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11. 发明授权

US06749774B2 Conductive adhesive and connection structure using the same 失效
标题翻译：导电胶和连接结构使用相同
公开(公告)号：US06749774B2
公开(公告)日：2004-06-15
申请号：US10309596
申请日：2002-12-03
申请人： Hiroaki Takezawa , Takashi Kitae , Yukihiro Ishimaru , Tsutomu Mitani
发明人： Hiroaki Takezawa , Takashi Kitae , Yukihiro Ishimaru , Tsutomu Mitani
IPC分类号： H01B122
CPC分类号： H01B1/22 , C09J9/02 , H01R4/04 , H05K3/321 , H05K2201/0129 , H05K2203/121 , Y10T428/249985 , Y10T428/2804 , Y10T428/2852
摘要： A mounting technique with improved adhesive strength and higher reliability against bending stress is provided with the use of a conductive adhesive including a binder resin and a metal filler as main components, in which a functional group is introduced into the molecular chain of the binder resin to form a multidentate bonding with an electrode metal easily. As a thermoplastic resin, at least two kinds of functional groups selected from the group consisting of a carbonyl group, a carboxyl group, an amino group, an imino group, an iminoacetic acid group, an iminopropionic acid group, a hydroxyl group, a thiol group, a pyridinium group, an imido group, an azo group, a nitrilo group, an ammonium group and an imidazole group are introduced. Accordingly, a strong bond with the electrode metal can be achieved. The conductive adhesive is screen-printed to an electrode disposed on a substrate, and after an electrode of a component is mounted, the structure is heated so as to create a mounted structure.
摘要翻译：通过使用包含粘合剂树脂和金属填料作为主要成分的导电粘合剂，其中将官能团引入到粘合剂树脂的分子链中，提供了具有改进的粘合强度和对弯曲应力的更高可靠性的安装技术，与电极金属容易形成多齿结合。作为热塑性树脂，选自羰基，羧基，氨基，亚氨基，亚氨基乙酸基，亚氨基丙酸基，羟基，硫醇中的至少两种官能团基团，吡啶鎓基，亚氨基，偶氮基，次氮基，铵基和咪唑基。因此，可以实现与电极金属的牢固结合。将导电粘合剂丝网印刷到设置在基板上的电极，并且在部件的电极安装之后，将该结构加热以形成安装的结构。

12. 发明授权

US06620345B2 Conductive adhesive agent, packaging structure, and method for manufacturing the same structure 失效
标题翻译：导电胶粘剂，包装结构及其制造方法
公开(公告)号：US06620345B2
公开(公告)日：2003-09-16
申请号：US09947353
申请日：2001-09-07
申请人： Hiroaki Takezawa , Yukihiro Ishimaru , Takashi Kitae , Tsutomu Mitani , Tousaku Nishiyama
发明人： Hiroaki Takezawa , Yukihiro Ishimaru , Takashi Kitae , Tsutomu Mitani , Tousaku Nishiyama
IPC分类号： H01B122
CPC分类号： H01L24/83 , C09J9/02 , H01B1/22 , H01L23/49883 , H01L24/28 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/29111 , H01L2224/2919 , H01L2224/2929 , H01L2224/29339 , H01L2224/29347 , H01L2224/29355 , H01L2224/29439 , H01L2224/29444 , H01L2224/29499 , H01L2224/32225 , H01L2224/73204 , H01L2224/8319 , H01L2224/838 , H01L2924/00014 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01016 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01327 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/1579 , H01L2924/19041 , H01L2924/19043 , H01R4/04 , H05K3/321 , H05K13/0469 , H05K2201/0769 , H05K2201/10636 , H05K2201/10674 , H05K2203/121 , Y02P70/611 , Y10T428/2982 , Y10T428/2984 , H01L2924/00 , H01L2924/3512 , H01L2924/00012 , H01L2224/05599
摘要： A conductive adhesive agent of the invention contains an elution preventing film-forming agent 4, which becomes reactive after electric continuity through a conductive particle 3 appeared in the conductive adhesive agent when a binder resin 2 is being hardened, to thereby form an elution preventing film 5 on a surface of the conductive particle 3. By using this conductive adhesive agent, the packaging structure is made migration resistant and sulfurization resistant.
摘要翻译：本发明的导电性粘合剂含有防粘膜成膜剂4，当粘合剂树脂2硬化时，在导电性粘合剂中出现通过导电性粒子3的电连续性而变为反应性的成膜剂，从而形成洗脱防止膜通过使用该导电性粘合剂，使包装结构耐迁移，耐硫化。

13. 发明授权

US06524721B2 Conductive adhesive and packaging structure using the same 有权
公开(公告)号：US06524721B2
公开(公告)日：2003-02-25
申请号：US09898721
申请日：2001-07-03
申请人： Hiroaki Takezawa , Takashi Kitae , Yukihiro Ishimaru , Tsutomu Mitani , Tousaku Nishiyama
发明人： Hiroaki Takezawa , Takashi Kitae , Yukihiro Ishimaru , Tsutomu Mitani , Tousaku Nishiyama
IPC分类号： H01L2314
CPC分类号： H01B1/22 , C09J9/02 , H01L2924/181 , H05K3/321 , H05K3/323 , H05K2201/0272 , H05K2201/0769 , Y10T428/12069 , Y10T428/1209 , Y10T428/12111 , Y10T428/12139 , Y10T428/12528 , Y10T428/25 , H01L2924/00012
摘要： The present invention provides a conductive adhesive and a packaging structure that can keep moisture-proof reliability even when a multipurpose base metal electrode is used. A conductive adhesive according to the present invention includes first particles having a standard electrode potential that is equal to or higher than a standard electrode potential of silver, and second particles having a standard electrode potential lower than a standard electrode potential of silver. A metal compound coating having a potential higher than that of metal particles as the first particles can be formed on a surface of an electrode having a potential lower than that of the metal particles.

14. 发明授权

US06512183B2 Electronic component mounted member and repair method thereof 失效
公开(公告)号：US06512183B2
公开(公告)日：2003-01-28
申请号：US09893106
申请日：2001-06-27
申请人： Tsutomu Mitani , Hiroaki Takezawa , Yukihiro Ishimaru , Takashi Kitae , Yasuhiro Suzuki
发明人： Tsutomu Mitani , Hiroaki Takezawa , Yukihiro Ishimaru , Takashi Kitae , Yasuhiro Suzuki
IPC分类号： H05K109
CPC分类号： H05K3/321 , H05K2201/0129 , H05K2201/10992 , H05K2203/176 , H05K2203/306 , Y10T29/49172
摘要： An electronic component mounted member includes a circuit board, an electronic component connected to the circuit board and an electrically conductive adhesive interposed between the electronic component and the circuit board. In a joining interface of the electrically conductive adhesive and an electrode of the circuit board, an intermediate layer that is formed of a thermoplastic insulating adhesive with a softening temperature of 100° C. to 300° C. is interposed between the electrically conductive adhesive and the electrode. An electrically conductive filler contained in the electrically conductive adhesive is present partially in the intermediate layer, thus allowing an electrical conduction between the electrically conductive adhesive and the electrode of the circuit board. This electronic component mounted member is used, and when a repair is necessary, a portion of the intermediate layer corresponding to the electronic component to be repaired is heated so as to raise a temperature of this portion to at least a melting point of the thermoplastic insulating adhesive, thereby melting the thermoplastic insulating adhesive. Then, the electronic component is removed with this state maintained.

15. 发明授权

US07151306B2 Electronic part, and electronic part mounting element and an process for manufacturing such the articles 失效
标题翻译：电子部件和电子部件安装元件及其制造方法
公开(公告)号：US07151306B2
公开(公告)日：2006-12-19
申请号：US11009045
申请日：2004-12-13
申请人： Takashi Kitae , Tsutomu Mitani , Yukihiro Ishimaru , Hiroaki Takezawa
发明人： Takashi Kitae , Tsutomu Mitani , Yukihiro Ishimaru , Hiroaki Takezawa
IPC分类号： H01L21/44 , H01L21/48 , H01L21/50
CPC分类号： H01L24/10 , H01L24/13 , H01L24/29 , H01L24/83 , H01L2224/13 , H01L2224/13099 , H01L2224/29101 , H01L2224/2919 , H01L2224/2929 , H01L2224/29318 , H01L2224/29339 , H01L2224/29344 , H01L2224/29355 , H01L2224/29364 , H01L2224/29369 , H01L2224/8319 , H01L2224/838 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01088 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/19041 , H05K3/321 , H05K2201/10636 , H05K2201/10689 , H05K2201/10909 , H05K2203/0307 , H05K2203/1446 , Y02P70/611 , H01L2924/00 , H01L2924/3512 , H01L2924/00014 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299
摘要： A surface of an external electrode 3 of an electronic part 4 is formed with a coating containing resin ingredient. Thereby, adhesion strength and reliability may be significantly improved in mounting an electronic part onto a circuit board 1 through the medium of a conductive adhesive. Further, it will be able to mount an electronic part to an element to be mounted by utilizing a conductive adhesive forming an external electrode 3 as a connecting element.Further, surface roughness (Ra) of an external electrode 3 of an electronic part is set to 0.1 μm or more and to 10.0 μm or less and preferably to 1.0 μm or more and to 5.0 μm or less. Thereby, adhesion strength with a conductive adhesive may be significantly enhanced in comparison with a conventional electronic part presented.
摘要翻译：电子部件4的外部电极3的表面形成有含有树脂成分的涂层。因此，通过导电粘合剂的介质将电子部件安装到电路板1上可以显着改善粘附强度和可靠性。此外，通过利用形成作为连接元件的外部电极3的导电粘合剂，能够将电子部件安装到要安装的元件上。此外，电子部件的外部电极3的表面粗糙度（R a1 a）设定为0.1μm以上至10.0μm以下，优选为1.0μm以上且5.0μm以下。因此，与传统的电子部件相比，与导电粘合剂的粘附强度可以显着提高。

16. 发明授权

US06853074B2 Electronic part, an electronic part mounting element and a process for manufacturing such the articles 失效
标题翻译：电子部件，电子部件安装元件和制造这些物品的方法
公开(公告)号：US06853074B2
公开(公告)日：2005-02-08
申请号：US09747976
申请日：2000-12-27
申请人： Takashi Kitae , Tsutomu Mitani , Yukihiro Ishimaru , Hiroaki Takezawa
发明人： Takashi Kitae , Tsutomu Mitani , Yukihiro Ishimaru , Hiroaki Takezawa
IPC分类号： H01L21/60 , H01L23/485 , H05K3/32 , H01L23/04 , H01L23/34 , H01L23/48 , H01L23/52
CPC分类号： H01L24/10 , H01L24/13 , H01L24/29 , H01L24/83 , H01L2224/13 , H01L2224/13099 , H01L2224/29101 , H01L2224/2919 , H01L2224/2929 , H01L2224/29318 , H01L2224/29339 , H01L2224/29344 , H01L2224/29355 , H01L2224/29364 , H01L2224/29369 , H01L2224/8319 , H01L2224/838 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01088 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/19041 , H05K3/321 , H05K2201/10636 , H05K2201/10689 , H05K2201/10909 , H05K2203/0307 , H05K2203/1446 , Y02P70/611 , H01L2924/00 , H01L2924/3512 , H01L2924/00014 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299
摘要： A surface of an external electrode 3 of an electronic part 4 is formed with a coating containing resin ingredient. Thereby, adhesion strength and reliability may be significantly improved in mounting an electronic part onto a circuit board 1 through the medium of a conductive adhesive. Further, it will be able to mount an electronic part to an element to be mounted by utilizing a conductive adhesive forming an external electrode 3 as a connecting element.Further, surface roughness (Ra) of an external electrode 3 of an electronic part is set to 0.1 μm or more and to 10.0 μm or less and preferably to 1.0 μm or more and to 5.0 μm or less. Thereby, adhesion strength with a conductive adhesive may be significantly enhanced in comparison with a conventional electronic part presented.
摘要翻译：电子部件4的外部电极3的表面形成有含有树脂成分的涂层。因此，通过导电粘合剂的介质将电子部件安装到电路板1上可以显着改善粘附强度和可靠性。此外，通过利用形成外部电极3作为连接元件的导电粘合剂，能够将电子部件安装到要安装的元件上。此外，设置电子部件的外部电极3的表面粗糙度（Ra）至0.1μm以上至10.0μm以下，优选为1.0μm以上至5.0μm以下。因此，与传统的电子部件相比，与导电粘合剂的粘附强度可以显着提高。

17. 发明授权

US06521144B2 Conductive adhesive and connection structure using the same 失效
标题翻译：导电胶和连接结构使用相同
公开(公告)号：US06521144B2
公开(公告)日：2003-02-18
申请号：US09751621
申请日：2000-12-29
申请人： Hiroaki Takezawa , Takashi Kitae , Yukihiro Ishimaru , Tsutomu Mitani
发明人： Hiroaki Takezawa , Takashi Kitae , Yukihiro Ishimaru , Tsutomu Mitani
IPC分类号： H01B122
CPC分类号： H01B1/22 , C09J9/02 , H01R4/04 , H05K3/321 , H05K2201/0129 , H05K2203/121 , Y10T428/249985 , Y10T428/2804 , Y10T428/2852
摘要： A mounting technique with improved adhesive strength and higher reliability against bending stress is provided with the use of a conductive adhesive including a binder resin and a metal filler as main components, in which a functional group is introduced into the molecular chain of the binder resin to form a multidentate bonding with an electrode metal easily. As a thermoplastic resin, at least two kinds of functional groups selected from the group consisting of a carbonyl group, a carboxyl group, an amino group, an imino group, an iminoacetic acid group, an iminopropionic acid group, a hydroxyl group, a thiol group, a pyridinium group, an imido group, an azo group, a nitrilo group; an ammonium group and an imidazole group are introduced. Accordingly, a strong bond with the electrode metal can be achieved. The conductive adhesive is screen-printed to an electrode disposed on a substrate, and after an electrode of a component is mounted, the structure is heated so as to create a mounted structure.
摘要翻译：通过使用包含粘合剂树脂和金属填料作为主要成分的导电粘合剂，其中将官能团引入到粘合剂树脂的分子链中，提供了具有改进的粘合强度和对弯曲应力的更高可靠性的安装技术，与电极金属容易形成多齿结合。作为热塑性树脂，选自羰基，羧基，氨基，亚氨基，亚氨基乙酸基，亚氨基丙酸基，羟基，硫醇中的至少两种官能团基团，吡啶鎓基，亚氨基，偶氮基，次氮基; 引入铵基和咪唑基。因此，可以实现与电极金属的牢固结合。将导电粘合剂丝网印刷到设置在基板上的电极，并且在部件的电极安装之后，将该结构加热以形成安装的结构。

18. 发明授权

US6042953A Substrate on which bumps are formed and method of forming the same 失效
标题翻译：形成凸块的基板及其形成方法
公开(公告)号：US6042953A
公开(公告)日：2000-03-28
申请号：US820779
申请日：1997-03-18
申请人： Kazufumi Yamaguchi , Tsutomu Mitani , Mitsuo Asabe
发明人： Kazufumi Yamaguchi , Tsutomu Mitani , Mitsuo Asabe
IPC分类号： H01L21/60 , H01L23/485 , B32B15/10 , B32B15/00 , H01H1/02
CPC分类号： H01L24/11 , H01L24/13 , H01L2224/1147 , H01L2224/11902 , H01L2224/13019 , H01L2224/13099 , H01L2224/13147 , H01L2224/45144 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01018 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30107 , H01L2924/3025 , H01L2924/351 , Y10S428/929 , Y10T428/1275 , Y10T428/12764 , Y10T428/12792 , Y10T428/24997
摘要： A bi-layer bump comprises a base layer composed of sprayed aluminum thick film having a thickness of about 20 .mu.m formed to cover the periphery of the passivation film formed on each pad electrode, a surface layer composed of sprayed copper thick film having a thickness of about 30 .mu.m formed on the base layer. According to the above-mentioned structure, a substrate on which bumps are formed which has an excellent electric property and connecting reliability, wherein an interlayer insulating layer, an active layer and a multi-layer wiring can be provided under the pad electrode can be obtained.
摘要翻译：双层凸块包括由形成为覆盖形成在每个焊盘电极上的钝化膜的周围形成的厚度为约20μm的喷镀的铝厚膜构成的基底层，由喷镀铜厚膜构成的表面层，其具有厚度在基层上形成约30微米。根据上述结构，可以获得在焊盘电极下方可以设置层间绝缘层，有源层和多层布线的具有优异的电性能和连接可靠性的形成有凸块的基板。

19. 发明授权

US5203924A Method of and apparatus for synthesizing diamondlike thin film 失效
标题翻译：用于合成DIAMONDLIKE薄膜的方法和装置
公开(公告)号：US5203924A
公开(公告)日：1993-04-20
申请号：US558241
申请日：1990-07-26
申请人： Tsutomu Mitani , Hirokazu Nakaue , Hideo Kurokawa
发明人： Tsutomu Mitani , Hirokazu Nakaue , Hideo Kurokawa
IPC分类号： C23C16/26 , C23C16/452 , C23C16/54 , H01J37/32
CPC分类号： H01J37/32449 , C23C16/26 , C23C16/452 , C23C16/545 , H01J37/32082 , H01J37/32357 , H01J2237/338 , H01J2237/339 , Y10S427/106
摘要： A method of and an apparatus for synthesizing a diamondlike thin film on a substrate, the method comprising the steps of: generating plasma of gas containing hydrocarbon gas, in a first vacuum vessel having an inflow portion and an outflow portion for the gas such that the substrate is provided in a second vacuum vessel maintained at a pressure lower, by one figure or more, than that of the first vacuum vessel due to flow resistance of the gas between the outflow portion and the substrate; and irradiating the plasma onto the substrate by pressure difference between the first vacuum vessel and the second vacuum vessel while an AC power is being applied to at least one of the substrate and an internal electrode provided in the first vacuum vessel.

20. 发明授权

US4835070A Magnetic recording medium and method of producing the same 失效
标题翻译：磁记录介质及其制造方法
公开(公告)号：US4835070A
公开(公告)日：1989-05-30
申请号：US772629
申请日：1985-09-04
申请人： Hideo Kurokawa , Tsutomu Mitani , Kazuo Yokoyama , Taketoshi Yonezawa
发明人： Hideo Kurokawa , Tsutomu Mitani , Kazuo Yokoyama , Taketoshi Yonezawa
IPC分类号： G11B5/66 , C08J7/00 , C08J7/04 , C08J7/06 , C09D165/00 , C10M105/50 , C10M107/38 , C10N40/18 , C10N70/00 , G11B5/64 , G11B5/65 , G11B5/72 , G11B5/725 , G11B5/78 , G11B5/84
CPC分类号： G11B5/72 , G11B5/84 , Y10S428/90 , Y10T428/265
摘要： A magnetic recording medium has a non-magnetic substrate, a magnetic layer formed on the surface of the substrate containing a ferromagnetic material, and a protective film formed on the magnetic layer. The protective film is constituted by a singular layer of continuous or dispersed molecular structures in which carbon and an element constituting the magnetic layer are bonded directly or indirectly through oxygen and at least one fluorine is bonded to the carbon. This magnetic recording medium can be produced by a method comprising preparing a substrate of a non-magnetic material, forming a magnetic layer of a ferromagnetic material on the surface of the substrate, and forming, by a plasma CVD method, a protective film of a fluorine-containing molecular body having a thickness not greater than a value equivalent to 5 .ANG. on the surface of the magnetic layer.
摘要翻译：磁记录介质具有非磁性基板，在含有铁磁材料的基板的表面上形成的磁性层和形成在磁性层上的保护膜。保护膜由连续或分散的分子结构的单一层构成，其中碳和构成磁性层的元素直接或间接地通过氧结合，并且至少一个氟与碳结合。该磁记录介质可以通过以下方法制造：制备非磁性材料的基板，在基板的表面上形成铁磁材料的磁性层，并通过等离子体CVD法形成保护膜含氟分子体的厚度不大于磁性层表面上的5 ANGSTROM的值。

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