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11. 发明授权

US09419142B2 Method for manufacturing semiconductor device 有权
标题翻译：制造半导体器件的方法
公开(公告)号：US09419142B2
公开(公告)日：2016-08-16
申请号：US13431073
申请日：2012-03-27
申请人： Masafumi Morisue , Yasuhiro Jinbo , Gen Fujii , Hajime Kimura
发明人： Masafumi Morisue , Yasuhiro Jinbo , Gen Fujii , Hajime Kimura
IPC分类号： H01L29/786 , G02F1/167 , H01L27/12 , H01L31/0392 , H01L51/00 , H01L27/32 , H01L51/56
CPC分类号： H01L27/1266 , G02F1/133305 , G02F1/133345 , G02F1/133711 , G02F1/133734 , G02F1/133784 , G02F1/13394 , G02F1/167 , H01L27/1214 , H01L27/1218 , H01L27/3244 , H01L27/3272 , H01L29/78603 , H01L29/78633 , H01L31/0392 , H01L31/03925 , H01L31/03926 , H01L31/1896 , H01L51/003 , H01L51/56 , H01L2227/326 , H01L2251/5338 , Y02E10/549 , Y02P70/521
摘要： A method for manufacturing a semiconductor device includes: forming a photocatalytic layer and an organic compound layer in contact with the photocatalytic layer over a substrate having a light transmitting property; forming an element forming layer over the substrate having the light transmitting property with the photocatalytic layer and the organic compound layer in contact with the photocatalytic layer interposed therebetween; and separating the element forming layer from the substrate having the light transmitting property after the photocatalytic layer is irradiated with light through the substrate having the light transmitting property.
摘要翻译：一种制造半导体器件的方法包括：在具有透光性的基板上形成光催化层和与光催化层接触的有机化合物层; 在所述光催化层和所述有机化合物层之间与所述光催化层接触的具有透光性的基板上形成元件形成层; 并且在通过具有透光性的基板用光照射光催化层之后，将元件形成层与具有透光性的基板分离。

12. 发明授权

US08173519B2 Method for manufacturing semiconductor device 有权
标题翻译：制造半导体器件的方法
公开(公告)号：US08173519B2
公开(公告)日：2012-05-08
申请号：US11709126
申请日：2007-02-22
申请人： Masafumi Morisue , Yasuhiro Jinbo , Gen Fujii , Hajime Kimura
发明人： Masafumi Morisue , Yasuhiro Jinbo , Gen Fujii , Hajime Kimura
IPC分类号： H01L21/30
CPC分类号： H01L27/1266 , G02F1/133305 , G02F1/133345 , G02F1/133711 , G02F1/133734 , G02F1/133784 , G02F1/13394 , G02F1/167 , H01L27/1214 , H01L27/1218 , H01L27/3244 , H01L27/3272 , H01L29/78603 , H01L29/78633 , H01L31/0392 , H01L31/03925 , H01L31/03926 , H01L31/1896 , H01L51/003 , H01L51/56 , H01L2227/326 , H01L2251/5338 , Y02E10/549 , Y02P70/521
摘要： A method for manufacturing a semiconductor device includes: forming a photocatalytic layer and an organic compound layer in contact with the photocatalytic layer over a substrate having a light transmitting property; forming an element forming layer over the substrate having the light transmitting property with the photocatalytic layer and the organic compound layer in contact with the photocatalytic layer interposed therebetween; and separating the element forming layer from the substrate having the light transmitting property after the photocatalytic layer is irradiated with light through the substrate having the light transmitting property.
摘要翻译：一种制造半导体器件的方法包括：在具有透光性的基板上形成光催化层和与光催化层接触的有机化合物层; 在所述光催化层和所述有机化合物层之间与所述光催化层接触的具有透光性的基板上形成元件形成层; 并且在通过具有透光性的基板用光照射光催化层之后，将元件形成层与具有透光性的基板分离。

13. 发明授权

US08053171B2 Substrate having film pattern and manufacturing method of the same, manufacturing method of semiconductor device, liquid crystal television, and EL television 有权
标题翻译：具有膜图案的基板及其制造方法，半导体装置，液晶电视和EL电视机的制造方法
公开(公告)号：US08053171B2
公开(公告)日：2011-11-08
申请号：US11025921
申请日：2005-01-03
申请人： Shinji Maekawa , Gen Fujii , Hiroko Shiroguchi , Masafumi Morisue
发明人： Shinji Maekawa , Gen Fujii , Hiroko Shiroguchi , Masafumi Morisue
IPC分类号： H01L21/00
CPC分类号： G02B5/201 , G03F7/0007 , H01L27/1285 , H01L27/1292 , H01L27/3281 , H01L27/3295 , H01L29/66757 , H01L29/66765 , H01L51/56
摘要： The invention provides a manufacturing method of a substrate having a film pattern including an insulating film, a semiconductor film, a conductive film and the like by simple steps, and also a manufacturing method of a semiconductor device which is low in cost with high throughput and yield. According to the invention, after forming a first protective film which has low wettability on a substrate, a material which has high wettability is applied or discharged on an outer edge of a first mask pattern, thereby a film pattern and a substrate having the film pattern are formed.
摘要翻译：本发明通过简单的步骤提供了具有包括绝缘膜，半导体膜，导电膜等的膜图案的基板的制造方法，以及低成本，高生产率的半导体器件的制造方法，产量。根据本发明，在形成在基材上具有低润湿性的第一保护膜之后，在第一掩模图案的外边缘上施加或排出具有高润湿性的材料，从而形成膜图案和具有膜图案的基板形成。

14. 发明授权

US07449372B2 Manufacturing method of substrate having conductive layer and manufacturing method of semiconductor device 有权
标题翻译：具有导电层的基板的制造方法和半导体装置的制造方法
公开(公告)号：US07449372B2
公开(公告)日：2008-11-11
申请号：US11295471
申请日：2005-12-07
申请人： Gen Fujii , Masafumi Morisue , Hironobu Shoji , Junya Maruyama , Kouji Dairiki , Tomoyuki Aoki
发明人： Gen Fujii , Masafumi Morisue , Hironobu Shoji , Junya Maruyama , Kouji Dairiki , Tomoyuki Aoki
IPC分类号： H01L21/84
CPC分类号： H01L27/12 , H01L23/48 , H01L23/5227 , H01L24/11 , H01L27/0629 , H01L27/1266 , H01L27/1292 , H01L27/13 , H01L28/10 , H01L29/78621 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2924/00014 , H01L2924/07811 , H01L2924/12044 , H01L2924/14 , H01L2924/15788 , H01L2924/3011 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： The manufacturing method of a substrate having a conductive layer has the steps of: forming an inorganic insulating layer over a substrate; forming an organic resin layer with a desired shape over the inorganic insulating layer; forming a low wettability layer with respect to a composition containing conductive particles on a first exposed portion of the inorganic insulating layer; removing the organic resin layer; and coating a second exposed portion of the inorganic insulating layer with a composition containing conductive particles and baking, thereby forming a conductive layer.
摘要翻译：具有导电层的基板的制造方法具有以下步骤：在基板上形成无机绝缘层; 在无机绝缘层上形成具有所需形状的有机树脂层; 在无机绝缘层的第一暴露部分上相对于含有导电颗粒的组合物形成低润湿性层; 去除有机树脂层; 并用含有导电颗粒的组合物涂覆无机绝缘层的第二暴露部分并进行烘烤，由此形成导电层。

15. 发明申请

US20060134918A1 Manufacturing method of substrate having conductive layer and manufacturing method of semiconductor device 有权
标题翻译：具有导电层的基板的制造方法和半导体装置的制造方法
公开(公告)号：US20060134918A1
公开(公告)日：2006-06-22
申请号：US11295471
申请日：2005-12-07
申请人： Gen Fujii , Masafumi Morisue , Hironobu Shoji , Junya Maruyama , Kouji Dairiki , Tomoyuki Aoki
发明人： Gen Fujii , Masafumi Morisue , Hironobu Shoji , Junya Maruyama , Kouji Dairiki , Tomoyuki Aoki
IPC分类号： H01L21/311 , H01L21/302
CPC分类号： H01L27/12 , H01L23/48 , H01L23/5227 , H01L24/11 , H01L27/0629 , H01L27/1266 , H01L27/1292 , H01L27/13 , H01L28/10 , H01L29/78621 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2924/00014 , H01L2924/07811 , H01L2924/12044 , H01L2924/14 , H01L2924/15788 , H01L2924/3011 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： The manufacturing method of a substrate having a conductive layer has the steps of: forming an inorganic insulating layer over a substrate; forming an organic resin layer with a desired shape over the inorganic insulating layer, forming a low wettability layer with respect to a composition containing conductive particles on a first exposed portion of the inorganic insulating layer; removing the organic resin layer; and coating a second exposed portion of the inorganic insulating layer with a composition containing conductive particles and baking, thereby forming a conductive layer.
摘要翻译：具有导电层的基板的制造方法具有以下步骤：在基板上形成无机绝缘层; 在所述无机绝缘层上形成具有所需形状的有机树脂层，在所述无机绝缘层的第一暴露部分上相对于含有导电颗粒的组合物形成低润湿性层; 去除有机树脂层; 并用含有导电颗粒的组合物涂覆无机绝缘层的第二暴露部分并进行烘烤，由此形成导电层。

16. 发明授权

US08624252B2 Substrate having film pattern and manufacturing method of the same, manufacturing method of semiconductor device, liquid crystal television, and el television 有权
标题翻译：具有膜图案的基板及其制造方法，半导体装置，液晶电视和电视机的制造方法
公开(公告)号：US08624252B2
公开(公告)日：2014-01-07
申请号：US13612146
申请日：2012-09-12
申请人： Shinji Maekawa , Gen Fujii , Hiroko Shiroguchi , Masafumi Morisue
发明人： Shinji Maekawa , Gen Fujii , Hiroko Shiroguchi , Masafumi Morisue
IPC分类号： H01L29/04 , H01L29/10 , H01L31/00 , H01L27/14 , H01L29/15 , H01L31/036 , H01L27/12
CPC分类号： G02B5/201 , G03F7/0007 , H01L27/1285 , H01L27/1292 , H01L27/3281 , H01L27/3295 , H01L29/66757 , H01L29/66765 , H01L51/56
摘要： The invention provides a manufacturing method of a substrate having a film pattern including an insulating film, a semiconductor film, a conductive film and the like by simple steps, and also a manufacturing method of a semiconductor device which is low in cost with high throughput and yield. According to the invention, after forming a first protective film which has low wettability on a substrate, a material which has high wettability is applied or discharged on an outer edge of a first mask pattern, thereby a film pattern and a substrate having the film pattern are formed.
摘要翻译：本发明通过简单的步骤提供了具有包括绝缘膜，半导体膜，导电膜等的膜图案的基板的制造方法，以及低成本，高生产率的半导体器件的制造方法，产量。根据本发明，在形成在基材上具有低润湿性的第一保护膜之后，在第一掩模图案的外边缘上施加或排出具有高润湿性的材料，从而形成膜图案和具有膜图案的基板形成。

17. 发明申请

US20100099217A1 Semiconductor Device, Electronic Device, and Method of Manufacturing Semiconductor Device 有权
标题翻译：半导体器件，电子器件和半导体器件的制造方法
公开(公告)号：US20100099217A1
公开(公告)日：2010-04-22
申请号：US12641701
申请日：2009-12-18
申请人： Toshiyuki Isa , Gen Fujii , Masafumi Morisue , Ikuko Kawamata
发明人： Toshiyuki Isa , Gen Fujii , Masafumi Morisue , Ikuko Kawamata
IPC分类号： H01L21/336
CPC分类号： H01L21/288 , H01L21/02672 , H01L21/76838 , H01L27/12 , H01L27/124 , H01L27/1285 , H01L27/1292 , H01L27/3248 , H01L27/3276 , H01L51/0019 , H01L51/0022 , H01L51/0023 , H01L2924/0002 , Y02P80/30 , H01L2924/00
摘要： Conductive layers having knots are adjacently formed with uniform distance therebetween. Droplets of the conductive layers are discharged to stagger centers of the droplets in a length direction of wirings so that the centers of the discharged droplets are not on the same line in a line width direction between the adjacent conductive layers. Since the centers of the droplets are staggered, parts of the conductive layers each having a widest line width (the widest width of knot) are not connected to each other, and the conductive layers can be formed adjacently with a shorter distance therebetween.
摘要翻译：具有结的导电层相邻地形成，其间具有均匀的距离。导电层的液滴在布线的长度方向上被排出到液滴的错开中心，使得排出的液滴的中心在相邻导电层之间的线宽方向上不在相同的线上。由于液滴的中心是错开的，所以每个具有最宽的线宽（结的最宽的宽度）的导电层的部分彼此不连接，导电层可以以较短的距离相邻地形成。

18. 发明授权

US07670884B2 Manufacturing method of substrate having conductive layer and manufacturing method of semiconductor device 有权
标题翻译：具有导电层的基板的制造方法和半导体装置的制造方法
公开(公告)号：US07670884B2
公开(公告)日：2010-03-02
申请号：US12268039
申请日：2008-11-10
申请人： Gen Fujii , Masafumi Morisue , Hironobu Shoji , Junya Maruyama , Kouji Dairiki , Tomoyuki Aoki
发明人： Gen Fujii , Masafumi Morisue , Hironobu Shoji , Junya Maruyama , Kouji Dairiki , Tomoyuki Aoki
IPC分类号： H01L21/00 , H01L21/24 , H01L21/20
CPC分类号： H01L27/12 , H01L23/48 , H01L23/5227 , H01L24/11 , H01L27/0629 , H01L27/1266 , H01L27/1292 , H01L27/13 , H01L28/10 , H01L29/78621 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2924/00014 , H01L2924/07811 , H01L2924/12044 , H01L2924/14 , H01L2924/15788 , H01L2924/3011 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： The manufacturing method of a substrate having a conductive layer has the steps of: forming an inorganic insulating layer over a substrate; forming an organic resin layer with a desired shape over the inorganic insulating layer; forming a low wettability layer with respect to a composition containing conductive particles on a first exposed portion of the inorganic insulating layer; removing the organic resin layer; and coating a second exposed portion of the inorganic insulating layer with a composition containing conductive particles and baking, thereby forming a conductive layer.
摘要翻译：具有导电层的基板的制造方法具有以下步骤：在基板上形成无机绝缘层; 在无机绝缘层上形成具有所需形状的有机树脂层; 在无机绝缘层的第一暴露部分上相对于含有导电颗粒的组合物形成低润湿性层; 去除有机树脂层; 并用含有导电颗粒的组合物涂覆无机绝缘层的第二暴露部分并进行烘烤，由此形成导电层。

19. 发明授权

US07582904B2 Semiconductor device, display device and method for manufacturing thereof, and television device 有权
标题翻译：半导体装置，显示装置及其制造方法以及电视装置
公开(公告)号：US07582904B2
公开(公告)日：2009-09-01
申请号：US11271800
申请日：2005-11-14
申请人： Gen Fujii , Masafumi Morisue
发明人： Gen Fujii , Masafumi Morisue
IPC分类号： H01L33/00
CPC分类号： H01L29/4908 , H01L27/1292 , H01L29/458 , H01L2924/0002 , H01L2924/00
摘要： The purpose of the present invention is to provide a semiconductor device or a display device that can be manufactured by improving the use efficiency of a material as well as simplifying the manufacturing process, and a manufacturing technique of those devices. Also, another purpose of the present invention is to provide a technique for forming a pattern of wirings, etc., constituting the semiconductor device or the display device, in a desired shape and with good adhesiveness. The adhesiveness between first and second conductive layers is increased by forming a conductive buffer layer including at least one pore between them. The second conductive layer is formed by filling the pores of the buffer layer including at least one pore with a particle shaped conductive material which is solidified by baking. The conductive layer solidified in the pores functions like a wedge, and the second conductive layer is formed over the first conductive layer with good adhesiveness and stability.
摘要翻译：本发明的目的是提供一种能够通过提高材料的使用效率以及简化制造工艺而制造的半导体装置或显示装置，以及这些装置的制造技术。此外，本发明的另一个目的是提供一种用于形成构成半导体器件或显示装置的布线图案等的所需形状和良好的粘合性的技术。通过在它们之间形成包括至少一个孔的导电缓冲层来增加第一和第二导电层之间的粘附性。通过将包含至少一个孔的缓冲层的孔填充到通过烘烤固化的颗粒状导电材料而形成第二导电层。在孔中凝固的导电层起楔形作用，第二导电层形成在第一导电层的上方，具有良好的粘合性和稳定性。

20. 发明申请

US20070207571A1 Method for manufacturing semiconductor device 有权
标题翻译：制造半导体器件的方法
公开(公告)号：US20070207571A1
公开(公告)日：2007-09-06
申请号：US11709126
申请日：2007-02-22
申请人： Masafumi Morisue , Yasuhiro Jinbo , Gen Fujii , Hajime Kimura
发明人： Masafumi Morisue , Yasuhiro Jinbo , Gen Fujii , Hajime Kimura
IPC分类号： H01L21/00
CPC分类号： H01L27/1266 , G02F1/133305 , G02F1/133345 , G02F1/133711 , G02F1/133734 , G02F1/133784 , G02F1/13394 , G02F1/167 , H01L27/1214 , H01L27/1218 , H01L27/3244 , H01L27/3272 , H01L29/78603 , H01L29/78633 , H01L31/0392 , H01L31/03925 , H01L31/03926 , H01L31/1896 , H01L51/003 , H01L51/56 , H01L2227/326 , H01L2251/5338 , Y02E10/549 , Y02P70/521
摘要： A method for manufacturing a semiconductor device includes: forming a photocatalytic layer and an organic compound layer in contact with the photocatalytic layer over a substrate having a light transmitting property; forming an element forming layer over the substrate having the light transmitting property with the photocatalytic layer and the organic compound layer in contact with the photocatalytic layer interposed therebetween; and separating the element forming layer from the substrate having the light transmitting property after the photocatalytic layer is irradiated with light through the substrate having the light transmitting property.
摘要翻译：一种制造半导体器件的方法包括：在具有透光性的基板上形成光催化层和与光催化层接触的有机化合物层; 在所述光催化层和所述有机化合物层之间与所述光催化层接触的具有透光性的基板上形成元件形成层; 并且在通过具有透光性的基板用光照射光催化层之后，将元件形成层与具有透光性的基板分离。

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