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    • 5. 发明授权
    • Semiconductor device and manufacturing method thereof
    • 半导体装置及其制造方法
    • US07687326B2
    • 2010-03-30
    • US11292365
    • 2005-12-02
    • Masafumi MorisueShinji Maekawa
    • Masafumi MorisueShinji Maekawa
    • H01L21/00H01L21/84
    • H01L27/14683H01L27/1292H01L27/14621
    • An object of the invention is to provide a semiconductor device and a display device which can be manufactured with improved material efficiency through a simplified manufacturing process, and a manufacturing method thereof. Another object is to provide a technique capable of forming a pattern such as a wiring included in the semiconductor device or display device in a desired shape with good controllability. One feature of a method for manufacturing a semiconductor device is to comprise the steps of forming a layer having a rough surface, forming a region having low wettability by a composition containing a conductive material and a region having high wettability by the composition over the rough surface, and forming a conductive material using the composition in the region having high wettability. Since regions having largely different wettability (regions having a large difference in wettability) can be formed, a liquid conductive or insulating material is attached only to a formation region with precision. Accordingly, a conductive or insulating layer can be precisely formed in a desired pattern.
    • 本发明的目的是提供一种半导体器件和显示装置,其可以通过简化的制造工艺制造成具有改善的材料效率及其制造方法。 另一个目的是提供一种技术,其能够以良好的可控制性形成包括在半导体器件或显示装置中的布线的图案为期望的形状。 用于制造半导体器件的方法的一个特征是包括以下步骤:形成具有粗糙表面的层,通过包含导电材料的组合物和通过粗糙表面上的组合物具有高润湿性的区域形成具有低润湿性的区域 ,并且在具有高润湿性的区域中使用该组合物形成导电材料。 由于可以形成具有大大不同的润湿性的区域(润湿性差异的区域),所以液体导电或绝缘材料仅精确地附着在形成区域上。 因此,可以以期望的图案精确地形成导电或绝缘层。
    • 6. 发明申请
    • Semiconductor device and manufacturing method thereof
    • 半导体装置及其制造方法
    • US20060166411A1
    • 2006-07-27
    • US11292365
    • 2005-12-02
    • Masafumi MorisueShinji Maekawa
    • Masafumi MorisueShinji Maekawa
    • H01L21/84H01L21/00
    • H01L27/14683H01L27/1292H01L27/14621
    • An object of the invention is to provide a semiconductor device and a display device which can be manufactured with improved material efficiency through a simplified manufacturing process, and a manufacturing method thereof. Another object is to provide a technique capable of forming a pattern such as a wiring included in the semiconductor device or display device in a desired shape with good controllability. One feature of a method for manufacturing a semiconductor device is to comprise the steps of forming a layer having a rough surface, forming a region having low wettability by a composition containing a conductive material and a region having high wettability by the composition over the rough surface, and forming a conductive material using the composition in the region having high wettability. Since regions having largely different wettability (regions having a large difference in wettability) can be formed, a liquid conductive or insulating material is attached only to a formation region with precision. Accordingly, a conductive or insulating layer can be precisely formed in a desired pattern.
    • 本发明的目的是提供一种半导体器件和显示装置,其可以通过简化的制造工艺制造成具有改善的材料效率及其制造方法。 另一个目的是提供一种技术,其能够以良好的可控制性形成包括在半导体器件或显示装置中的布线的图案为期望的形状。 用于制造半导体器件的方法的一个特征是包括以下步骤:形成具有粗糙表面的层,通过包含导电材料的组合物和通过粗糙表面上的组合物具有高润湿性的区域形成具有低润湿性的区域 ,并且在具有高润湿性的区域中使用该组合物形成导电材料。 由于可以形成具有大大不同的润湿性的区域(润湿性差异的区域),所以液体导电或绝缘材料仅精确地附着在形成区域上。 因此,可以以期望的图案精确地形成导电或绝缘层。
    • 9. 发明授权
    • Method for manufacturing semiconductor device
    • 制造半导体器件的方法
    • US07732334B2
    • 2010-06-08
    • US11195725
    • 2005-08-03
    • Masafumi MorisueGen Fujii
    • Masafumi MorisueGen Fujii
    • H01L21/311
    • H01L27/1285H01L27/1292
    • It is an object of the present invention to provide a method for manufacturing a substrate having film patterns such as an insulating film, a semiconductor film, and a conductive film in simple processes. It is another object of the invention to provide a method for manufacturing a semiconductor device with high throughput and high yield at low cost. A method for manufacturing a semiconductor device including the steps of: forming a first film over a substrate; discharging a solution containing a mask material to the first film thereby forming a mask over the first film; patterning the first film with the use of the mask thereby forming low wettability regions and a high wettability region over the substrate; removing the mask; and discharging a solution containing a material of an insulating film, a semiconductor film, or a conductive film to the high wettability region provided between the low wettability regions thereby forming a pattern of the insulating film, the semiconductor film, or the conductive film.
    • 本发明的目的是提供一种在简单的工艺中制造具有绝缘膜,半导体膜和导电膜等膜图案的基板的方法。 本发明的另一个目的是提供一种以低成本生产高产量和高产率的半导体器件的方法。 一种制造半导体器件的方法,包括以下步骤:在衬底上形成第一膜; 将含有掩模材料的溶液排放到第一膜上,从而在第一膜上形成掩模; 通过使用掩模图案化第一膜,从而在衬底上形成低润湿性区域和高润湿性区域; 去除面膜; 并且将包含绝缘膜,半导体膜或导电膜的材料的溶液排出到设置在低润湿性区域之间的高润湿性区域,从而形成绝缘膜,半导体膜或导电膜的图案。