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    • 15. 发明申请
    • METHOD OF PROCESSING SUBSTRATE BY IMPRINTING
    • 通过印刷加工基板的方法
    • US20090166317A1
    • 2009-07-02
    • US12337155
    • 2008-12-17
    • Shingo OkushimaAtsunori TerasakiJunichi Seki
    • Shingo OkushimaAtsunori TerasakiJunichi Seki
    • C03C15/00
    • G03F7/0002B82Y10/00B82Y40/00
    • A method of processing a substrate includes applying a resin on the substrate, imprinting a pattern of a mold onto the resin, the pattern including protrusions and recesses, forming a protective layer over the resin, etching the protective layer so that the protrusions of the pattern imprinted in the resin are exposed and the protective layer in the recesses of the pattern in the resin remains, etching the exposed protrusions of the pattern, to expose the substrate, while using the protective layer as a mask to prevent areas covered by the protective layer from being etched, so that a reverse pattern is formed on the protective layer, which has a structure reversed from the pattern imprinted on the resin, and etching the exposed substrate, to etch a pattern in the substrate, while using the reverse pattern as a mask to prevent areas covered by the protective layer from being etched.
    • 一种处理基板的方法包括在基板上施加树脂,将模具图案压印在树脂上,图案包括突起和凹陷,在树脂上形成保护层,蚀刻保护层,使得图案的突起 在树脂中印刷,并且树脂中的图案的凹部中的保护层保留,蚀刻图案的露出的突起,露出基板,同时使用保护层作为掩模,以防止被保护层覆盖的区域 从而被蚀刻,使得在保护层上形成反向图案,该保护层具有与印刷在树脂上的图案相反的结构,并蚀刻暴露的基板,以蚀刻基板中的图案,同时使用反向图案作为 掩模以防止被保护层覆盖的区域被蚀刻。