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11. 发明授权

US07199308B2 Multi-layered printed wiring board 有权
标题翻译：多层印刷线路板
公开(公告)号：US07199308B2
公开(公告)日：2007-04-03
申请号：US10949290
申请日：2004-09-27
申请人： Tohru Ohsaka
发明人： Tohru Ohsaka
IPC分类号： H01R12/04 , H05K1/11
CPC分类号： H05K1/0216 , H05K2201/09336 , H05K2201/09345 , H05K2201/09354
摘要： A multi-layered printed wiring board, capable of securing required wiring density even with a decreased number of wiring layers and reducing radiation noises, has at least three wiring layers each at least having at least one power supply line or a ground line, and another kind of line, the wiring layers each having an outer edge. A ground line is formed at the outer edge of at least one of the wiring layers. A basic power supply line is formed inside the ground line. At least one power supply line extends from the basic power supply line. A plurality of electronic parts are mounted on at least one of the wiring layers. The at least one power supply line is wired to mounting positions of the electronic parts via at least one of the wiring layers.
摘要翻译：即使在布线层数量的减少和辐射噪声减少的情况下，也能够确保所需布线密度的多层印刷布线板具有至少三个至少具有至少一个电源线或接地线的布线层，另外各种线路，各层具有外缘。在至少一个布线层的外边缘处形成接地线。在地线内形成基本电源线。至少一条电源线从基本电源线延伸。多个电子部件安装在至少一个布线层上。所述至少一个电源线通过所述布线层中的至少一个布线到所述电子部件的安装位置。

12. 发明申请

US20050230823A1 Semiconductor device and printed circuit board 失效
标题翻译：半导体器件和印刷电路板
公开(公告)号：US20050230823A1
公开(公告)日：2005-10-20
申请号：US11094136
申请日：2005-03-31
申请人： Tohru Ohsaka
发明人： Tohru Ohsaka
IPC分类号： H01L23/12 , H01L23/32 , H01L23/48 , H01L23/498 , H01L23/66 , H05K1/02 , H05K1/11 , H05K3/24
CPC分类号： H05K1/0243 , H01L23/49827 , H01L23/66 , H01L24/48 , H01L24/49 , H01L2223/6627 , H01L2224/48091 , H01L2224/48227 , H01L2224/49112 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/15173 , H01L2924/15311 , H01L2924/1903 , H01L2924/3011 , H01L2924/30111 , H05K1/023 , H05K1/112 , H05K3/242 , H05K2201/09227 , H05K2201/0979 , H05K2201/10022 , H05K2201/10734 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： For a multi-terminal semiconductor package, such as a BGA or a CSP, that handles high-speed differential signals, a high-speed signal is assigned to the innermost located electrode pad on an interposer substrate, and the electrode pad is connected to the outermost located ball pad on the interposer substrate. With this arrangement, the length of a plating stub can be considerably reduced, and the adverse affect on a signal waveform can be minimized. This arrangement is especially effective for differential signal lines.
摘要翻译：对于处理高速差分信号的诸如BGA或CSP的多端子半导体封装，将高速信号分配给插入器基板上的最内侧定位的电极焊盘，并且电极焊盘连接到位于内插器基板上的最外侧的球垫。通过这种布置，可以显着地减少电镀短截线的长度，并且可以最小化对信号波形的不利影响。这种布置对于差分信号线特别有效。

13. 发明申请

US20080128873A1 SEMICONDUCTOR DEVICE AND PRINTED CIRCUIT BOARD 失效
标题翻译：半导体器件和印刷电路板
公开(公告)号：US20080128873A1
公开(公告)日：2008-06-05
申请号：US11960161
申请日：2007-12-19
申请人： Tohru Ohsaka
发明人： Tohru Ohsaka
IPC分类号： H01L23/48
CPC分类号： H05K1/0243 , H01L23/49827 , H01L23/66 , H01L24/48 , H01L24/49 , H01L2223/6627 , H01L2224/48091 , H01L2224/48227 , H01L2224/49112 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/15173 , H01L2924/15311 , H01L2924/1903 , H01L2924/3011 , H01L2924/30111 , H05K1/023 , H05K1/112 , H05K3/242 , H05K2201/09227 , H05K2201/0979 , H05K2201/10022 , H05K2201/10734 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： For a multi-terminal semiconductor package, such as a BGA or a CSP, that handles high-speed differential signals, a high-speed signal is assigned to the innermost located electrode pad on an interposer substrate, and the electrode pad is connected to the outermost located ball pad on the interposer substrate. With this arrangement, the length of a plating stub can be considerably reduced, and the adverse affect on a signal waveform can be minimized. This arrangement is especially effective for differential signal lines.
摘要翻译：对于处理高速差分信号的诸如BGA或CSP的多端子半导体封装，将高速信号分配给插入器基板上的最内侧定位的电极焊盘，并且电极焊盘连接到位于内插器基板上的最外侧的球垫。通过这种布置，可以显着地减少电镀短截线的长度，并且可以最小化对信号波形的不利影响。这种布置对于差分信号线特别有效。

14. 发明申请

US20060065965A1 Multi-terminal device and printed wiring board 有权
标题翻译：多终端设备和印刷电路板
公开(公告)号：US20060065965A1
公开(公告)日：2006-03-30
申请号：US11237508
申请日：2005-09-27
申请人： Tohru Ohsaka
发明人： Tohru Ohsaka
IPC分类号： H01L23/48
CPC分类号： H01L23/49838 , H01L23/50 , H01L2924/0002 , H01L2924/15173 , H01L2924/15311 , H01L2924/3011 , H05K1/0237 , H05K1/114 , H05K2201/09227 , H05K2201/09236 , H05K2201/10734 , H01L2924/00
摘要： According to the invention, even when high-speed differential signal pins are arranged on the inner side of a BGA, they can be wired on a printed wiring board at a low cost. In a multi-terminal device (1) having one surface where a large number of connection terminals are arrayed planarly, terminals (3) that need not be electrically connected individually are arranged between differential signal terminals (2) of the multi-terminal device and the periphery of the multi-terminal device.
摘要翻译：根据本发明，即使高速差分信号引脚布置在BGA的内侧，也可以低成本地布线在印刷电路板上。在具有平面排列大量连接端子的一个表面的多端子装置（1）中，不需要电连接的端子（3）分别设置在多端子装置的差分信号端子（2）和多端设备的外围。

15. 发明授权

US06800814B2 Multi-layered printed wiring board 失效
标题翻译：多层印刷线路板
公开(公告)号：US06800814B2
公开(公告)日：2004-10-05
申请号：US10046163
申请日：2002-01-16
申请人： Tohru Ohsaka
发明人： Tohru Ohsaka
IPC分类号： H05K103
CPC分类号： H05K1/0216 , H05K2201/09336 , H05K2201/09345 , H05K2201/09354
摘要： A multi-layered printed wiring board capable of securing required wiring density even with a decreased number of wiring layers and reducing radiation noises. The multi-layered printed wiring board has at least three wiring layers each at least having at least one power supply line or a ground line, and another kind of line, said wiring layers each having an outer edge. A ground line is formed at the outer edge of at least one of the wiring layers. A basic power supply line is formed inside the ground line. At least one power supply line extends from the basic power supply line. A plurality of electronic parts are mounted on at least one of the wiring layers. The at least one power supply line is wired to mounting positions of the electronic parts via at least one of the wiring layers.
摘要翻译：一种多层印刷电路板，即使在布线层数量减少并且减少辐射噪声的情况下也能够确保所需的布线密度。多层印刷电路板具有至少三个布线层，每个布线层至少具有至少一个电源线或接地线，并且另一种线，所述布线层各自具有外边缘。在至少一个布线层的外边缘处形成接地线。在地线内形成基本电源线。至少一条电源线从基本电源线延伸。多个电子部件安装在至少一个布线层上。所述至少一个电源线经由所述布线层中的至少一个布线到所述电子部件的安装位置。

16. 发明授权

US5302798A Method of forming a hole with a laser and an apparatus for forming a hole with a laser 失效
标题翻译：用激光形成孔的方法和用激光形成孔的装置
公开(公告)号：US5302798A
公开(公告)日：1994-04-12
申请号：US860687
申请日：1992-03-30
申请人： Hideo Inagawa , Shigenobu Nojo , Tohru Ohsaka
发明人： Hideo Inagawa , Shigenobu Nojo , Tohru Ohsaka
IPC分类号： B23K26/067 , B23K26/38 , H05K3/00 , B23K26/00
CPC分类号： B23K26/0676 , B23K26/067 , B23K26/382 , B23K26/40 , B23K26/402 , B23K2203/42 , B23K2203/50 , H05K3/0017
摘要： A hole forming method with a laser beam and a hole forming laser apparatus improves the efficiency of hole formation without deterioration in the quality of the formed hole. In a hole forming method for forming holes in a plurality of articles by irradiation with a condensed laser beam, the laser beam is switched in succession to plural working optical axes, thereby forming holes in succession in the articles positioned respectively on the working optical axes.
摘要翻译：具有激光束和孔形成激光装置的孔形成方法提高了孔形成的效率，而不会使形成的孔的质量劣化。在通过照射聚光激光而在多个制品中形成孔的孔形成方法中，激光束被连续地切换成多个工作光轴，从而在分别位于工作光轴上的制品中连续地形成孔。

17. 发明授权

US5215593A Method of introducing liquid into small-diameter hole 失效
标题翻译：将液体引入小口径孔的方法
公开(公告)号：US5215593A
公开(公告)日：1993-06-01
申请号：US691421
申请日：1991-04-25
申请人： Shigenobu Nojo , Hideho Inagawa , Tohru Ohsaka
发明人： Shigenobu Nojo , Hideho Inagawa , Tohru Ohsaka
IPC分类号： B08B3/10 , C23C18/18 , C25D5/34 , C25D21/10 , H05K3/00 , H05K3/26 , H05K3/42
CPC分类号： H05K3/0088 , B08B3/106
摘要： A substrate having a small-diameter hole is taken from the air and placed in a boiling vapor and/or boiling liquid in a first treatment tank of a vessel having a boiling heater, whereupon the pressure of the air in the small-diameter hole exceeds atmospheric pressure by an amount equivalent to the partial pressure of the air in the hole. Accordingly, the air cannot remain in the hole but is instead expelled to the outside. As a result, the interior of the microhole is replaced entirely by the boiling vapor and/or boiling liquid. Next, without being brought into contact with the external air, the substrate is contacted with a non-boiling liquid inside a second treatment tank, thereby preventing external gas from flowing back into the small-diameter. The non-boiling liquid and the boiling vapor and/or boiling liquid are soluble in each other. As a result, the two are unified and introduced to the small-diameter hole in the form of a liquid.
摘要翻译：将具有小直径孔的基板从空气中取出并置于具有沸腾加热器的容器的第一处理槽中的沸腾蒸气和/或沸腾液中，于是小直径孔中的空气压力超过大气压力相当于孔中空气的分压的量。因此，空气不能保留在孔中，而是排出到外部。结果，微孔的内部完全被沸腾的蒸气和/或沸腾的液体所取代。接下来，不与外部空气接触，基板与第二处理槽内的非沸腾液体接触，从而防止外部气体流回小直径。非沸腾液体和沸腾蒸气和/或沸腾液体彼此可溶。结果，两者被统一并以液体形式引入小直径孔。

18. 发明申请

US20060208348A1 Stacked semiconductor package 有权
标题翻译：堆叠半导体封装
公开(公告)号：US20060208348A1
公开(公告)日：2006-09-21
申请号：US11378685
申请日：2006-03-17
申请人： Tohru Ohsaka , Hiroshi Kondo
发明人： Tohru Ohsaka , Hiroshi Kondo
IPC分类号： H01L23/02
CPC分类号： H05K1/141 , H01L24/97 , H01L25/0657 , H01L25/105 , H01L2224/16225 , H01L2224/32145 , H01L2224/48225 , H01L2224/48227 , H01L2224/97 , H01L2225/06568 , H01L2225/1023 , H01L2225/1058 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01082 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H01L2924/30107 , H05K1/0263 , H05K1/145 , H05K3/3436 , H05K2201/10515 , H05K2201/10734 , H01L2924/00 , H01L2224/0401
摘要： In a stacked semiconductor package, since electric power is supplied to a second semiconductor package through a first semiconductor package, a power supply path becomes complicated and fluctuation of its inductance becomes large, whereby power bounce occurs to reduce signal quality and also prevent high speed signal communication. Therefore, according to the present invention, a first solder ball group for joint to a printed wiring board is attached to a second layer of the first semiconductor package, and a second solder ball group for joint to the first semiconductor package and a solder group for power supply for direct joint to the printed wiring board are provided on the second layer of the second semiconductor package, whereby electric power can be directly supplied from the printed wiring board.
摘要翻译：在层叠半导体封装中，由于通过第一半导体封装向第二半导体封装供给电力，电源路径变得复杂，电感的波动变大，因此发生电源反弹以降低信号质量并且还防止高速信号通讯。因此，根据本发明，与第一半导体封装的第二层和第一半导体封装的接合用的第二焊球组和用于与第一半导体封装接合的第二焊球组，用于直接接合到印刷线路板的电源设置在第二半导体封装的第二层上，从而可以从印刷线路板直接供应电力。

19. 发明申请

US20050039947A1 Multi-layered printed wiring board 有权
标题翻译：多层印刷线路板
公开(公告)号：US20050039947A1
公开(公告)日：2005-02-24
申请号：US10949290
申请日：2004-09-27
申请人： Tohru Ohsaka
发明人： Tohru Ohsaka
IPC分类号： H05K1/02 , H05K3/46 , H05K7/06
CPC分类号： H05K1/0216 , H05K2201/09336 , H05K2201/09345 , H05K2201/09354
摘要： A multi-layered printed wiring board is provided that is capable of securing required wiring density even with a decreased number of wiring layers and reducing radiation noises. The multi-layered printed wiring board has at least three wiring layers each at least having at least one power supply line or a ground line, and another kind of line, said wiring layers each having an outer edge. A ground line is formed at the outer edge of at least one of the wiring layers. A basic power supply line is formed inside the ground line. At least one power supply line extends from the basic power supply line. A plurality of electronic parts are mounted on at least one of the wiring layers. The at least one power supply line is wired to mounting positions of the electronic parts via at least one of the wiring layers.
摘要翻译：提供了一种多层印刷电路板，即使在布线层数量减少并且减少辐射噪声的情况下也能够确保所需的配线密度。多层印刷电路板具有至少三个布线层，每个布线层至少具有至少一个电源线或接地线，并且另一种线，所述布线层各自具有外边缘。在至少一个布线层的外边缘处形成接地线。在地线内形成基本电源线。至少一条电源线从基本电源线延伸。多个电子部件安装在至少一个布线层上。所述至少一个电源线经由所述布线层中的至少一个布线到所述电子部件的安装位置。

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