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1. 发明授权

US06620345B2 Conductive adhesive agent, packaging structure, and method for manufacturing the same structure 失效
标题翻译：导电胶粘剂，包装结构及其制造方法
公开(公告)号：US06620345B2
公开(公告)日：2003-09-16
申请号：US09947353
申请日：2001-09-07
申请人： Hiroaki Takezawa , Yukihiro Ishimaru , Takashi Kitae , Tsutomu Mitani , Tousaku Nishiyama
发明人： Hiroaki Takezawa , Yukihiro Ishimaru , Takashi Kitae , Tsutomu Mitani , Tousaku Nishiyama
IPC分类号： H01B122
CPC分类号： H01L24/83 , C09J9/02 , H01B1/22 , H01L23/49883 , H01L24/28 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/29111 , H01L2224/2919 , H01L2224/2929 , H01L2224/29339 , H01L2224/29347 , H01L2224/29355 , H01L2224/29439 , H01L2224/29444 , H01L2224/29499 , H01L2224/32225 , H01L2224/73204 , H01L2224/8319 , H01L2224/838 , H01L2924/00014 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01016 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01327 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/1579 , H01L2924/19041 , H01L2924/19043 , H01R4/04 , H05K3/321 , H05K13/0469 , H05K2201/0769 , H05K2201/10636 , H05K2201/10674 , H05K2203/121 , Y02P70/611 , Y10T428/2982 , Y10T428/2984 , H01L2924/00 , H01L2924/3512 , H01L2924/00012 , H01L2224/05599
摘要： A conductive adhesive agent of the invention contains an elution preventing film-forming agent 4, which becomes reactive after electric continuity through a conductive particle 3 appeared in the conductive adhesive agent when a binder resin 2 is being hardened, to thereby form an elution preventing film 5 on a surface of the conductive particle 3. By using this conductive adhesive agent, the packaging structure is made migration resistant and sulfurization resistant.
摘要翻译：本发明的导电性粘合剂含有防粘膜成膜剂4，当粘合剂树脂2硬化时，在导电性粘合剂中出现通过导电性粒子3的电连续性而变为反应性的成膜剂，从而形成洗脱防止膜通过使用该导电性粘合剂，使包装结构耐迁移，耐硫化。

2. 发明授权

US06524721B2 Conductive adhesive and packaging structure using the same 有权
公开(公告)号：US06524721B2
公开(公告)日：2003-02-25
申请号：US09898721
申请日：2001-07-03
申请人： Hiroaki Takezawa , Takashi Kitae , Yukihiro Ishimaru , Tsutomu Mitani , Tousaku Nishiyama
发明人： Hiroaki Takezawa , Takashi Kitae , Yukihiro Ishimaru , Tsutomu Mitani , Tousaku Nishiyama
IPC分类号： H01L2314
CPC分类号： H01B1/22 , C09J9/02 , H01L2924/181 , H05K3/321 , H05K3/323 , H05K2201/0272 , H05K2201/0769 , Y10T428/12069 , Y10T428/1209 , Y10T428/12111 , Y10T428/12139 , Y10T428/12528 , Y10T428/25 , H01L2924/00012
摘要： The present invention provides a conductive adhesive and a packaging structure that can keep moisture-proof reliability even when a multipurpose base metal electrode is used. A conductive adhesive according to the present invention includes first particles having a standard electrode potential that is equal to or higher than a standard electrode potential of silver, and second particles having a standard electrode potential lower than a standard electrode potential of silver. A metal compound coating having a potential higher than that of metal particles as the first particles can be formed on a surface of an electrode having a potential lower than that of the metal particles.

3. 发明授权

US06814893B2 Conductive adhesive agent, packaging structure, and method for manufacturing the same structure 失效
标题翻译：导电胶粘剂，包装结构及其制造方法
公开(公告)号：US06814893B2
公开(公告)日：2004-11-09
申请号：US10613042
申请日：2003-07-07
申请人： Hiroaki Takezawa , Yukihiro Ishimaru , Takashi Kitae , Tsutomu Mitani , Tousaku Nishiyama
发明人： Hiroaki Takezawa , Yukihiro Ishimaru , Takashi Kitae , Tsutomu Mitani , Tousaku Nishiyama
IPC分类号： H01B122
CPC分类号： H01L24/83 , C09J9/02 , H01B1/22 , H01L23/49883 , H01L24/28 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/29111 , H01L2224/2919 , H01L2224/2929 , H01L2224/29339 , H01L2224/29347 , H01L2224/29355 , H01L2224/29439 , H01L2224/29444 , H01L2224/29499 , H01L2224/32225 , H01L2224/73204 , H01L2224/8319 , H01L2224/838 , H01L2924/00014 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01016 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01327 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/1579 , H01L2924/19041 , H01L2924/19043 , H01R4/04 , H05K3/321 , H05K13/0469 , H05K2201/0769 , H05K2201/10636 , H05K2201/10674 , H05K2203/121 , Y02P70/611 , Y10T428/2982 , Y10T428/2984 , H01L2924/00 , H01L2924/3512 , H01L2924/00012 , H01L2224/05599
摘要： A conductive adhesive agent of the invention contains an elution preventing film-forming agent 4, which becomes reactive after electric continuity through a conductive particle 3 appeared in the conductive adhesive agent when a binder resin 2 is being hardened, to thereby form an elution preventing film 5 on a surface of the conductive particle 3. By using this conductive adhesive agent, the packaging structure is made migration resistant and sulfurization resistant.

4. 发明授权

US06666994B2 Conductive adhesive and packaging structure using the same 有权
公开(公告)号：US06666994B2
公开(公告)日：2003-12-23
申请号：US10309426
申请日：2002-12-03
申请人： Hiroaki Takezawa , Takashi Kitae , Yukihiro Ishimaru , Tsutomu Mitani , Tousaku Nishiyama
发明人： Hiroaki Takezawa , Takashi Kitae , Yukihiro Ishimaru , Tsutomu Mitani , Tousaku Nishiyama
IPC分类号： H01L2314
CPC分类号： H01B1/22 , C09J9/02 , H01L2924/181 , H05K3/321 , H05K3/323 , H05K2201/0272 , H05K2201/0769 , Y10T428/12069 , Y10T428/1209 , Y10T428/12111 , Y10T428/12139 , Y10T428/12528 , Y10T428/25 , H01L2924/00012
摘要： The present invention provides a conductive adhesive and a packaging structure that can keep moisture-proof reliability even when a multipurpose base metal electrode is used. A conductive adhesive according to the present invention includes first particles having a standard electrode potential that is equal to or higher than a standard electrode potential of silver, and second particles having a standard electrode potential lower than a standard electrode potential of silver. A metal compound coating having a potential higher than that of metal particles as the first particles can be formed on a surface of an electrode having a potential lower than that of the metal particles.

5. 发明申请

US20050098338A1 Electronic part, and electronic part mounting element and an process for manufacturing such the articles 失效
标题翻译：电子部件和电子部件安装元件及其制造方法
公开(公告)号：US20050098338A1
公开(公告)日：2005-05-12
申请号：US11009045
申请日：2004-12-13
申请人： Takashi Kitae , Tsutomu Mitani , Yukihiro Ishimaru , Hiroaki Takezawa
发明人： Takashi Kitae , Tsutomu Mitani , Yukihiro Ishimaru , Hiroaki Takezawa
IPC分类号： H01L21/60 , H01L23/485 , H05K3/32 , H02G3/08
CPC分类号： H01L24/10 , H01L24/13 , H01L24/29 , H01L24/83 , H01L2224/13 , H01L2224/13099 , H01L2224/29101 , H01L2224/2919 , H01L2224/2929 , H01L2224/29318 , H01L2224/29339 , H01L2224/29344 , H01L2224/29355 , H01L2224/29364 , H01L2224/29369 , H01L2224/8319 , H01L2224/838 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01088 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/19041 , H05K3/321 , H05K2201/10636 , H05K2201/10689 , H05K2201/10909 , H05K2203/0307 , H05K2203/1446 , Y02P70/611 , H01L2924/00 , H01L2924/3512 , H01L2924/00014 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299
摘要： A surface of an external electrode 3 of an electronic part 4 is formed with a coating containing resin ingredient. Thereby, adhesion strength and reliability may be significantly improved in mounting an electronic part onto a circuit board 1 through the medium of a conductive adhesive. Further, it will be able to mount an electronic part to an element to be mounted by utilizing a conductive adhesive forming an external electrode 3 as a connecting element. Further, surface roughness (Ra) of an external electrode 3 of an electronic part is set to 0.1 μm or more and to 10.0 μm or less and preferably to 1.0 μm or more and to 5.0 μm or less. Thereby, adhesion strength with a conductive adhesive may be significantly enhanced in comparison with a conventional electronic part presented.
摘要翻译：电子部件4的外部电极3的表面形成有含有树脂成分的涂层。因此，通过导电粘合剂的介质将电子部件安装到电路板1上可以显着改善粘附强度和可靠性。此外，通过利用形成作为连接元件的外部电极3的导电粘合剂，能够将电子部件安装到要安装的元件上。此外，电子部件的外部电极3的表面粗糙度（R a1 a）设定为0.1μm以上至10.0μm以下，优选为1.0μm以上且5.0μm以下。因此，与传统的电子部件相比，与导电粘合剂的粘附强度可以显着提高。

6. 发明授权

US06675474B2 Electronic component mounted member and repair method thereof 有权
标题翻译：电子元件安装件及其修理方法
公开(公告)号：US06675474B2
公开(公告)日：2004-01-13
申请号：US10309597
申请日：2002-12-03
申请人： Tsutomu Mitani , Hiroaki Takezawa , Yukihiro Ishimaru , Takashi Kitae , Yasuhiro Suzuki
发明人： Tsutomu Mitani , Hiroaki Takezawa , Yukihiro Ishimaru , Takashi Kitae , Yasuhiro Suzuki
IPC分类号： H05K1300
CPC分类号： H05K3/321 , H05K2201/0129 , H05K2201/10992 , H05K2203/176 , H05K2203/306 , Y10T29/49172
摘要： An electronic component mounted member includes a circuit board, an electronic component connected to the circuit board and an electrically conductive adhesive interposed between the electronic component and the circuit board. In a joining interface of the electrically conductive adhesive and an electrode of the circuit board, an intermediate layer that is formed of a thermoplastic insulating adhesive with a softening temperature of 100° C. to 300° C. is interposed between the electrically conductive adhesive and the electrode. An electrically conductive filler contained in the electrically conductive adhesive is present partially in the intermediate layer, thus allowing an electrical conduction between the electrically conductive adhesive and the electrode of the circuit board. This electronic component mounted member is used, and when a repair is necessary, a portion of the intermediate layer corresponding to the electronic component to be repaired is heated so as to raise a temperature of this portion to at least a melting point of the thermoplastic insulating adhesive, thereby melting the thermoplastic insulating adhesive. Then, the electronic component is removed with this state maintained.
摘要翻译：电子部件安装部件包括电路板，连接到电路板的电子部件和插入在电子部件和电路板之间的导电粘合剂。在导电粘合剂和电路板的电极的接合界面中，由软化温度为100℃至300℃的热塑性绝缘粘合剂形成的中间层介于导电粘合剂和电极。包含在导电粘合剂中的导电填料部分地存在于中间层中，从而允许导电粘合剂和电路板的电极之间的导电。使用该电子部件安装部件，当需要修理时，对应于要修复的电子部件的中间层的一部分被加热，以将该部分的温度升高至热塑性绝缘体的至少熔点粘合剂，从而熔化热塑性绝缘粘合剂。然后，保持该状态，去除电子部件。

7. 发明授权

US06510059B2 Conductive resin, electronic module using conductive resin, and method of manufacturing electronic module 失效
公开(公告)号：US06510059B2
公开(公告)日：2003-01-21
申请号：US09889523
申请日：2001-07-18
申请人： Tsutomu Mitani , Yukihiro Ishimaru , Takashi Kitae , Hiroaki Takezawa
发明人： Tsutomu Mitani , Yukihiro Ishimaru , Takashi Kitae , Hiroaki Takezawa
IPC分类号： H05K118
CPC分类号： H05K3/321 , C09J9/02 , H01L23/49883 , H01L2924/0002 , H05K3/305 , H05K2201/10636 , H05K2201/10977 , H05K2203/0278 , H05K2203/0783 , Y02P70/611 , Y10S205/925 , Y10T29/4913 , Y10T29/49146 , H01L2924/00
摘要： In mounting an electronic component using a conductive resin, a conductive resin containing a specific diluent component is used as the conductive resin, or a specific diluent component is applied to the conductive resin before being cured. This allows connection in a portion where an electrode (5) of an electronic component (4) and an electrode (2) of a circuit substrate (1) are opposed to each other to be provided via a resin (3a) containing a conductive filler as a main component, and allows connection at a lower surface of the electronic component (4) and connection in vicinities of the electrode (5) to be provided via a resin (3b, 3c) containing a binder resin as a main component that has oozed out of the conductive resin. The resin (3b, 3c) containing the binder resin as the main component increases junction strength.

8. 发明授权

US06749774B2 Conductive adhesive and connection structure using the same 失效
标题翻译：导电胶和连接结构使用相同
公开(公告)号：US06749774B2
公开(公告)日：2004-06-15
申请号：US10309596
申请日：2002-12-03
申请人： Hiroaki Takezawa , Takashi Kitae , Yukihiro Ishimaru , Tsutomu Mitani
发明人： Hiroaki Takezawa , Takashi Kitae , Yukihiro Ishimaru , Tsutomu Mitani
IPC分类号： H01B122
CPC分类号： H01B1/22 , C09J9/02 , H01R4/04 , H05K3/321 , H05K2201/0129 , H05K2203/121 , Y10T428/249985 , Y10T428/2804 , Y10T428/2852
摘要： A mounting technique with improved adhesive strength and higher reliability against bending stress is provided with the use of a conductive adhesive including a binder resin and a metal filler as main components, in which a functional group is introduced into the molecular chain of the binder resin to form a multidentate bonding with an electrode metal easily. As a thermoplastic resin, at least two kinds of functional groups selected from the group consisting of a carbonyl group, a carboxyl group, an amino group, an imino group, an iminoacetic acid group, an iminopropionic acid group, a hydroxyl group, a thiol group, a pyridinium group, an imido group, an azo group, a nitrilo group, an ammonium group and an imidazole group are introduced. Accordingly, a strong bond with the electrode metal can be achieved. The conductive adhesive is screen-printed to an electrode disposed on a substrate, and after an electrode of a component is mounted, the structure is heated so as to create a mounted structure.
摘要翻译：通过使用包含粘合剂树脂和金属填料作为主要成分的导电粘合剂，其中将官能团引入到粘合剂树脂的分子链中，提供了具有改进的粘合强度和对弯曲应力的更高可靠性的安装技术，与电极金属容易形成多齿结合。作为热塑性树脂，选自羰基，羧基，氨基，亚氨基，亚氨基乙酸基，亚氨基丙酸基，羟基，硫醇中的至少两种官能团基团，吡啶鎓基，亚氨基，偶氮基，次氮基，铵基和咪唑基。因此，可以实现与电极金属的牢固结合。将导电粘合剂丝网印刷到设置在基板上的电极，并且在部件的电极安装之后，将该结构加热以形成安装的结构。

9. 发明授权

US06512183B2 Electronic component mounted member and repair method thereof 失效
公开(公告)号：US06512183B2
公开(公告)日：2003-01-28
申请号：US09893106
申请日：2001-06-27
申请人： Tsutomu Mitani , Hiroaki Takezawa , Yukihiro Ishimaru , Takashi Kitae , Yasuhiro Suzuki
发明人： Tsutomu Mitani , Hiroaki Takezawa , Yukihiro Ishimaru , Takashi Kitae , Yasuhiro Suzuki
IPC分类号： H05K109
CPC分类号： H05K3/321 , H05K2201/0129 , H05K2201/10992 , H05K2203/176 , H05K2203/306 , Y10T29/49172
摘要： An electronic component mounted member includes a circuit board, an electronic component connected to the circuit board and an electrically conductive adhesive interposed between the electronic component and the circuit board. In a joining interface of the electrically conductive adhesive and an electrode of the circuit board, an intermediate layer that is formed of a thermoplastic insulating adhesive with a softening temperature of 100° C. to 300° C. is interposed between the electrically conductive adhesive and the electrode. An electrically conductive filler contained in the electrically conductive adhesive is present partially in the intermediate layer, thus allowing an electrical conduction between the electrically conductive adhesive and the electrode of the circuit board. This electronic component mounted member is used, and when a repair is necessary, a portion of the intermediate layer corresponding to the electronic component to be repaired is heated so as to raise a temperature of this portion to at least a melting point of the thermoplastic insulating adhesive, thereby melting the thermoplastic insulating adhesive. Then, the electronic component is removed with this state maintained.

10. 发明授权

US07151306B2 Electronic part, and electronic part mounting element and an process for manufacturing such the articles 失效
标题翻译：电子部件和电子部件安装元件及其制造方法
公开(公告)号：US07151306B2
公开(公告)日：2006-12-19
申请号：US11009045
申请日：2004-12-13
申请人： Takashi Kitae , Tsutomu Mitani , Yukihiro Ishimaru , Hiroaki Takezawa
发明人： Takashi Kitae , Tsutomu Mitani , Yukihiro Ishimaru , Hiroaki Takezawa
IPC分类号： H01L21/44 , H01L21/48 , H01L21/50
CPC分类号： H01L24/10 , H01L24/13 , H01L24/29 , H01L24/83 , H01L2224/13 , H01L2224/13099 , H01L2224/29101 , H01L2224/2919 , H01L2224/2929 , H01L2224/29318 , H01L2224/29339 , H01L2224/29344 , H01L2224/29355 , H01L2224/29364 , H01L2224/29369 , H01L2224/8319 , H01L2224/838 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01088 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/19041 , H05K3/321 , H05K2201/10636 , H05K2201/10689 , H05K2201/10909 , H05K2203/0307 , H05K2203/1446 , Y02P70/611 , H01L2924/00 , H01L2924/3512 , H01L2924/00014 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299
摘要： A surface of an external electrode 3 of an electronic part 4 is formed with a coating containing resin ingredient. Thereby, adhesion strength and reliability may be significantly improved in mounting an electronic part onto a circuit board 1 through the medium of a conductive adhesive. Further, it will be able to mount an electronic part to an element to be mounted by utilizing a conductive adhesive forming an external electrode 3 as a connecting element.Further, surface roughness (Ra) of an external electrode 3 of an electronic part is set to 0.1 μm or more and to 10.0 μm or less and preferably to 1.0 μm or more and to 5.0 μm or less. Thereby, adhesion strength with a conductive adhesive may be significantly enhanced in comparison with a conventional electronic part presented.
摘要翻译：电子部件4的外部电极3的表面形成有含有树脂成分的涂层。因此，通过导电粘合剂的介质将电子部件安装到电路板1上可以显着改善粘附强度和可靠性。此外，通过利用形成作为连接元件的外部电极3的导电粘合剂，能够将电子部件安装到要安装的元件上。此外，电子部件的外部电极3的表面粗糙度（R a1 a）设定为0.1μm以上至10.0μm以下，优选为1.0μm以上且5.0μm以下。因此，与传统的电子部件相比，与导电粘合剂的粘附强度可以显着提高。

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