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11. 发明授权

US07037586B2 Film for circuit board 失效
标题翻译：电路板胶片
公开(公告)号：US07037586B2
公开(公告)日：2006-05-02
申请号：US10754618
申请日：2004-01-12
申请人： Tadahiko Yokota , Shigeo Nakamura
发明人： Tadahiko Yokota , Shigeo Nakamura
IPC分类号： B32B15/00 , B32B27/38 , C08L63/00
CPC分类号： H05K3/387 , B32B15/08 , B32B27/08 , H05K1/036 , H05K3/181 , H05K3/381 , H05K2201/0141 , H05K2201/0154 , H05K2201/0394 , H05K2203/0264 , Y10S428/901 , Y10T428/24917 , Y10T428/2495 , Y10T428/265 , Y10T428/2804 , Y10T428/2852 , Y10T428/31511 , Y10T428/31515 , Y10T428/31522 , Y10T428/31529
摘要： The present invention relates to a film for a circuit board characterized in that the following A layer is adjacent to the following B layer is disclosed in the present application. A circuit board excellent in adhesion strength of a conductor layer can easily be produced by using this film.A layer: a heat-resistant resin layer with a thickness of from 2 to 250 μm which layer is made of a heat-resistant resin having a glass transition point of 200° C. or more or a decomposition temperature of 300° C. or more, andB layer: a roughenable cured resin layer with a thickness of from 5 to 20 μm which layer is made of a cured product of a thermosetting resin composition containing at least component (a) of an epoxy resin having two or more epoxy groups in a molecule and component (b) of an epoxy curing agent, the cured product being capable of roughening with an oxidizing agent.
摘要翻译：本发明涉及一种用于电路板的薄膜，其特征在于在本申请中公开了以下A层与以下B层相邻。通过使用该膜，可以容易地制造出导体层的粘合强度优异的电路板。层：厚度为2〜250μm的耐热树脂层，该层由玻璃化转变点为200℃以上或分解温度为300℃的耐热性树脂构成，或更多和B层：厚度为5〜20μm的可粗化固化树脂层，该层由至少含有至少两种以上环氧基的环氧树脂组分（a）的热固性树脂组合物的固化产物形成，在环氧固化剂的分子和组分（b）中，固化产物能够用氧化剂粗化。

12. 发明申请

US20050005437A1 Adhesive film for use in multilayer printed wiring board and method of producing multilayer printed wiring board 有权
公开(公告)号：US20050005437A1
公开(公告)日：2005-01-13
申请号：US10849172
申请日：2004-05-20
申请人： Shigeo Nakamura , Tadahiko Yokota
发明人： Shigeo Nakamura , Tadahiko Yokota
IPC分类号： B32B7/12 , B32B15/02 , H05K3/38 , H05K3/46 , B44C1/00 , H05K3/02
CPC分类号： B32B7/12 , B32B15/02 , B32B27/08 , B32B27/20 , B32B27/26 , B32B27/38 , B32B2457/08 , H05K3/387 , H05K3/4661 , H05K3/4673 , H05K2201/0195 , H05K2201/0209 , H05K2203/066 , Y10S428/901 , Y10T29/49128 , Y10T29/49155 , Y10T428/287
摘要： The present invention provides a laminating method, when a multilayer printed wiring board is produced according to a build-up technique, for easily introducing an insulating layer that, under the lamination conditions, allows filling a resin inside a through hole and/or a via hole simultaneously with laminating a circuit board, is low in the thermal expansion coefficient of a formed insulating layer, and, after roughening a surface of the insulating layer, is excellent in the adhesiveness with a conductor layer that is formed according to plating. The present invention also provides a method of forming the insulating layer; and a method of producing the multilayer printed wiring board; and furthermore an adhesive film that is used in these methods. The laminating method is a method of laminating a circuit board characterized in that the adhesive film formed by laminating a resin composition layer made of the following A layer and B layer on a support base film; Layer A is a layer of a thermosetting resin composition that contains an epoxy resin having two or more epoxy groups in one molecule and an epoxy curing agent, has an inorganic filler content of from 0 to less than 40% by weight, has a cured surface obtained by thermally curing which after roughening with an alkaline permanganic acid solution, allows forming a conductor layer according to the plating, and is solid at ambient temperature, and; Layer B is a layer of a thermosetting resin composition that contains an epoxy resin having two or more epoxy groups in one molecule and an epoxy curing agent, has an inorganic filler content of 40% by weight or more, and is solid at ambient temperature; Layer A is laminated adjacent to the support base film; Layer B layer has a fluidity that allows under lamination conditions the filling of a resin into a through hole and/or a via hole simultaneously with the lamination of the circuit board; and The lamination is carried out while keeping the B layer directly in contact with the circuit board.

13. 发明授权

US06221972B1 Photosensitive resin and photosensitive resin composition containing the same 失效
标题翻译：感光树脂和含有它们的感光性树脂组合物
公开(公告)号：US06221972B1
公开(公告)日：2001-04-24
申请号：US08927086
申请日：1997-09-10
申请人： Shigeo Nakamura , Tadahiko Yokota
发明人： Shigeo Nakamura , Tadahiko Yokota
IPC分类号： C08F830
CPC分类号： G03F7/038 , C08G59/1433 , C09D163/10 , G03F7/029 , Y10S522/904
摘要： The present invention relates to a novel photosensitive resin which can be developed in water and which can be used as a photosensitive resin composition. More specifically, the present invention relates to a composition which is useful as a photosensitive soldering resist for printed circuit board.
摘要翻译：本发明涉及一种可在水中显影并可用作感光性树脂组合物的新型感光性树脂。更具体地说，本发明涉及可用作印刷电路板的感光性抗蚀剂的组合物。

14. 发明申请

US20130067742A1 PROCESS FOR PRODUCING MULTILAYER PRINTED WIRING BOARD 审中-公开
标题翻译：生产多层印刷线路板的工艺
公开(公告)号：US20130067742A1
公开(公告)日：2013-03-21
申请号：US13618168
申请日：2012-09-14
申请人： Shigeo NAKAMURA , Seiichiro OHASHI , Eiichi Hayashi , Tadahiko Yokota
发明人： Shigeo NAKAMURA , Seiichiro OHASHI , Eiichi Hayashi , Tadahiko Yokota
IPC分类号： H05K3/10 , B32B38/10
CPC分类号： H05K3/4673 , B32B37/025 , B32B38/0004 , B32B2038/0076 , B32B2305/076 , B32B2309/02 , B32B2309/105 , B32B2309/12 , B32B2309/68 , B32B2311/00 , B32B2457/08 , H05K3/4644 , H05K2203/0228 , H05K2203/066 , H05K2203/085 , Y10T29/49155 , Y10T156/1052 , Y10T156/1054
摘要： Multi-layer printed wiring boards may be produced by: (1) conveying an adhesive sheet from an adhesive sheet roll wherein an adhesive sheet having a prepreg formed on a support film is wound in a roll and placing the adhesive sheet such that a prepreg surface contacts one or both of the surfaces of a circuit board, (2) partially adhering the adhesive sheet to the circuit board by heating and pressing a part of the adhesive sheet from the support film side, and cutting the adhesive sheet according to the size of the circuit board with a cutter, (3) heating and pressing the temporarily fitted adhesive sheet under reduced pressure to laminate the adhesive sheet on the circuit board, (4) forming an insulating layer by thermally curing the prepreg, and (5) detaching the support film after the thermal curing step.
摘要翻译：多层印刷线路板可以通过以下方式制造：（1）从粘合片辊输送粘合片，其中将形成在支撑膜上的预浸料的粘合片卷绕成卷并将粘合片放置成预浸料表面接触电路板的一个或两个表面，（2）通过从支撑膜侧加热和压制粘合片的一部分，将粘合片部分地粘合到电路板上，并根据具有切割器的电路板，（3）在减压下对临时贴合的粘合片进行加热加压，将粘合片层压在电路板上，（4）通过热固化预浸料形成绝缘层，（5）热固化步骤后支撑薄膜。

15. 发明申请

US20100206471A1 PROCESS FOR PRODUCING MULTILAYER PRINTED WIRING BOARD 有权
标题翻译：生产多层印刷线路板的工艺
公开(公告)号：US20100206471A1
公开(公告)日：2010-08-19
申请号：US12721891
申请日：2010-03-11
申请人： Shigeo Nakamura , Seiichiro Ohashi , Eiichi Hayashi , Tadahiko Yokota
发明人： Shigeo Nakamura , Seiichiro Ohashi , Eiichi Hayashi , Tadahiko Yokota
IPC分类号： B32B38/10
CPC分类号： H05K3/4673 , B32B37/025 , B32B38/0004 , B32B2038/0076 , B32B2305/076 , B32B2309/02 , B32B2309/105 , B32B2309/12 , B32B2309/68 , B32B2311/00 , B32B2457/08 , H05K3/4644 , H05K2203/0228 , H05K2203/066 , H05K2203/085 , Y10T29/49155 , Y10T156/1052 , Y10T156/1054
摘要： A production method of a multi-layer printed wiring board containing the following steps (1)-(5): (1) a temporary fitting preparatory step including conveying an adhesive sheet from an adhesive sheet roll wherein an adhesive sheet having a prepreg formed on a support film is wound in a roll and placing the adhesive sheet such that a prepreg surface contacts one or both of the surfaces of a circuit board, (2) a temporary fitting step for temporarily fitting the adhesive sheet to the circuit board, including partially adhering the adhesive sheet to the circuit board by heating and pressing a part of the adhesive sheet from the support film side, and cutting the adhesive sheet according to the size of the circuit board with a cutter, (3) a laminating step including heating and pressing the temporarily fitted adhesive sheet under reduced pressure to laminate the adhesive sheet on the circuit board, (4) a thermal curing step including forming an insulating layer by thermally curing the prepreg, and (5) a detaching step including detaching the support film after the thermal curing step, enables continuous production of an insulating layer of a multi-layer printed wiring board with a prepreg and without using a single wafer.
摘要翻译：一种包含以下步骤（1） - （5）的多层印刷线路板的制造方法：（1）临时配合准备步骤，包括从粘合片辊输送粘合片，其中，将具有预浸渍体的粘合片形成在将支撑膜缠绕在卷筒中并放置粘合片，使得预浸料表面接触电路板的一个或两个表面，（2）临时安装步骤，用于将粘合片临时装配到电路板，包括部分通过从支撑膜侧加热和压制粘合片的一部分，将粘合片粘合到电路板上，并用切割机根据电路板的尺寸切割粘合片，（3）层压步骤，包括加热和在减压下按压临时贴合的粘合片以将粘合片层合在电路板上，（4）热固化步骤，包括通过热固化该制备形成绝缘层（5）包括在热固化步骤之后分离支撑膜的分离步骤，能够连续制备具有预浸料的多层印刷线路板的绝缘层，而不使用单个晶片。

16. 发明授权

US06881293B2 Process for producing a multi-layer printer wiring board 有权
标题翻译：多层印刷线路板的制造方法
公开(公告)号：US06881293B2
公开(公告)日：2005-04-19
申请号：US10080408
申请日：2002-02-25
申请人： Shigeo Nakamura , Tadahiko Yokota
发明人： Shigeo Nakamura , Tadahiko Yokota
IPC分类号： C08L63/00 , H05K1/00 , H05K3/46 , B32B31/20
CPC分类号： H05K3/4655 , C08L63/00 , H05K3/4652 , H05K3/4661 , H05K3/4676 , H05K2201/0209 , H05K2201/0212 , H05K2201/0355 , H05K2203/066 , H05K2203/0773 , Y10S428/901 , Y10T428/24917 , Y10T428/287
摘要： The present invention is directed to an inter-laminar adhesive composition containing a liquid epoxy resin, a polyfunctional epoxy resin having a softening point higher than a lamination temperature of the adhesive and with two or more epoxy groups within the molecule; and a latent epoxy curing agent initiating a reaction at a temperature higher than the lamination temperature. The adhesive composition optionally contains a liquid resin other than the liquid epoxy resin and/or an organic solvent and the liquid resin includes the liquid epoxy resin, the organic solvent or both constituting from 10 to 55% by weight of the composition.This inter-laminar adhesive composition allows for the preparation of a multi-layer printed wiring board. The process for preparing the multi-layer printed wiring board is provided. The resulting multi-layer printed wiring board of the invention possesses excellent embedding properties in the internal-layer circuit, excellent surface smoothness and can be provided at high productivity levels in a building up process using the present adhesive.
摘要翻译：本发明涉及一种层间粘合剂组合物，其包含液体环氧树脂，软化点高于粘合剂的层压温度和分子内具有两个或更多个环氧基的多官能环氧树脂; 和潜在的环氧固化剂在高于层压温度的温度下引发反应。粘合剂组合物任选地含有液体环氧树脂和/或有机溶剂以外的液体树脂，液体树脂包括液体环氧树脂，有机溶剂或两者构成组合物的10至55重量％。这种层间粘合剂组合物允许制备多层印刷线路板。提供了制备多层印刷线路板的方法。所得到的本发明的多层印刷电路板在内层电路中具有优异的嵌入性能，优异的表面平滑性，并且可以在使用本粘合剂的建筑工艺中以高生产率提供。

17. 发明授权

US5723262A Resin composition 失效
标题翻译：树脂组成
公开(公告)号：US5723262A
公开(公告)日：1998-03-03
申请号：US680551
申请日：1996-07-09
申请人： Shigeo Nakamura , Masahiko Oshimura , Kenichi Mori , Tadahiko Yokota , Hiroyasu Koto
发明人： Shigeo Nakamura , Masahiko Oshimura , Kenichi Mori , Tadahiko Yokota , Hiroyasu Koto
IPC分类号： C08F2/50 , C08F8/00 , C08G18/54 , C08G18/62 , C08G18/81 , C08G59/20 , C08G59/62 , C08L61/04 , C08L61/16 , C08L63/00 , G03F7/023 , G03F7/027 , G03F7/028 , G03F7/032 , G03F7/038 , H05K3/06 , H05K3/28
CPC分类号： G03F7/0388 , C08F8/00 , C08G18/542 , C08G18/62 , C08G18/8108 , C08G18/8116 , C08G18/8158 , C08G18/8175 , G03F7/032 , G03F7/038
摘要： An alkali soluble resin and a resin composition thereof useful as a solder resist, having good adhesive properties, solder heat resistance, and plating resistance are provided. Particular resistance to plating under alkaline conditions is provided by the invention.
摘要翻译：提供了可用作阻焊剂的碱溶性树脂和其树脂组合物，具有良好的粘合性，焊料耐热性和耐电镀性。在碱性条件下对电镀的耐受性由本发明提供。

18. 发明申请

US20050178501A1 Process for producing a multi-layer printer wiring board 审中-公开
公开(公告)号：US20050178501A1
公开(公告)日：2005-08-18
申请号：US11058700
申请日：2005-02-16
申请人： Shigeo Nakamura , Tadahiko Yokota
发明人： Shigeo Nakamura , Tadahiko Yokota
IPC分类号： C08L63/00 , H05K1/00 , H05K3/46 , B32B31/26
CPC分类号： H05K3/4655 , C08L63/00 , H05K3/4652 , H05K3/4661 , H05K3/4676 , H05K2201/0209 , H05K2201/0212 , H05K2201/0355 , H05K2203/066 , H05K2203/0773 , Y10S428/901 , Y10T428/24917 , Y10T428/287
摘要： The present invention is directed to an inter-laminar adhesive composition containing a liquid epoxy resin, a polyfunctional epoxy resin having a softening point higher than a lamination temperature of the adhesive and with two or more epoxy groups within the molecule; and a latent epoxy curing agent initiating a reaction at a temperature higher than the lamination temperature. The adhesive composition optionally contains a liquid resin other than the liquid epoxy resin and/or an organic solvent and the liquid resin includes the liquid epoxy resin, the organic solvent or both constituting from 10 to 55% by weight of the composition. This inter-laminar adhesive composition allows for the preparation of a multi-layer printed wiring board. The process for preparing the multi-layer printed wiring board is provided. The resulting multi-layer printed wiring board of the invention possesses excellent embedding properties in the internal-layer circuit, excellent surface smoothness and can be provided at high productivity levels in a building up process using the present adhesive.

19. 发明授权

US06403221B1 Epoxy resin composition, and adhesive film and prepreg using the composition, and multilayer printed-wiring board using them, and process for manufacturing the same 有权
标题翻译：环氧树脂组合物，使用该组合物的粘合膜和预浸料，使用它们的多层印刷布线板及其制造方法
公开(公告)号：US06403221B1
公开(公告)日：2002-06-11
申请号：US09684671
申请日：2000-10-11
申请人： Shigeo Nakamura , Tadahiko Yokota
发明人： Shigeo Nakamura , Tadahiko Yokota
IPC分类号： B32B1508
CPC分类号： H05K3/4661 , C08G59/621 , C08L63/00 , C08L71/00 , C08L71/02 , G03F7/038 , H01L23/49894 , H01L2924/0002 , Y10S428/901 , Y10T428/24994 , Y10T428/249941 , Y10T428/26 , Y10T428/287 , Y10T428/2971 , Y10T428/31511 , Y10T428/31515 , Y10T428/31522 , Y10T428/31529 , C08L2666/14 , H01L2924/00
摘要： Epoxy resin compositions which comprise, as essential components, (A) an epoxy resin having two or more epoxy groups in one molecule, (B) a phenolic curing agent, (C) a phenoxy resin containing a bisphenol S skeleton and having a weight average molecular weight of 5,000 to 100,000, and (D) a curing accelerator, are useful for making adhesive films formed by coating the epoxy resin composition on a supporting base film. Such compositions are also useful for making prepregs, by coating and/or impregnating a sheet-shaped reinforced base material made of a fiber with the resin composition, as well as multilayer printed-wiring boards made with such prepregs. Such epoxy resin compositions are also useful for forming conductor layers with excellent adhesiveness without requiring, in the insulating layer, a roughening component which deteriorates performance, as well as multilayer printed-wiring boards.
摘要翻译：作为必要成分的（A）在一个分子中具有两个以上环氧基的环氧树脂，（B）酚类固化剂，（C）含有双酚S骨架并具有重均分子量的苯氧基树脂作为必要成分的环氧树脂组合物分子量为5,000〜100,000，（D）固化促进剂用于制造通过在支撑基底膜上涂布环氧树脂组合物而形成的粘合膜。这样的组合物也可用于制备预浸料，通过用树脂组合物涂布和/或浸渍由纤维制成的片状增强基材，以及由这种预浸料制成的多层印刷线路板。这种环氧树脂组合物也可用于形成具有优异粘合性的导体层，而不需要绝缘层中的性能劣化的粗糙化组分以及多层印刷线路板。

20. 发明授权

US06376053B1 Inter-laminar adhesive film for multi-layer printed wiring board and multi-layer printed wiring board using the same 有权
标题翻译：用于多层印刷线路板的层间粘合膜和使用其的多层印刷线路板
公开(公告)号：US06376053B1
公开(公告)日：2002-04-23
申请号：US09721664
申请日：2000-11-27
申请人： Shigeo Nakamura , Tadahiko Yokota
发明人： Shigeo Nakamura , Tadahiko Yokota
IPC分类号： B32B300
CPC分类号： H05K3/4655 , C08L63/00 , H05K3/4652 , H05K3/4661 , H05K3/4676 , H05K2201/0209 , H05K2201/0212 , H05K2201/0355 , H05K2203/066 , H05K2203/0773 , Y10S428/901 , Y10T428/24917 , Y10T428/287
摘要： An inter-laminar adhesive composition containing: (A) a liquid epoxy resin; (B) a polyfunctional epoxy resin having a softening point higher than a lamination temperature of the adhesive and with two or more epoxy groups within the molecule; and (C) a latent epoxy curing agent initiating a reaction at a temperature higher than the lamination temperature; wherein the adhesive composition optionally contains a liquid resin other than component (A) and/or an organic solvent and wherein the liquid resin including component (A), the organic solvent or both constitute from 10 to 55% by weight of the composition, and the use of this interlaminar adhesive composition to prepare a multilayer printed wiring board, and the process for preparing the multilayer printed wiring board are provided. The resulting multilayer printed wiring board of the invention has excellent embedding properties in the internal-layer circuit, excellent surface smoothness and can be provided at high productivity levels in a build up process using the present adhesive.
摘要翻译：一种层间粘合剂组合物，其包含：（A）液体环氧树脂;（B）具有高于所述粘合剂的层压温度和分子内两个或更多个环氧基的软化点的多官能环氧树脂; 和（C）在高于层压温度的温度下引发反应的潜在环氧固化剂;其中所述粘合剂组合物任选地含有除了组分（A）和/或有机溶剂之外的液体树脂，并且其中所述液体树脂包括组分 A），有机溶剂或两者均构成组合物的10至55重量％，并且使用该层间粘合剂组合物来制备多层印刷线路板，以及制备多层印刷线路板的方法。所得到的本发明的多层印刷电路板在内层电路中具有优异的嵌入性能，优异的表面平滑性，并且可以在使用本发明的粘合剂的聚集过程中以高生产率提供。

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