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11. 外观设计

USD433768S Candle lamp 失效
公开(公告)号：USD433768S
公开(公告)日：2000-11-14
申请号：US120274
申请日：2000-03-17
申请人： Stanley Huang
设计人： Stanley Huang

12. 发明授权

US07560812B2 Cooling module against ESD and electronic package, assembly and system using the same 有权
标题翻译：冷却模块防静电和电子封装，组装和系统使用相同
公开(公告)号：US07560812B2
公开(公告)日：2009-07-14
申请号：US11554046
申请日：2006-10-30
申请人： Kevin Kuo , Stanley Huang , Cheng-Ming Hsu , Neng-An Kuo
发明人： Kevin Kuo , Stanley Huang , Cheng-Ming Hsu , Neng-An Kuo
IPC分类号： H01L23/10 , H01L23/34
CPC分类号： H01L23/60 , H01L23/367 , H01L2224/16225 , H01L2224/32245 , H01L2224/73253 , H01L2924/00011 , H01L2924/00014 , H01L2924/15311 , H01L2924/3025 , H01L2224/0401
摘要： An electronic assembly includes a substrate, a chip, a conductive fence and a heat sink. The substrate has a bonding surface. The chip is bonded to the bonding surface. The conductive fence connects the bonding surface and at least locally surrounds the sides of the chip. The heat sink is disposed over the substrate and contacts the chip and the conductive fence. By disposing the conductive fence between the substrate and the heat sink, the conductive fence and the heat sink can further function as the shields of the chip to reduce any adverse influence of an ESD current on the chip.
摘要翻译：电子组件包括基板，芯片，导电栅栏和散热器。基板具有接合表面。芯片结合到接合表面。导电栅栏连接接合表面，并且至少局部地围绕芯片的侧面。散热器设置在基板上并与芯片和导电栅栏接触。通过将导电栅栏设置在基板和散热片之间，导电栅栏和散热器可进一步起到芯片的屏蔽的作用，以减少ESD电流对芯片的不利影响。

13. 发明授权

US07443686B2 Electronic system 有权
标题翻译：电子系统
公开(公告)号：US07443686B2
公开(公告)日：2008-10-28
申请号：US11285014
申请日：2005-11-23
申请人： Robert Kuo , James Hsyu , Langhans Chang , Stanley Huang
发明人： Robert Kuo , James Hsyu , Langhans Chang , Stanley Huang
IPC分类号： H05K7/20
CPC分类号： H01L23/4006 , G06F1/182 , G06F1/20 , H01L2023/4056 , H01L2023/4062 , H01L2023/4081 , H01L2924/0002 , H05K1/0215 , H05K3/4046 , H01L2924/00
摘要： An electronic system includes a circuit board, a first conducting element, a second conducting element and at least one connecting element. In this case, the circuit board has at least one through hole and at least one grounding unit disposed around the through hole. The first conducting element is disposed on one side of the circuit board, and the second conducting element is disposed on the other side of the circuit board. The connecting element is disposed through the through hole for connecting the first conducting element and the second conducting element.
摘要翻译：电子系统包括电路板，第一导电元件，第二导电元件和至少一个连接元件。在这种情况下，电路板具有至少一个通孔和至少一个布置在通孔周围的接地单元。第一导电元件设置在电路板的一侧，第二导电元件设置在电路板的另一侧。连接元件设置成穿过用于连接第一导电元件和第二导电元件的通孔。

14. 发明授权

US06924215B2 Method of monitoring high tilt angle of medium current implant 失效
标题翻译：监测中等电流植入物高倾角的方法
公开(公告)号：US06924215B2
公开(公告)日：2005-08-02
申请号：US10157558
申请日：2002-05-29
申请人： Hung-Ta Huang , Hsueh-Li Sun , Juinn-Jie Chang , Stanley Huang , Jih-Churng Twu , Tom Tseng
发明人： Hung-Ta Huang , Hsueh-Li Sun , Juinn-Jie Chang , Stanley Huang , Jih-Churng Twu , Tom Tseng
IPC分类号： H01J37/304 , H01L21/66 , H01L21/336 , H01L21/265 , H01L21/331 , H01L21/36 , H01L21/425
CPC分类号： H01L22/20 , H01J37/3045 , H01J2237/31701
摘要： A method of monitoring and adjusting the position of a wafer with respect to an ion beam including setting the position of a wafer holder so that a wafer to be held therein is positioned at a tilt angle of 45 degrees and a twist angle of 45 degrees with respect to the path of an ion beam; positioning a n-type wafer without screen oxide in the wafer holder; implanting boron species into a region of the wafer at 160 KeV and a dose level of 5.0×1013 atoms/cm2; periodically measuring the sheet resistivity of a implanted wafer and readjusting the wafer tilt angle when the sheet resistivity is greater than 30 ohms/square.
摘要翻译：一种监测和调整晶片相对于离子束的位置的方法，包括设置晶片保持器的位置，使得待保持在其中的晶片位于45度的倾斜角度和45度的扭转角度，相对于离子束的路径; 将没有荧光体氧化物的n型晶片定位在晶片保持器中; 在160KeV下将硼物质注入晶片的区域，并且剂量水平为5.0×10 3原子/ cm 2; 周期性地测量植入晶片的片电阻率，并且当片电阻率大于30欧姆/平方时重新调整晶片倾斜角。

15. 外观设计

USD462474S1 Decorative lamp 失效
公开(公告)号：USD462474S1
公开(公告)日：2002-09-03
申请号：US29145925
申请日：2001-07-31
申请人： Stanley Huang
设计人： Stanley Huang

16. 发明申请

US20070147035A1 Direct-type backlight module 有权
标题翻译：直接型背光模组
公开(公告)号：US20070147035A1
公开(公告)日：2007-06-28
申请号：US11636855
申请日：2006-12-11
申请人： Chen-Pin Hung , Stanley Huang , Tzu-Chang Wang
发明人： Chen-Pin Hung , Stanley Huang , Tzu-Chang Wang
IPC分类号： F21V13/14 , F21V7/04
CPC分类号： G02B6/0021 , G02B6/0018
摘要： A direct-type backlight module includes a light-guide plate. The light-guide plate has a first surface and a second surface opposite the first surface. The first surface has at least one first groove. The backlight module may also include at least one light source. The light source corresponds to the first groove so that light emitted from the light source is reflected by the first groove. One or more optical films may be disposed on the first surface of the light-guide plate and a reflector may be disposed below the second surface of the light-guide plate. With the light-guide plate in place, the overall thickness of the backlight module is reduced, and the lamp mura is avoided.
摘要翻译：直接型背光模块包括导光板。导光板具有与第一表面相对的第一表面和第二表面。第一表面具有至少一个第一凹槽。背光模块还可以包括至少一个光源。光源对应于第一凹槽，使得从光源发射的光被第一凹槽反射。一个或多个光学膜可以设置在导光板的第一表面上，反射器可以设置在导光板的第二表面下方。在导光板就位的情况下，背光模块的整体厚度减小，避免了灯泡。

17. 发明申请

US20070035931A1 Electronic system 有权
标题翻译：电子系统
公开(公告)号：US20070035931A1
公开(公告)日：2007-02-15
申请号：US11285014
申请日：2005-11-23
申请人： Robert Kuo , James Hsyu , Langhans Chang , Stanley Huang
发明人： Robert Kuo , James Hsyu , Langhans Chang , Stanley Huang
IPC分类号： H05K7/20
CPC分类号： H01L23/4006 , G06F1/182 , G06F1/20 , H01L2023/4056 , H01L2023/4062 , H01L2023/4081 , H01L2924/0002 , H05K1/0215 , H05K3/4046 , H01L2924/00
摘要： An electronic system includes a circuit board, a first conducting element, a second conducting element and at least one connecting element. In this case, the circuit board has at least one through hole and at least one grounding unit disposed around the through hole. The first conducting element is disposed on one side of the circuit board, and the second conducting element is disposed on the other side of the circuit board. The connecting element is disposed through the through hole for connecting the first conducting element and the second conducting element.
摘要翻译：电子系统包括电路板，第一导电元件，第二导电元件和至少一个连接元件。在这种情况下，电路板具有至少一个通孔和至少一个布置在通孔周围的接地单元。第一导电元件设置在电路板的一侧，第二导电元件设置在电路板的另一侧。连接元件设置成穿过用于连接第一导电元件和第二导电元件的通孔。

18. 外观设计

USD514735S1 Ornamental light 失效
公开(公告)号：USD514735S1
公开(公告)日：2006-02-07
申请号：US29187217
申请日：2003-07-30
申请人： Stanley Huang
设计人： Stanley Huang

19. 发明授权

US5054865A Multi-ocular kaleidoscope 失效
标题翻译：多眼万花筒
公开(公告)号：US5054865A
公开(公告)日：1991-10-08
申请号：US600838
申请日：1990-10-22
申请人： Stanley Huang
发明人： Stanley Huang
IPC分类号： G02B27/08
CPC分类号： G02B27/08
摘要： A multi-ocular kaleidoscope comprised of two transparent, semi-spherical shells connected into a transparent, spherical shell for containing transparent liquid and colored bits of glass or plastic. The two semi-spherical shells have each an internally threaded circular projection on its outer wall at the center and five internally and externally threaded semi-circular projections around its edge. Seven circular projections are thus formed on the outer wall, after the two semi-spherical shells are connected into a spherical shell, respectively for mounting seven pieces of visual tubes which have each three mirrors fastened therein and connected in a triangular structure.
摘要翻译：一种多眼万花筒，由两个透明的半球形壳体组成，透明的球形壳体，用于容纳透明液体和彩色的玻璃或塑料。两个半球形壳体在其外壁上分别具有内螺纹的圆形突起，并且在其边缘周围有五个内外螺纹的半圆形突起。因此，在将两个半球形壳体分别连接到球形壳体中之后，在外壁上形成七个圆形突出部，用于安装七个可视管，其中每个三个镜子被固定在其中并以三角形结构连接。

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