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    • 13. 发明申请
    • METHOD OF SEALING AN AIR GAP IN A LAYER OF A SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR STRUCTURE
    • 在半导体结构和半导体结构层中密封空气隙的方法
    • US20110021036A1
    • 2011-01-27
    • US12936113
    • 2008-04-17
    • Greg BraecklmannMarius OrlowskiAndreas Wild
    • Greg BraecklmannMarius OrlowskiAndreas Wild
    • H01L21/312
    • H01L21/7682H01L21/76829H01L21/76834
    • A method of sealing an air gap in a layer of a semiconductor structure comprises providing a first layer of the semiconductor structure having at least one air gap for providing isolation between at least two conductive lines formed in the first layer. The at least one air gap extends into the first layer from a first surface of the first layer. The method further comprises forming a barrier layer of a barrier dielectric material over the first surface of the first layer and the at least one air gap. The barrier dielectric material is selected to have a dielectric constant less than 3.5 and to provide a barrier to prevent chemicals entering the at least one air gap. In another embodiment, the at least one air gap extends from a first surface of the first layer to at least a portion of side surfaces of the at least two conductive lines to expose at least a portion of the side surfaces, and a barrier layer of a barrier dielectric material is formed over the exposed portions of the side surfaces of each of the at least two conductive lines.
    • 密封半导体结构层中的气隙的方法包括提供具有至少一个气隙的半导体结构的第一层,用于在形成在第一层中的至少两个导电线之间提供隔离。 所述至少一个气隙从所述第一层的第一表面延伸到所述第一层中。 该方法还包括在第一层的第一表面和至少一个气隙上形成阻挡介电材料的阻挡层。 阻挡介电材料被选择为具有小于3.5的介电常数并且提供屏障以防止化学品进入至少一个气隙。 在另一个实施例中,至少一个空气间隙从第一层的第一表面延伸到至少两个导电线的侧表面的至少一部分以暴露至少一部分侧表面,并且阻挡层 在所述至少两根导电线中的每一个的侧表面的暴露部分上形成阻挡介电材料。
    • 20. 发明授权
    • Method of forming an inverted T shaped channel structure for an inverted T channel field effect transistor device
    • 形成用于反向T沟道场效应晶体管器件的反相T形沟道结构的方法
    • US08158484B2
    • 2012-04-17
    • US12679385
    • 2007-10-03
    • Marius OrlowskiAndreas Wild
    • Marius OrlowskiAndreas Wild
    • H01L21/331H01L21/8222
    • H01L29/7854H01L29/66795H01L29/78687
    • A method of forming an inverted T shaped channel structure having a vertical channel portion and a horizontal channel portion for an Inverted T channel Field Effect Transistor ITFET device comprises providing a semiconductor substrate, providing a first layer of a first semiconductor material over the semiconductor substrate, and providing a second layer of a second semiconductor material over the first layer. The first and the second semiconductor materials are selected such that the first semiconductor material has a rate of removal which is less than a rate of removal of the second semiconductor material. The method further comprises removing a portion of the first layer and a portion of the second layer selectively according to the different rates of removal so as to provide a lateral layer and the vertical channel portion of the inverted T shaped channel structure and removing a portion of the lateral layer so as to provide the horizontal channel portion of the inverted T shaped channel structure.
    • 一种形成具有用于反向T沟道场效应晶体管ITFET器件的垂直沟道部分和水平沟道部分的反向T形沟道结构的方法包括提供半导体衬底,在半导体衬底上提供第一半导体材料的第一层, 以及在所述第一层上提供第二半导体材料层。 选择第一和第二半导体材料,使得第一半导体材料具有小于除去第二半导体材料的速率的去除速率。 该方法还包括根据不同的去除速率选择性地去除第一层的一部分和第二层的一部分,以便提供倒置的T形沟道结构的横向层和垂直沟道部分,并且去除 横向层,以提供倒置的T形通道结构的水平通道部分。