系统2和在包括来自半导体的光轴的插入位置之间可移动的固体浸没透镜(SIL)3 装置S到物镜20和离开光轴的待机位置。 然后在两个控制模式下进行观察,该两种控制模式由SIL 3位于待机位置的第一模式进行,并且基于第一模式的基板的折射率n0和厚度t0进行聚焦和像差校正 半导体器件S和第二模式,其中SIL 3位于插入位置,并且基于衬底的折射率n0和厚度t0执行聚焦和像差校正,并且折射率n1,厚度 d1和SIL3的曲率半径R1。这提供了能够容易地观察对半导体器件的微结构等的分析所需的样品的显微镜和样品观察方法。
    • 15. 发明申请
    • Method for Thin Film Formation
    • 薄膜形成方法
    • US20090202721A1
    • 2009-08-13
    • US11886317
    • 2006-03-14
    • Hiroshi NogamiKatsuhisa YudaHiroshi Tanabe
    • Hiroshi NogamiKatsuhisa YudaHiroshi Tanabe
    • C23C16/00C23C16/54
    • C23C16/401C23C16/402C23C16/452H01L21/02164H01L21/02211H01L21/02274H01L21/31612
    • A method for thin film formation that can form, at a low temperature, a good thin film having a good interfacial property between a silicon substrate and a silicon oxide film and having a low interfacial trap density is provided.The method for thin film formation comprises generating plasma within a vacuum vessel to generate an active species (radical) and forming a silicon oxide film on a silicon substrate using this active species and a material gas, wherein, in addition to the material gas, a nitrogen atom-containing gas is introduced into the vacuum vessel in its film forming space where the active species (radical) and the material gas come into contact with each other for the first time and are reacted with each other to form a silicon film on the silicon substrate, and wherein the flow rate of the nitrogen atom-containing gas during the formation of the silicon oxide film on the silicon substrate is regulated so as to be the maximum value at least at the time of the start of formation of the silicon film on the silicon substrate.
    • 提供了一种薄膜形成方法,其可以在低温下形成在硅衬底和氧化硅膜之间具有良好界面性能并具有低界面陷阱密度的良好薄膜。 用于薄膜形成的方法包括在真空容器内产生等离子体以产生活性物质(自由基),并使用该活性物质和材料气体在硅衬底上形成氧化硅膜,其中,除了材料气体之外, 含氮原子气体在其成膜空间中被引入真空容器中,其中活性物质(自由基)和原料气体首次相互接触并且彼此反应以形成硅膜 硅衬底,并且其中在硅衬底上形成氧化硅膜期间含氮原子气体的流速被调节为至少在开始形成硅膜时为最大值 在硅衬底上。
    • 18. 发明申请
    • Microscope and sample observation method
    • 显微镜和样品观察法
    • US20080074739A1
    • 2008-03-27
    • US11979592
    • 2007-11-06
    • Hirotoshi TeradaIkuo ArataMasaharu TokiwaHiroshi TanabeShigeru SakamotoYoshio Isobe
    • Hirotoshi TeradaIkuo ArataMasaharu TokiwaHiroshi TanabeShigeru SakamotoYoshio Isobe
    • G02B21/00
    • G02B21/33G01N21/9501G01N21/956G01N21/95684G02B21/0016G02B21/362
    • For a semiconductor device S as an inspected object, there are provided an image acquisition part 1, an optical system 2 including an objective lens 20, and a solid immersion lens (SIL) 3 movable between an insertion position including an optical axis from the semiconductor device S to the objective lens 20 and a standby position off the optical axis. Then observation is carried out in two control modes consisting of a first mode in which the SIL 3 is located at the standby position and in which focusing and aberration correction are carried out based on a refractive index n0 and a thickness t0 of a substrate of the semiconductor device S, and a second mode in which the SIL 3 is located at the insertion position and in which focusing and aberration correction are carried out based on the refractive index n0 and thickness t0 of the substrate, and a refractive index n1, a thickness d1, and a radius of curvature R1 of SIL 3. This provides a microscope and a sample observation method capable of readily performing observation of the sample necessary for an analysis of microstructure or the like of the semiconductor device.
    • 对于作为检查对象的半导体装置S,提供了图像获取部分1,包括物镜20的光学系统2和在包括来自半导体的光轴的插入位置之间可移动的固体浸没透镜(SIL)3 装置S到物镜20和离开光轴的待机位置。 然后在两个控制模式下进行观察,该两种控制模式由SIL 3位于待机位置的第一模式组成,并且基于折射率n <0>进行聚焦和像差校正, 半导体器件S的衬底的厚度t 0 <0 和其中SIL 3位于插入位置并且基于折射率执行聚焦和像差校正的第二模式 n 和底层的厚度t 0 <0,折射率n <1,厚度d 1, 以及SIL 3的曲率半径R 1 1。 这提供了能够容易地观察对半导体器件的微细结构等的分析所需的样品的显微镜和样品观察方法。
    • 19. 发明授权
    • Microscope and sample observation method
    • 显微镜和样品观察法
    • US07312921B2
    • 2007-12-25
    • US11333550
    • 2006-01-18
    • Hirotoshi TeradaIkuo ArataMasaharu TokiwaHiroshi TanabeShigeru SakamotoYoshio Isobe
    • Hirotoshi TeradaIkuo ArataMasaharu TokiwaHiroshi TanabeShigeru SakamotoYoshio Isobe
    • G02B21/00
    • G02B21/33G01N21/9501G01N21/956G01N21/95684G02B21/0016G02B21/362
    • For a semiconductor device S as an inspected object, there are provided an image acquisition part 1, an optical system 2 including an objective lens 20, and a solid immersion lens (SIL) 3 movable between an insertion position including an optical axis from the semiconductor device S to the objective lens 20 and a standby position off the optical axis. Then observation is carried out in two control modes consisting of a first mode in which the SIL 3 is located at the standby position and in which focusing and aberration correction are carried out based on a refractive index n0 and a thickness t0 of a substrate of the semiconductor device S, and a second mode in which the SIL 3 is located at the insertion position and in which focusing and aberration correction are carried out based on the refractive index n0 and thickness t0 of the substrate, and a refractive index n1, a thickness d1, and a radius of curvature R1 of SIL 3. This provides a microscope and a sample observation method capable of readily performing observation of the sample necessary for an analysis of microstructure or the like of the semiconductor device.
    • 对于作为检查对象的半导体装置S,提供了图像获取部分1,包括物镜20的光学系统2和在包括来自半导体的光轴的插入位置之间可移动的固体浸没透镜(SIL)3 装置S到物镜20和离开光轴的待机位置。 然后在两个控制模式下进行观察,该两种控制模式由SIL 3位于待机位置的第一模式组成,并且基于折射率n <0>进行聚焦和像差校正, 半导体器件S的衬底的厚度t 0 <0 和其中SIL 3位于插入位置并且基于折射率执行聚焦和像差校正的第二模式 n 和底层的厚度t 0 <0,折射率n <1,厚度d 1, 以及SIL 3的曲率半径R 1 1。 这提供了能够容易地观察对半导体器件的微细结构等的分析所需的样品的显微镜和样品观察方法。