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1. 发明申请

US20070035931A1 Electronic system 有权
标题翻译：电子系统
公开(公告)号：US20070035931A1
公开(公告)日：2007-02-15
申请号：US11285014
申请日：2005-11-23
申请人： Robert Kuo , James Hsyu , Langhans Chang , Stanley Huang
发明人： Robert Kuo , James Hsyu , Langhans Chang , Stanley Huang
IPC分类号： H05K7/20
CPC分类号： H01L23/4006 , G06F1/182 , G06F1/20 , H01L2023/4056 , H01L2023/4062 , H01L2023/4081 , H01L2924/0002 , H05K1/0215 , H05K3/4046 , H01L2924/00
摘要： An electronic system includes a circuit board, a first conducting element, a second conducting element and at least one connecting element. In this case, the circuit board has at least one through hole and at least one grounding unit disposed around the through hole. The first conducting element is disposed on one side of the circuit board, and the second conducting element is disposed on the other side of the circuit board. The connecting element is disposed through the through hole for connecting the first conducting element and the second conducting element.
摘要翻译：电子系统包括电路板，第一导电元件，第二导电元件和至少一个连接元件。在这种情况下，电路板具有至少一个通孔和至少一个布置在通孔周围的接地单元。第一导电元件设置在电路板的一侧，第二导电元件设置在电路板的另一侧。连接元件设置成穿过用于连接第一导电元件和第二导电元件的通孔。

2. 发明申请

US20060040529A1 Main board and fixing component thereof 审中-公开
标题翻译：主板及其固定部件
公开(公告)号：US20060040529A1
公开(公告)日：2006-02-23
申请号：US11036010
申请日：2005-01-18
申请人： Kevin Kuo , James Hsyu , Langhans Chang
发明人： Kevin Kuo , James Hsyu , Langhans Chang
IPC分类号： H01R12/00
CPC分类号： H01R4/64 , H01R12/707 , H05K3/341 , H05K7/142 , H05K2201/0373 , H05K2201/10409 , H05K2201/10598 , Y02P70/613
摘要： A fixing component of a main board comprises a connecting part, a thread-assembling part and a fixing part. The connecting part has a first surface and a second surface, wherein the first surface is disposed opposite to the second surface. The thread-assembling part is disposed on the first surface of the connecting part. The fixing part is disposed on the second surface. The connecting part and the fixing part are disposed on a main board by utilizing DIP technology and SMT.
摘要翻译：主板的固定部件包括连接部件，螺纹组装部件和固定部件。连接部分具有第一表面和第二表面，其中第一表面设置成与第二表面相对。螺纹组装部设置在连接部的第一面上。固定部分设置在第二表面上。连接部分和固定部分通过DIP技术和SMT设置在主板上。

3. 发明授权

US07443686B2 Electronic system 有权
标题翻译：电子系统
公开(公告)号：US07443686B2
公开(公告)日：2008-10-28
申请号：US11285014
申请日：2005-11-23
申请人： Robert Kuo , James Hsyu , Langhans Chang , Stanley Huang
发明人： Robert Kuo , James Hsyu , Langhans Chang , Stanley Huang
IPC分类号： H05K7/20
CPC分类号： H01L23/4006 , G06F1/182 , G06F1/20 , H01L2023/4056 , H01L2023/4062 , H01L2023/4081 , H01L2924/0002 , H05K1/0215 , H05K3/4046 , H01L2924/00
摘要： An electronic system includes a circuit board, a first conducting element, a second conducting element and at least one connecting element. In this case, the circuit board has at least one through hole and at least one grounding unit disposed around the through hole. The first conducting element is disposed on one side of the circuit board, and the second conducting element is disposed on the other side of the circuit board. The connecting element is disposed through the through hole for connecting the first conducting element and the second conducting element.
摘要翻译：电子系统包括电路板，第一导电元件，第二导电元件和至少一个连接元件。在这种情况下，电路板具有至少一个通孔和至少一个布置在通孔周围的接地单元。第一导电元件设置在电路板的一侧，第二导电元件设置在电路板的另一侧。连接元件设置成穿过用于连接第一导电元件和第二导电元件的通孔。

4. 发明申请

US20060024991A1 Connection device with plurality return paths 审中-公开
标题翻译：具有多个返回路径的连接装置
公开(公告)号：US20060024991A1
公开(公告)日：2006-02-02
申请号：US11036116
申请日：2005-01-18
申请人： Kevin Kuo , Langhans Chang
发明人： Kevin Kuo , Langhans Chang
IPC分类号： H01R12/00
CPC分类号： H01R12/716 , H01R12/57 , H01R13/6595
摘要： A connection device with plurality return paths includes a first connection component and a second connection component. The first connection component has a rectangular containing portion, a plurality of first pins and two first ground pads. The first pins are disposed at two long sides of the rectangular containing portion. The first ground pads are disposed at two short sides of the rectangular containing portion. The second connection component has a rectangular protruding portion corresponding to the rectangular containing portion, a plurality of second pins and two second ground pads. The second pins are disposed at two long sides of the rectangular protruding portion. The second ground pads are disposed at two short sides of the rectangular protruding portion. When the rectangular protruding portion is inserted into the rectangular containing portion, each first pin connects to each second pin, and each first ground pad connects to each second ground pad.
摘要翻译：具有多个返回路径的连接装置包括第一连接部件和第二连接部件。第一连接部件具有矩形容纳部分，多个第一引脚和两个第一接地焊盘。第一销布置在矩形容纳部分的两个长边。第一接地焊盘设置在矩形容纳部分的两个短边。第二连接部件具有对应于矩形容纳部分的矩形突起部分，多个第二引脚和两个第二接地焊盘。第二销布置在矩形突出部分的两个长边上。第二接地焊盘设置在矩形突出部分的两个短边。当矩形突起部分插入矩形容纳部分中时，每个第一引脚连接到每个第二引脚，并且每个第一接地焊盘连接到每个第二接地焊盘。

5. 发明申请

US20060023423A1 Expandable heat sink 审中-公开
标题翻译：可扩展散热器
公开(公告)号：US20060023423A1
公开(公告)日：2006-02-02
申请号：US10988593
申请日：2004-11-16
申请人： Kevin Kuo , James Hsyu , Langhans Chang , Robert Kuo
发明人： Kevin Kuo , James Hsyu , Langhans Chang , Robert Kuo
IPC分类号： H05K7/20
CPC分类号： F28F3/02 , F28F2275/14 , H01L23/367 , H01L2924/0002 , H01L2924/00
摘要： An expandable heat sink is used for dissipating heat of a heat source on a main board. The heat sink comprises a main body and an expanded body. The main body comprises a main-body contact surface, which is contacted with the heat source, and a plurality of first fins. The first fins compose a main connecting portion. Furthermore, the expanded body comprises a plurality of second fins and the second fins compose an expanded connecting portion. The expanded connecting portion is removably connected to the main connecting portion.
摘要翻译：可扩展散热器用于散热主板上热源的热量。散热器包括主体和膨胀体。主体包括与热源接触的主体接触表面和多个第一散热片。第一散热片构成主连接部。此外，膨胀体包括多个第二翅片，并且第二翅片构成扩张的连接部分。膨胀的连接部分可拆卸地连接到主连接部分。

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