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11. 发明授权

US5135595A Process for fabricating a low dielectric composite substrate 失效
标题翻译：制造低介电复合基板的工艺
公开(公告)号：US5135595A
公开(公告)日：1992-08-04
申请号：US503495
申请日：1990-03-30
申请人： John Acocella , Peter A. Agostino , Arnold I. Baise , Richard A. Bates , Ray M. Bryant , Jon A. Casey , David R. Clarke , George Czornyj , Allen J. Dam , Lawrence D. David , Renuka S. Divakaruni , Werner E. Dunkel , Ajay P. Giri , Liang-Choo Hsia , James N. Humenik , Steven M. Kandetzke , Daniel P. Kirby , John U. Knickerbocker , Sarah H. Knickerbocker , Anthony Mastreani , Amy T. Matts , Robert W. Nufer , Charles H. Perry , Srinivasa S. N. Reddy , Salvatore J. Scilla , Mark A. Takacs , Lovell B. Wiggins
发明人： John Acocella , Peter A. Agostino , Arnold I. Baise , Richard A. Bates , Ray M. Bryant , Jon A. Casey , David R. Clarke , George Czornyj , Allen J. Dam , Lawrence D. David , Renuka S. Divakaruni , Werner E. Dunkel , Ajay P. Giri , Liang-Choo Hsia , James N. Humenik , Steven M. Kandetzke , Daniel P. Kirby , John U. Knickerbocker , Sarah H. Knickerbocker , Anthony Mastreani , Amy T. Matts , Robert W. Nufer , Charles H. Perry , Srinivasa S. N. Reddy , Salvatore J. Scilla , Mark A. Takacs , Lovell B. Wiggins
IPC分类号： H05K1/03 , C04B41/48 , C04B41/49 , H01L21/48 , H01L23/08 , H01L23/538 , H05K3/40
CPC分类号： H01L21/4857 , C04B41/488 , C04B41/4961 , H01L23/5383 , H05K3/4061 , C04B2111/00672 , C04B2111/00844 , H01L2924/0002 , H01L2924/09701 , H01L2924/12044 , H05K1/0306 , H05K2201/09581 , H05K2203/1147 , H05K2203/308
摘要： The cracking experienced during thermal cycling of metal:dielectric semiconductor packages results from a mismatch in thermal co-efficients of expansion. The non-hermeticity associated with such cracking can be addresssed by backfilling the permeable cracks with a flexible material. Uniform gaps between the metal and dielectric materials can similarly be filled with flexible materials to provide stress relief, bulk compressibility and strength to the package. Furthermore, a permeable, skeletal dielectric can be fabricated as a fired, multilayer structure having sintered metallurgy and subsequently infused with a flexible, temperature-stable material to provide hermeticity and strength.

12. 发明授权

US4466820A Electrolysis treatment for drawing ions out of a ceramic 失效
标题翻译：从陶瓷中抽出离子的电解处理
公开(公告)号：US4466820A
公开(公告)日：1984-08-21
申请号：US514718
申请日：1983-07-18
申请人： David R. Clarke
发明人： David R. Clarke
IPC分类号： C04B35/584 , C04B41/53 , C04B41/91 , C25F1/00
CPC分类号： C04B41/009 , C04B35/584 , C04B41/53 , C04B41/91
摘要： A method is provided for drawing ions out of the glassy phase of a ceramic in order to improve its high temperature strength and to reduce its dielectric loss. The ceramic is heated to a high temperature to increase the mobility of the ions within the glassy phase. An electric field is then applied across the ceramic to draw the ions to the surfaces of the ceramic where they can be removed by grinding.
摘要翻译：提供了一种用于将离子从陶瓷的玻璃相中拉出以提高其高温强度并降低其介电损耗的方法。将陶瓷加热至高温以增加玻璃相内离子的迁移率。然后将电场施加在陶瓷上以将离子吸引到陶瓷的表面，在那里它们可以通过研磨除去。

13. 发明授权

US07070866B2 Nickel aluminide coating with improved oxide stability 失效
标题翻译：镍铝镀层具有改善的氧化物稳定性
公开(公告)号：US07070866B2
公开(公告)日：2006-07-04
申请号：US10855687
申请日：2004-05-27
申请人： Joseph D. Rigney , David R. Clarke , Ramgopal Darolia
发明人： Joseph D. Rigney , David R. Clarke , Ramgopal Darolia
IPC分类号： B23B15/04 , B23B15/20 , B05D3/04 , C22C19/03
CPC分类号： C04B35/486 , C04B2235/3206 , C04B2235/3208 , C04B2235/3224 , C04B2235/3225 , C04B2235/3227 , C04B2235/3229 , C04B2235/3232 , C23C4/18 , C23C8/02 , C23C28/321 , C23C28/345 , C23C28/3455 , Y10T428/12493 , Y10T428/12535 , Y10T428/12618 , Y10T428/12736 , Y10T428/12944
摘要： In one embodiment of the invention, a NiAl overlay bond coating composition comprises a NiAl alloy. The alloy comprises Zr and at least one modifying element in an amount effective to form a stabilized oxide structure comprising stabilized zirconia including a substantially tetragonal structure upon oxidation of the alloy. The tetragonal structure is stabilized such that it does not change phases and revert to a monoclinic or monoclinic and tetragonal structure, which is not substantially tetragonal, upon thermal cycling.
摘要翻译：在本发明的一个实施方案中，NiAl覆盖层涂层组合物包含NiAl合金。合金包含Zr和至少一种修饰元素，其量有效地形成稳定的氧化物结构，其包含在合金氧化时包括基本上四方晶结构的稳定的氧化锆。四方结构被稳定，使得其在热循环时不改变相并恢复为单斜晶体或单斜晶体和四方晶体结构，其基本上不是四边形。

14. 发明授权

US6072568A Thermal barrier coating stress measurement 失效
标题翻译：热障涂层应力测量
公开(公告)号：US6072568A
公开(公告)日：2000-06-06
申请号：US810001
申请日：1997-03-03
申请人： Neil E. Paton , Kenneth S. Murphy , David R. Clarke
发明人： Neil E. Paton , Kenneth S. Murphy , David R. Clarke
IPC分类号： G01L1/24 , G01L5/00 , G01N21/64 , G01N21/84 , G01N21/95
CPC分类号： G01L1/24 , G01L5/0047 , G01N21/64 , G01N21/8422 , G01N21/95 , G01N2021/646 , G01N2021/8438
摘要： A non-destructive measurement method for determining residual stress proximate an intermediate layer in a multilayer thermal barrier coating system by directing a laser beam through an outer ceramic thermal insulating layer with the laser beam illuminating a ceramic-bearing intermediate layer in a manner to cause species present in the intermediate layer to fluoresce, measuring the frequency of the light or photons emitted by the fluroescing species, and comparing the measured frequency shift of the intermediate ceramic layer to the frequency shift determined on like ceramic material under controlled stress states to determine a representation of relative residual stress in the measured coating. The invention can be used to assess integrity or quality control of as-manufactured TBC coatings or to assess remaining coating service life of engine-run TBC coated components during an inspection or repair procedure.
摘要翻译：一种非破坏性测量方法，用于通过将激光束引导通过外部陶瓷绝热层来确定多层热障涂层系统中的中间层附近的残余应力，激光束照射陶瓷轴承中间层以引起物质存在于中间层中以发荧光，测量由氟化物种发射的光或光子的频率，并将中间陶瓷层的测量的频移与在受控应力状态下在类似陶瓷材料上测定的频移进行比较，以确定表示的测量涂层中的相对残余应力。本发明可用于评估制造的TBC涂层的完整性或质量控制，或者在检查或修复过程期间评估发动机运行的TBC涂覆部件的剩余涂层使用寿命。

15. 发明授权

US5277725A Process for fabricating a low dielectric composite substrate 失效
标题翻译：低介电复合衬底的制造方法
公开(公告)号：US5277725A
公开(公告)日：1994-01-11
申请号：US881448
申请日：1992-05-11
申请人： John Acocella , Peter A. Agostino , Arnold I. Baise , Richard A. Bates , Ray M. Bryant , Jon A. Casey , David R. Clarke , George Czornyj , Allen J. Dam , Lawrence D. David , Renuka S. Divakaruni , Werner E. Dunkel , Ajay P. Giri , Liang-Choo Hsia , James N. Humenik , Steven M. Kandetzke , Daniel P. Kirby , John U. Knickerbocker , Sarah H. Knickerbocker , Anthony Mastreani , Amy T. Matts , Robert W. Nufer , Charles H. Perry , Srinivasa S. N. Reddy , Salvatore J. Scilla , Mark A. Takacs , Lovell B. Wiggins
发明人： John Acocella , Peter A. Agostino , Arnold I. Baise , Richard A. Bates , Ray M. Bryant , Jon A. Casey , David R. Clarke , George Czornyj , Allen J. Dam , Lawrence D. David , Renuka S. Divakaruni , Werner E. Dunkel , Ajay P. Giri , Liang-Choo Hsia , James N. Humenik , Steven M. Kandetzke , Daniel P. Kirby , John U. Knickerbocker , Sarah H. Knickerbocker , Anthony Mastreani , Amy T. Matts , Robert W. Nufer , Charles H. Perry , Srinivasa S. N. Reddy , Salvatore J. Scilla , Mark A. Takacs , Lovell B. Wiggins
IPC分类号： H05K1/03 , C04B41/48 , C04B41/49 , H01L21/48 , H01L23/08 , H01L23/538 , H05K3/40 , C04B37/00 , B05D5/12
CPC分类号： H01L21/4857 , C04B41/488 , C04B41/4961 , H01L23/5383 , H05K3/4061 , C04B2111/00672 , C04B2111/00844 , H01L2924/0002 , H01L2924/09701 , H01L2924/12044 , H05K1/0306 , H05K2201/09581 , H05K2203/1147 , H05K2203/308
摘要： The cracking experienced during thermal cycling of metal:dielectric semiconductor packages results from a mismatch in thermal co-efficients of expansion. The non-hermeticity associated with such cracking can be addressed by backfilling the permeable cracks with a flexible material. Uniform gaps between the metal and dielectric materials can similarly be filled with flexible materials to provide stress relief, bulk compressibility and strength to the package. Furthermore, a permeable, skeletal dielectric can be fabricated as a fired, multilayer structure having sintered metallurgy and subsequently infused with a flexible, temperature-stable material to provide hermeticity and strength.
摘要翻译：在金属的热循环过程中经历的裂纹：电介质半导体封装是由热膨胀系数不匹配引起的。与这种开裂相关的非气密性可以通过用柔性材料回填可渗透裂缝来解决。金属和电介质材料之间的均匀间隙可以类似地填充柔性材料，以提供应力消除，体积可压缩性和包装的强度。此外，可渗透的骨架电介质可以被制造为具有烧结冶金的烧结多层结构，并随后注入柔性的温度稳定的材料以提供气密性和强度。

16. 发明授权

US5045402A Zirconia toughening of glass-ceramic materials 失效
标题翻译：氧化锆增韧玻璃陶瓷材料
公开(公告)号：US5045402A
公开(公告)日：1991-09-03
申请号：US348980
申请日：1989-05-09
申请人： Richard W. Adams, Jr. , David R. Clarke , Sara H. Knickerbocker , Linda L. Rapp , Bernard Schwartz
发明人： Richard W. Adams, Jr. , David R. Clarke , Sara H. Knickerbocker , Linda L. Rapp , Bernard Schwartz
IPC分类号： C03C10/00 , C03C10/04 , C03C10/08 , C03C14/00 , C04B35/195 , H01L21/48 , H05K1/03
CPC分类号： H01L21/4807 , C03C10/0045 , C03C14/004 , C04B35/195 , C03C2214/04 , C03C2214/20 , H05K1/0306 , Y10T428/12007 , Y10T428/12618 , Y10T428/12903
摘要： A ceramic material suitable for packaging of large scale integrated circuits is produced by the process of forming a mixture of a powdered glass ceramic material which is a glassy precursor to cordierite ceramic material, formed by the steps which are as follows:a. Mix tetragonal phase material selected from the group consisitng of zirconia or hafnia powder containing a stabilizing oxide compound selected from the group consisting of MgO, CaO and Y.sub.2 O.sub.3 and a glass frit powder or frit of a glassy precursor of cordierite glass ceramic to yield a suspension of solids. Preferably, a binder is included.b. Disperse the suspended solids to yield a dispersion of the zirconia or hafnia with the stabilizing oxide compound and the glassy precursor.c. Densify the dispersion of zirconia or hafnia with the stabilizing oxide compound and the glassy precursor by a sintering heat treatment at a temperature of about 840.degree. C. to melt the glassy precursor into a viscous fluid at a temperature below the melting point of the zirconia or hafnia powder particles to yield a densified intermediate material with the zirconia or hafnia particles encapsulated in the molden glassy percursor.d. Crystallize the densified intermediate material into a polycrystalline composite by heating at 900.degree. C. to 950.degree. C.The process yields a ceramic material consisting of the tetragonal phase material encapsulated in crystalline cordierite glass ceramic material.This invention is a continuation in part of application Ser. No. 07/146,455 filed on Jan. 21, 1988 now abandoned which was a continuation of Ser. No. 06/892,687 filed Aug. 1, 1986 now abandoned.
摘要翻译：通过形成由以下步骤形成的堇青石陶瓷材料的玻璃状前体的玻璃陶瓷材料的混合物的制造方法，制造适合于大规模集成电路封装的陶瓷材料。混合选自氧化锆或铪粉末的四方相材料，其含有选自MgO，CaO和Y 2 O 3的稳定化氧化物和玻璃料粉末或堇青石玻璃陶瓷的玻璃状前体的玻璃料，以产生固体。优选地，包括粘合剂。 b。分散悬浮固体以产生氧化锆或铪的分散体与稳定化氧化物化合物和玻璃状前体。 C。通过在约840℃的温度下进行烧结热处理，使稳定氧化物化合物和玻璃状前体的氧化锆或铪的分散体致密化，在低于氧化锆熔点的温度下将玻璃状前体熔化成粘性流体，或铪粉末颗粒产生致密化的中间体材料，其中氧化锆或铪颗粒包裹在霉变玻璃质中。 d。通过在900℃加热至950℃将致密化的中间体材料结晶成多晶复合材料。该方法产生由包封在结晶堇青石玻璃陶瓷材料中的四方相材料组成的陶瓷材料。本发明是部分应用Ser的延续。 1988年1月21日提交的07 / 146,455号现在已经放弃，这是Ser的延续。 1986年8月1日提交的06 / 892,687号现已放弃。

17. 发明授权

US4457958A Method of strengthening silicon nitride ceramics 失效
标题翻译：强化氮化硅陶瓷的方法
公开(公告)号：US4457958A
公开(公告)日：1984-07-03
申请号：US266244
申请日：1981-05-22
申请人： Frederick F. Lange , David R. Clarke
发明人： Frederick F. Lange , David R. Clarke
IPC分类号： C04B35/584 , C04B41/00 , C04B41/50 , C04B41/87 , B05D3/02
CPC分类号： C04B41/009 , C04B35/584 , C04B41/00 , C04B41/5035 , C04B41/87
摘要： Si.sub.3 N.sub.4 ceramics having a glassy phase densification aid are heated while their surface is in contact with SiO.sub.2. The SiO.sub.2 forms one side of a diffusion couple and draws the glassy phase out of the ceramic. The SiO.sub.2 can be provided by heating the ceramic in air to form an SiO.sub.2 scale by the oxidation of Si.sub.3 N.sub.4, or by imbedding the ceramic in SiO.sub.2 powder. Surface pits, if any, formed during oxidation, are removed by grinding.
摘要翻译：具有玻璃相致密化助剂的Si 3 N 4陶瓷在其表面与SiO 2接触时被加热。 SiO 2形成扩散耦合的一侧并将玻璃相从陶瓷中拉出。 SiO 2可以通过在空气中加热陶瓷以通过Si 3 N 4的氧化形成SiO 2垢，或通过将陶瓷嵌入到SiO 2粉末中来提供。通过研磨除去在氧化期间形成的表面凹坑（如果有的话）。

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