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    • 12. 发明授权
    • Electrically erasable programmable read-only memory with NAND memory
cell structure
    • 具有NAND存储单元结构的电可擦除可编程只读存储器
    • US4996669A
    • 1991-02-26
    • US489967
    • 1990-03-07
    • Tetsuo EndohRiichiro ShirotaMasaki MomodomiTomoharu TanakaFujio MasuokaShigeyoshi Watanabe
    • Tetsuo EndohRiichiro ShirotaMasaki MomodomiTomoharu TanakaFujio MasuokaShigeyoshi Watanabe
    • G11C16/04
    • G11C16/0483
    • An electrically erasable programmable read-only memory with a NAND cell structure has parallel bit lines, and memory cells defining NAND cell blocks, each of which has a series-circuit of memory cell transistors. Each transistor has a floating gate and a control gate. Parallel word lines are connected to the control gates of the cell transistors. The first, second and third intermediate voltages are used in the data write mode: the first voltage is lower than the "H" level voltage and higher than the "L" level voltage; the second and third voltages are higher than the first voltage and lower than the "H" level voltage. Data is written into a selected memory cell transistor of a NAND cell block, by applying the "H" level voltage to a word line connected to the selected transistor, applying the second voltage to the remaining unselected word lines, applying a corresponding bit line associated with the selected transistor with one of the first and third voltages which is selected in accordance with a logic level of the data, and applying unselected bit lines with the third voltage, whereby carriers are moved by tunneling from or to the floating gate of the selected memory cell transistor.
    • 具有NAND单元结构的电可擦除可编程只读存储器具有并行位线,以及限定NAND单元块的存储器单元,每个存储单元具有存储单元晶体管的串联电路。 每个晶体管都有一个浮动栅极和一个控制栅极。 并行字线连接到单元晶体管的控制栅极。 在数据写入模式下使用第一,第二和第三中间电压:第一电压低于“H”电平电压并高于“L”电平电压; 第二和第三电压高于第一电压并低于“H”电平电压。 将数据写入NAND单元块的选定的存储单元晶体管中,通过将“H”电平电压施加到连接到所选晶体管的字线,将第二电压施加到剩余的未选字线,施加相应的位线 其中所选择的晶体管具有根据数据的逻辑电平选择的第一和第三电压中的一个,以及施加具有第三电压的未选择的位线,由此通过隧道从所选择的浮动栅极或者所选择的浮动栅极 存储单元晶体管。
    • 13. 发明授权
    • Semiconductor integrated circuit and method of producing the same
    • 半导体集成电路及其制造方法
    • US08969944B2
    • 2015-03-03
    • US13697905
    • 2011-05-13
    • Tetsuo EndohSeo Moon-Sik
    • Tetsuo EndohSeo Moon-Sik
    • H01L29/792
    • H01L27/11556G11C16/0425G11C16/0433G11C16/0483H01L27/088H01L27/11524H01L27/11551H01L29/42328H01L29/66477H01L29/66825H01L29/7883H01L29/7889
    • Provided is a semiconductor integrated circuit that uses a novel vertical MOS transistor that is free of interference between cells, that enables the short-channel effect to be minimized, that does not have hot electron injection, and that does not require the formation of shallow junction. Also provided is a method of producing the semiconductor integrated circuit. A memory cell 1 in the semiconductor integrated circuit is provided with: a semiconductor pillar 2 that serves as a channel; a floating gate 5 that circumferentially covers the semiconductor pillar 2 via a tunnel insulation layer 6 on the outer circumference of the semiconductor pillar 2; and a control gate 4 that circumferentially covers the semiconductor pillar via an insulating layer 8 on the outer circumference of the semiconductor pillar 2, and that circumferentially covers the floating gate 5 via an insulating layer 7 on the outer circumference of the floating gate.
    • 提供了一种半导体集成电路,其使用在电池之间没有干扰的新颖的垂直MOS晶体管,其能够使短沟道效应最小化,不具有热电子注入,并且不需要形成浅结 。 还提供了一种制造半导体集成电路的方法。 半导体集成电路中的存储单元1设置有:作为通道的半导体柱2; 通过半导体柱2的外周上的隧道绝缘层6周向地覆盖半导体柱2的浮动栅极5; 以及通过半导体柱2的外周上的绝缘层8周向地覆盖半导体柱的控制栅极4,并且经由浮动栅极的外周上的绝缘层7周向地覆盖浮置栅极5。
    • 18. 发明授权
    • Semiconductor memory device
    • 半导体存储器件
    • US5523980A
    • 1996-06-04
    • US364990
    • 1994-12-28
    • Koji SakuiHiroshi NakamuraTomoharu TanakaMasaki MomodomiFujio MasuokaKazunori OhuchiTetsuo Endoh
    • Koji SakuiHiroshi NakamuraTomoharu TanakaMasaki MomodomiFujio MasuokaKazunori OhuchiTetsuo Endoh
    • G11C16/06G11C8/12G11C16/02G11C16/04G11C29/00G11C29/34H01L29/78G11C8/00
    • G11C8/12G11C16/0483
    • A NAND-cell type EEPROM having a plurality of bit lines, a plurality of control gate lines intersecting with the bit lines, and a plurality of memory cells driven by applying a potential to the control gate lines for selectively storing data, supplying data to the bit lines and receiving data therefrom. The memory cells form a plurality of cell units. The memory cells constituting each cell unit are connected in series to one bit line by a common selecting gate transistor. A plurality of data latch circuits are provided on the bit lines, respectively, for storing data to be written into the memory cells selected by the control gate lines. Further, a plurality of selecting gate drivers are provided to correspond to the cell units, respectively, for driving the control gate lines. A row decoder decodes row addresses for driving the selecting gate drivers and the control gate lines. A plurality of block-address latch circuits are provided to correspond to the selecting gate drivers, respectively, for temporarily storing signals derived from a row address by the row decoder, thereby to select at least two of the selecting gate drivers at the same time in order to write data.
    • 具有多个位线的NAND单元型EEPROM,与位线相交的多个控制栅极线,以及通过向控制栅极线施加电位而驱动的多个存储单元,用于选择性地存储数据,向 位线和从其接收数据。 存储单元形成多个单元单元。 构成每个单元单元的存储单元通过公共选择栅极晶体管串联连接到一个位线。 分别在位线上提供多个数据锁存电路,用于存储要写入由控制栅极线选择的存储单元的数据。 此外,分别提供多个选择栅极驱动器以对应于用于驱动控制栅极线的单元单元。 行解码器解码用于驱动选择栅极驱动器和控制栅极线的行地址。 提供多个块地址锁存电路以分别对应于选择栅极驱动器,用于临时存储由行解码器从行地址导出的信号,从而同时选择至少两个选择栅极驱动器 命令写数据。