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11. 发明授权

US5882539A Wafer processing method and equipment therefor 失效
标题翻译：晶圆加工方法及设备
公开(公告)号：US5882539A
公开(公告)日：1999-03-16
申请号：US700604
申请日：1996-08-14
申请人： Fumihiko Hasegawa , Yasuyoshi Kuroda , Masayuki Yamada
发明人： Fumihiko Hasegawa , Yasuyoshi Kuroda , Masayuki Yamada
IPC分类号： B24B9/06 , B24B37/02 , B24B37/04 , H01L21/304 , B24B1/00
CPC分类号： H01L21/02021 , B24B37/02 , B24B37/042 , B24B9/065 , Y10S438/906 , Y10S438/928 , Y10S438/959 , Y10S438/974
摘要： A wafer processing method which can polish the chamfered portion of a wafer quickly, is disclosed. The processing method comprises the steps of: chamfering a peripheral portion of a wafer obtained by slicing an ingot, by grinding; lapping the wafer; etching the chamfered or lapped wafer; thereafter honing the entirety of the chamfered peripheral portion of the wafer by using a grinding stone while applying a predetermined load to the grinding stone; and thereafter polishing the entirety of the chamfered peripheral portion and the front and rear surfaces of the wafer.
摘要翻译：公开了可以快速抛光晶片的倒角部分的晶片处理方法。该处理方法包括以下步骤：通过研磨将通过切割锭块获得的晶片的周边部分倒角; 研磨晶圆; 蚀刻倒角或重叠的晶片; 然后通过使用研磨石珩磨整个切削的周边部分，同时向研磨石施加预定的载荷; 然后对整个切削的周边部分和晶片的前表面和后表面进行抛光。

12. 发明授权

US5538463A Apparatus for bevelling wafer-edge 失效
标题翻译：倾斜晶圆边缘装置
公开(公告)号：US5538463A
公开(公告)日：1996-07-23
申请号：US156829
申请日：1993-11-24
申请人： Fumihiko Hasegawa , Tatsuo Ohtani , Yasuyoshi Kuroda
发明人： Fumihiko Hasegawa , Tatsuo Ohtani , Yasuyoshi Kuroda
IPC分类号： B24B9/06 , B24B49/16 , B24B5/00
CPC分类号： B24B9/065 , B24B49/16
摘要： An apparatus for bevelling the edge of a wafer, comprising a framework, a table rotatably mounted to the framework and capable of holding down the wafer, a buff rotatably mounted to the framework opposite the table and having a formed groove for bevelling the wafer edge, an air cylinder assembly mounted to the framework and pressing the buff by different forces on the orientation flat, the circular edge and the round joints of the wafer held down by the table, a sensor sensing the orientation flat, the circular edge and the round joints of the wafer held down by the table and producing corresponding signals, and a control controlling the air cylinder assembly to select between the forces in response to the signals. The apparatus may comprise a grooving cutter assembly removably held by the table, a lock locking the rotation of the table when the apparatus produces the formed groove in the buff, and a stopper stopping the air cylinder assembly and positioning the cutter assembly relative to the buff.
摘要翻译：一种用于斜切晶片边缘的装置，包括框架，可旋转地安装到框架并能够保持晶片的台子，可旋转地安装到与桌子相对的框架上的抛光轮，并具有用于斜切晶片边缘的形成的凹槽，安装到框架上的气缸组件，并且通过由定位平面，圆形边缘和由桌子压下的晶片的圆形接头上的不同的力来挤压凸轮，感测定向平面，圆形边缘和圆形接头的传感器并且产生对应的信号，以及控制气缸组件以响应于信号在力之间进行选择的控制。该设备可以包括可移动地由工作台保持的切槽刀具组件，当设备在抛光器中产生形成的凹槽时锁定桌子的旋转，并且止动器阻止气缸组件并且相对于凸轮定位刀具组件。

13. 发明授权

US5458529A Apparatus for polishing notch portion of wafer 失效
标题翻译：用于抛光晶片的切口部分的装置
公开(公告)号：US5458529A
公开(公告)日：1995-10-17
申请号：US249933
申请日：1994-05-26
申请人： Fumihiko Hasegawa , Tatsuo Ohtani , Koichiro Ichikawa , Yoshio Nakamura
发明人： Fumihiko Hasegawa , Tatsuo Ohtani , Koichiro Ichikawa , Yoshio Nakamura
IPC分类号： B24B29/00 , B24B9/00 , B24B9/06 , B24B29/02 , H01L21/304 , B24B7/00
CPC分类号： B24B9/065
摘要： A polishing apparatus which can effectively polish a bottom wall of a wafer in the notch portion is disclosed. The polishing apparatus includes: a table for supporting the wafer thereon; a rotary buff having a thickness so that the periphery thereof can enter the notch portion of the wafer, and is rotated around an axis which is parallel with a plane of the surface of the wafer supported on the table; a first rotating member such as a motor for rotating the rotary buff; a movable linkage for supporting the rotary buff; an adjusting member such as a cylinder device for adjusting the pressure applied to the bottom wall of the wafer in the notch portion from the rotary buff; and a second rotating member such as a pulse motor for turning the rotary buff around a predetermined axis so that the applied pressure from the rotary buff acts on the bottom wall of the wafer in the notch portion in a direction approximately perpendicular to the surface of the bottom wall.
摘要翻译：公开了一种可以有效地抛光切口部分中的晶片底壁的抛光装置。抛光装置包括：用于在其上支撑晶片的工作台; 旋转抛光器，其厚度使得其周边可以进入晶片的切口部分，并且围绕与支撑在工作台上的晶片的表面的平面平行的轴线旋转; 第一旋转构件，例如用于旋转旋转抛光器的马达; 用于支撑旋转抛光器的可移动连杆; 调节构件，例如用于调节从旋转抛光器施加到切口部分中的晶片的底壁的压力的气缸装置; 以及第二旋转构件，例如脉冲电机，用于围绕预定轴线旋转旋转抛光器，使得来自旋转抛光器的施加压力在大致垂直于切割部分的表面的方向上作用在切口部分中的晶片的底壁上底壁。

14. 发明授权

US5429544A Polishing apparatus for notch portion of wafer 失效
标题翻译：抛光装置用于晶片缺口部分
公开(公告)号：US5429544A
公开(公告)日：1995-07-04
申请号：US265792
申请日：1994-06-27
申请人： Fumihiko Hasegawa , Tatsuo Ohtani , Koichiro Ichikawa , Yoshio Nakamura
发明人： Fumihiko Hasegawa , Tatsuo Ohtani , Koichiro Ichikawa , Yoshio Nakamura
IPC分类号： B24B9/00 , B24B9/06 , B24B29/00 , B24B29/02 , H01L21/304 , B24B19/00
CPC分类号： H01L21/02027 , B24B9/065
摘要： An polishing apparatus which can effectively polish a bottom wall of a wafer in a notch portion is disclosed. The apparatus includes: a table for supporting the wafer thereon; a rotary buff having a thickness so that the periphery thereof can enter the notch portion of the wafer, and is rotated around an axis which is parallel with a plane of the surface of the wafer supported on the table; a first rotating member such as a motor for rotating the rotary buff; a linkage for supporting the rotary buff; an adjusting member such as a cylinder device for adjusting the pressure applied to the bottom wall of the wafer in the notch portion from the rotary buff; and a second rotating member for turning the table around a predetermined axis which is approximately parallel with the rotary axis of the rotary buff so that the applied pressure from the rotary buff acts on the bottom wall of the wafer in the notch portion in a direction approximately perpendicular to the surface of the bottom wall.
摘要翻译：公开了一种能够在凹口部分中有效地抛光晶片底壁的抛光装置。该装置包括：用于在其上支撑晶片的工作台; 旋转抛光器，其厚度使得其周边可以进入晶片的切口部分，并且围绕与支撑在工作台上的晶片的表面的平面平行的轴线旋转; 第一旋转构件，例如用于旋转旋转抛光器的马达; 用于支撑旋转抛光器的连杆; 调节构件，例如用于调节从旋转抛光器施加到切口部分中的晶片的底壁的压力的气缸装置; 以及第二旋转构件，用于围绕大致平行于旋转抛光轮的旋转轴线的预定轴线旋转工作台，使得来自旋转抛光器的施加的压力在大致上的方向上作用在切口部分中的晶片的底壁上垂直于底壁的表面。

15. 发明授权

US5860853A Apparatus for polishing wafers 失效
标题翻译：抛光晶圆的设备
公开(公告)号：US5860853A
公开(公告)日：1999-01-19
申请号：US769441
申请日：1996-12-19
申请人： Fumihiko Hasegawa , Makoto Kobayashi , Fumio Suzuki
发明人： Fumihiko Hasegawa , Makoto Kobayashi , Fumio Suzuki
IPC分类号： B24B37/04 , B24B37/27 , B24B37/28 , B24B37/30 , H01L21/304 , B24B7/22
CPC分类号： B24B37/107 , B24B37/30
摘要： An apparatus for polishing wafers comprising a turn table with a polishing pad fixedly extended thereon, at least one polishing head positioned above a point on the turn table spaced by a distance from its center, a plate mounted on a lower surface of the at least one polishing head, and a carrier, which is used for retaining the wafers, mounted on the plate in a manner such that the carrier is freely rotatable relative to the plate, wherein a backing pad which is used to press the wafers is fixed on the plate and the wafers are rotated around their respective centers, while being revolved around the center of the plate. According to the apparatus, polished wafers with an excellent flatness are obtained in a reliable manner.
摘要翻译：一种用于抛光晶片的装置，包括具有固定地延伸在其上的抛光垫的转台，至少一个抛光头，其位于与其中心间隔一定距离的转台上的点上方，安装在至少一个的下表面上的板抛光头和用于保持晶片的载体，其以相对于板自由旋转的方式安装在板上，其中用于将晶片推压的背衬垫固定在板上并且晶片绕其各自的中心旋转，同时围绕板的中心旋转。根据该设备，以可靠的方式获得具有优异平坦度的抛光晶片。

16. 发明授权

US6017497A Atomizing roasting furnace for producing ferrite raw material powder 失效
标题翻译：用于生产铁氧体原料粉末的雾化炉
公开(公告)号：US6017497A
公开(公告)日：2000-01-25
申请号：US918571
申请日：1997-08-22
申请人： Katsushige Matsuzaki , Tatsunori Sunagawa , Kenji Kawahito , Junji Omori , Yoshitaka Yamana , Shoichi Osada , Kiyoshi Aritome , Yoshimasa Ikeda , Izumi Matsushita , Wataru Ohashi , Kaoru Ito , Fumihiko Hasegawa , Shinya Nariki , Michimasa Sasaki , Noritane Tsugane , Toshiaki Kurihara
发明人： Katsushige Matsuzaki , Tatsunori Sunagawa , Kenji Kawahito , Junji Omori , Yoshitaka Yamana , Shoichi Osada , Kiyoshi Aritome , Yoshimasa Ikeda , Izumi Matsushita , Wataru Ohashi , Kaoru Ito , Fumihiko Hasegawa , Shinya Nariki , Michimasa Sasaki , Noritane Tsugane , Toshiaki Kurihara
IPC分类号： C01G49/00 , C04B35/26 , C04B35/626 , H01F1/34 , B01J19/26 , F27B1/00
CPC分类号： C04B35/2658 , C01G49/009 , C04B35/26 , C04B35/626 , H01F1/344 , C01P2004/61 , C01P2006/12
摘要： An atomization roasting furnace for producing ferrite raw material powder includes an elongated roasting furnace body with a center burner located at the top end thereof. At least three liquid spray nozzles are located in an expansion slope portion below the center burner circumferentially with respect to the center burner. A quencher, located below the elongated roasting furnace body, has a top end connected to a bottom end of the elongated roasting furnace body. Quencher nozzles are located adjacent the top end of the quencher.
摘要翻译：一种用于生产铁氧体原料粉末的雾化焙烧炉包括具有位于其顶端的中心燃烧器的细长焙烧炉体。至少三个液体喷嘴位于相对于中心燃烧器周向的中心燃烧器下方的膨胀斜面部分中。位于细长焙烧炉体下方的淬火器具有连接到细长焙烧炉体的底端的顶端。猝灭剂喷嘴位于猝灭剂顶端附近。

17. 发明授权

US5913719A Workpiece holding mechanism 失效
标题翻译：工件夹持机构
公开(公告)号：US5913719A
公开(公告)日：1999-06-22
申请号：US798459
申请日：1997-02-10
申请人： Fumihiko Hasegawa , Makoto Kobayashi , Fumio Suzuki
发明人： Fumihiko Hasegawa , Makoto Kobayashi , Fumio Suzuki
IPC分类号： B24B37/04 , B24B37/30 , H01L21/304 , B24B41/06
CPC分类号： B24B37/30
摘要： A workpiece holding mechanism is used for holding a wafer. The wafer is sandwiched between a holding plate of the workpiece holding mechanism and a polishing pad attached to a polishing turn table. The workpiece is pressed against the polishing pad with a predetermined pressure so that the bottom surface of the wafer is polished. Water is confined within a fluid confinement space defined between an elastic membrane and the holding plate so as to press the wafer via the elastic membrane. There is provided a volume adjustment screw that can be advanced toward the fluid confinement space and be retracted therefrom. Through adjustment of the screw, the elastic membrane is caused to have a flat surface, so that the elastic member is in close contact with the entire surface of the wafer. A holding membrane made of polyurethane foam is bonded to the surface of the elastic membrane, and a template is bonded to the surface of the holding membrane so as to improve the holding performance. Accordingly, a uniform pressure can be applied onto the wafer during polishing, and the wafer is prevented from shifting from a desired position even when polishing is performed at a high speed.
摘要翻译：工件保持机构用于保持晶片。将晶片夹在工件保持机构的保持板和附接到抛光转台的抛光垫之间。以预定的压力将工件压在抛光垫上，从而抛光晶片的底面。水被限制在限定在弹性膜和保持板之间的流体限制空间内，以便通过弹性膜按压晶片。提供了可以朝向流体限制空间前进并从其中缩回的容积调节螺钉。通过调节螺钉，使弹性膜具有平坦的表面，使得弹性构件与晶片的整个表面紧密接触。将由聚氨酯泡沫制成的保持膜结合到弹性膜的表面，并且将模板粘合到保持膜的表面，以提高保持性能。因此，在抛光期间可以在晶片上施加均匀的压力，并且即使当高速执行抛光时也可以防止晶片从期望的位置移位。

18. 发明授权

US5317836A Apparatus for polishing chamfers of a wafer 失效
标题翻译：用于抛光晶片倒角的装置
公开(公告)号：US5317836A
公开(公告)日：1994-06-07
申请号：US980358
申请日：1992-11-23
申请人： Fumihiko Hasegawa , Masayuki Yamada , Hiroshi Kawano , Tatsuo Ohtani
发明人： Fumihiko Hasegawa , Masayuki Yamada , Hiroshi Kawano , Tatsuo Ohtani
IPC分类号： B24B9/00 , B23Q1/36 , B24B9/06 , H01L21/304
CPC分类号： H01L21/02021 , B23Q1/36 , B24B9/065
摘要： An apparatus for polishing edge chamfers of a semiconductor wafer to mirror gloss, having a rotatory cylindrical buff formed with annular groove(s) in its side and a wafer vacuum holder capable of holding and turning the wafer circumferentially, wherein the cylindrical buff is adapted to shift axially, and the annular groove has a width substantially greater than the thickness of the wafer, and a drive mechanism for axially biasing the cylindrical buff is provided.
摘要翻译：一种用于将半导体晶片的边缘倒角抛光成镜面光泽的装置，具有在其侧面形成有环形槽的旋转圆柱形抛光器和能够周向保持和转动晶片的晶片真空保持器，其中圆柱形抛光器适于并且环形槽具有基本上大于晶片厚度的宽度，并且提供用于轴向偏压圆柱形抛光器的驱动机构。

19. 发明申请

US20060106120A1 Method of degrading plastic and process for producing useful substance using the same 审中-公开
标题翻译：降解塑料的方法和使用其制造有用物质的方法
公开(公告)号：US20060106120A1
公开(公告)日：2006-05-18
申请号：US10532423
申请日：2003-09-17
申请人： Keietsu Abe , Katsuya Gomi , Yohei Yamagata , Fumihiko Hasegawa , Hiroshi Maeda , Tasuku Nakajima , Masayuki Machida
发明人： Keietsu Abe , Katsuya Gomi , Yohei Yamagata , Fumihiko Hasegawa , Hiroshi Maeda , Tasuku Nakajima , Masayuki Machida
IPC分类号： C08J11/04
CPC分类号： C12N9/242 , B29B17/00 , C07K14/375 , C08J11/105 , C08J2367/02 , C08J2367/04 , C12N9/18 , Y02W30/62 , Y02W30/702
摘要： A method of degrading a plastic in the presence of a biosurfactant; a method of degrading a plastic by contacting the plastic with a microorganism; a process for producing a useful substance from a plastic which comprises degrading the plastic by contacting the plastic with a microorganism and further converting the components of the thus degraded plastic with the use of a microorganism; a method of degrading a plastic by contacting the plastic with a microorganism in the coexistence of a biosurfactant and/or a plastic-degrading enzyme and thus degrading the plastic under the action of the microorganism; a transformant microorganism having been recombined with at least one DNA selected from among a DNA containing a gene encoding a surface active substance, a DNA containing a gene encoding a plastic-degrading enzyme and a DNA containing a gene encoding a useful substance; novel genes as described above; and proteins encoded thereby.
摘要翻译：在生物表面活性剂存在下降解塑料的方法; 通过使塑料与微生物接触来降解塑料的方法; 一种从塑料制造有用物质的方法，包括通过使塑料与微生物接触来降解塑料，并且通过使用微生物进一步转化由此降解的塑料的组分; 通过在生物表面活性剂和/或塑性降解酶的共存下使塑料与微生物接触从而在微生物的作用下降解塑料来降解塑料的方法; 已经与选自包含编码表面活性物质的DNA的DNA，含有编码塑性降解酶的基因的DNA和含有编码有用物质的基因的DNA重组的转化体微生物; 如上所述的新基因; 和由此编码的蛋白质。

20. 发明授权

US5918587A Method of producing slices 失效
标题翻译：生产切片的方法
公开(公告)号：US5918587A
公开(公告)日：1999-07-06
申请号：US608190
申请日：1996-02-28
申请人： Fumihiko Hasegawa , Hitoshi Misaka , Toshihiro Tsuchiya
发明人： Fumihiko Hasegawa , Hitoshi Misaka , Toshihiro Tsuchiya
IPC分类号： B26F3/06 , B28D5/00 , C03B33/095 , H01L21/304 , B26F3/02
CPC分类号： C03B33/095 , B28D5/0005 , Y10T225/304
摘要： The invention seeks to provide a method of producing slices, such as semiconductor wafers, from a rod-like ingot, which does not require any cutting margin for slicing so that less material is consumed, and also is free from warping or denatured layer of the slices, as well as being free from operating environment deterioration with high quality. A cylindrical ingot is obtained by cutting or grinding the outer periphery of a rod-like ingot, and it is then formed with a plurality of annular grooves at a predetermined pitch in its longitudinal direction to obtain a cylindrical work with annular grooves. The work is then severed in the section defined by the bottom of each annular groove by generating a stress in excess of the rupture strength of the slice in the groove.After the heating of the cylindrical work with annular grooves, the under-process end face of the work is suitably cooled quickly by cooling water jet from a jet nozzle from the outer periphery toward the center of the work.
摘要翻译：本发明寻求提供一种从棒状锭生产切片例如半导体晶片的方法，其不需要任何切割余量用于切片，从而消耗更少的材料，并且也不会有翘曲或变性层切片，以及高品质的环境恶化。通过切割或研磨棒状锭的外周而获得圆柱形锭，然后在其长度方向上以预定间距形成多个环形槽，以获得具有环形槽的圆柱形加工。然后通过产生超过槽中切片的断裂强度的应力在每个环形槽的底部限定的部分中切断工件。在用环形槽加热圆筒形工件之后，通过从射流喷嘴从外周向工件的中心冷却水射流，工件的处理前端面被适当地冷却。

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