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1. 发明授权

US09039402B2 Imprinting apparatus and method therefor 有权
标题翻译：压印装置及其方法
公开(公告)号：US09039402B2
公开(公告)日：2015-05-26
申请号：US12566513
申请日：2009-09-24
申请人： Eigo Kawakami , Shingo Okushima , Hideki Ina , Junichi Seki , Atsunori Terasaki , Motoki Okinaka
发明人： Eigo Kawakami , Shingo Okushima , Hideki Ina , Junichi Seki , Atsunori Terasaki , Motoki Okinaka
IPC分类号： B29C43/02 , B29C43/00 , B29C43/14 , B82Y10/00 , B82Y40/00 , G03F7/00 , B29C59/02 , B29C43/58
CPC分类号： B29C43/021 , B29C43/003 , B29C43/14 , B29C43/58 , B29C2043/025 , B29C2043/142 , B29C2043/5833 , B29C2059/023 , B82Y10/00 , B82Y40/00 , G03F7/0002
摘要： There is provided an imprinting apparatus that transfers a pattern of a mold to a resin on a substrate, the imprinting apparatus including a deposition mechanism configured to deposit the resin onto the substrate; a first driving mechanism configured to change a relative position, on a plane parallel to the surface of the substrate, of the substrate and the mold; a second driving mechanism configured to change the relative position, on a plane parallel to the surface of the substrate, of the substrate and the deposition mechanism; and a control unit configured to control the deposition mechanism and the driving mechanism so as to perform a resin deposition process of depositing the resin onto the substrate and an imprint process of transferring the pattern of the mold to the resin on the substrate in parallel.
摘要翻译：提供了一种压印装置，其将模具的图案转移到基板上的树脂，所述压印装置包括沉积机构，所述沉积机构被配置为将所述树脂沉积到所述基板上; 第一驱动机构，其构造成在基板的表面平行的平面上改变基板和模具的相对位置; 第二驱动机构，被配置为在与基板的表面平行的平面上改变基板和沉积机构的相对位置; 以及控制单元，被配置为控制沉积机构和驱动机构，以便执行将树脂沉积到基板上的树脂沉积工艺和将模具图案平行地转移到基板上的树脂的压印工艺。

2. 发明授权

US08404169B2 Imprint apparatus and method of manufacturing article 有权
标题翻译：印刷装置及其制造方法
公开(公告)号：US08404169B2
公开(公告)日：2013-03-26
申请号：US12566572
申请日：2009-09-24
申请人： Eigo Kawakami , Hideki Ina , Junichi Seki , Atsunori Terasaki , Shingo Okushima , Motoki Okinaka
发明人： Eigo Kawakami , Hideki Ina , Junichi Seki , Atsunori Terasaki , Shingo Okushima , Motoki Okinaka
IPC分类号： B29B11/08 , B29C45/76
CPC分类号： G03F7/0002 , B82Y10/00 , B82Y40/00 , G03F9/00
摘要： An imprint apparatus for pressing resin and a mold to each other in a Z-axis direction to form a resin pattern on a shot region includes: a mold chuck; an X-Y stage; a reference mark formed on the stage; a first scope configured to measure a positional deviation in an x-y plane between a mold mark and the reference mark; a second scope configured to measure a position of a substrate mark in the plane not via the mold mark; and a dispenser configured to dispense resin. In the plane, the dispenser center is deviated in position from the mold chuck center by a first distance in a first direction, and the second scope center is deviated in position from the dispenser center by a distance smaller than twice the first distance in the first direction or a second direction opposite thereto.
摘要翻译：在Z轴方向上按压树脂和模具以在射出区域形成树脂图案的压印装置包括：模具卡盘; X-Y舞台; 在舞台上形成参考标记; 第一范围，被配置为测量模具标记和参考标记之间的x-y平面中的位置偏差; 第二范围，被配置为不经由模具标记来测量所述平面中的基板标记的位置; 以及配置成分配树脂的分配器。在平面中，分配器中心从第一方向偏离模具卡盘中心第一距离，并且第二范围中心从分配器中心偏离距离小于第一距离的距离的距离方向或与其相反的第二方向。

3. 发明申请

US20090273124A1 NANOIMPRINTING METHOD AND MOLD FOR USE IN NANOIMPRINTING 有权
标题翻译：用于纳米压印的纳米压印方法和模具
公开(公告)号：US20090273124A1
公开(公告)日：2009-11-05
申请号：US12405847
申请日：2009-03-17
申请人： Motoki Okinaka , Junichi Seki , Atsunori Terasaki , Shingo Okushima
发明人： Motoki Okinaka , Junichi Seki , Atsunori Terasaki , Shingo Okushima
IPC分类号： B29C35/08 , B29C59/02
CPC分类号： G03F7/0002 , B82Y10/00 , B82Y40/00
摘要： A nanoimprinting method includes: forming at a region for performing a first nanoimprinting process on a substrate, a first patterning region with a first affinity to resin; forming at a region for performing a second nanoimprinting process on the substrate, a second patterning region with a second affinity to resin, the second affinity being lower than the first affinity; applying the resin to the first patterning region and transferring a pattern of a mold to the resin by the first nanoimprinting process; and modifying the second patterning region to a region with affinity to resin that is higher than the second affinity, then applying the resin to the modified region, and performing the second nanoimprinting process to process the second patterning region thereby connecting patterns formed at the first patterning region and the second patterning region to each other.
摘要翻译：纳米压印方法包括：在用于在衬底上进行第一纳米压印过程的区域上形成第一图案化区域，其对树脂具有第一亲和力; 在用于在所述基板上进行第二纳米压印处理的区域上形成第二图案化区域，所述第二图案形成区域对树脂具有第二亲和力，所述第二亲和力低于所述第一亲和力; 将所述树脂施加到所述第一图案形成区域并通过所述第一纳米压印工艺将模具的图案转移到所述树脂; 并且将所述第二图案形成区域修饰为与所述第二亲和力高于树脂的区域，然后将所述树脂施加到所述改性区域，并进行所述第二纳米压印处理以处理所述第二图案化区域，从而将形成在所述第一图案形成区域和第二图案形成区域彼此。

4. 发明授权

US08361336B2 Imprint method for imprinting a pattern of a mold onto a resin material of a substrate and related substrate processing method 有权
标题翻译：用于将模具图案压印到基板的树脂材料上的印刷方法和相关的基板处理方法
公开(公告)号：US08361336B2
公开(公告)日：2013-01-29
申请号：US12282454
申请日：2008-08-01
申请人： Shingo Okushima , Junichi Seki , Haruhito Ono , Nao Nakatsuji , Atsunori Terasaki
发明人： Shingo Okushima , Junichi Seki , Haruhito Ono , Nao Nakatsuji , Atsunori Terasaki
IPC分类号： B44C1/22
CPC分类号： G03F7/0002 , B29C33/424 , B82Y10/00 , B82Y40/00
摘要： An imprint method for imprinting a pattern of a mold onto a resin material on a substrate. The imprint method includes a step of forming a processed area in which an imprint pattern corresponding to the pattern of the mold is formed, and an outside area formed of a periphery of the processed area, by bringing the mold into contact with the resin material formed on the substrate, so that a portion of the resin material is extruded from the processed area into the outside area, a step of forming a protection layer for protecting the processed area, and a step of removing a layer of the resin material in the outside area, while the imprint pattern formed on a layer of the resin material in the processed area, is protected by the protection layer, so as not to be removed.
摘要翻译：用于将模具图案压印在基板上的树脂材料上的压印方法。压印方法包括通过使模具与形成的树脂材料接触来形成其中形成与模具的图案相对应的压印图案的处理区域和由处理区域的周边形成的外部区域的步骤在基板上，使得一部分树脂材料从处理区域挤出到外部区域中，形成用于保护加工区域的保护层的步骤，以及在外部去除树脂材料层的步骤区域，而在处理区域中形成在树脂材料层上的印模图案被保护层保护，以便不被去除。

5. 发明授权

US08178026B2 Nanoimprinting method and mold for use in nanoimprinting 有权
标题翻译：用于纳米压印的纳米印刷方法和模具
公开(公告)号：US08178026B2
公开(公告)日：2012-05-15
申请号：US12405847
申请日：2009-03-17
申请人： Motoki Okinaka , Junichi Seki , Atsunori Terasaki , Shingo Okushima
发明人： Motoki Okinaka , Junichi Seki , Atsunori Terasaki , Shingo Okushima
IPC分类号： B29C35/08 , B29C59/02
CPC分类号： G03F7/0002 , B82Y10/00 , B82Y40/00
摘要： A nanoimprinting method includes: forming at a region for performing a first nanoimprinting process on a substrate, a first patterning region with a first affinity to resin; forming at a region for performing a second nanoimprinting process on the substrate, a second patterning region with a second affinity to resin, the second affinity being lower than the first affinity; applying the resin to the first patterning region and transferring a pattern of a mold to the resin by the first nanoimprinting process; and modifying the second patterning region to a region with affinity to resin that is higher than the second affinity, then applying the resin to the modified region, and performing the second nanoimprinting process to process the second patterning region thereby connecting patterns formed at the first patterning region and the second patterning region to each other.
摘要翻译：纳米压印方法包括：在用于在衬底上进行第一纳米压印过程的区域上形成第一图案化区域，其对树脂具有第一亲和力; 在用于在所述基板上进行第二纳米压印处理的区域上形成第二图案化区域，所述第二图案形成区域对树脂具有第二亲和力，所述第二亲和力低于所述第一亲和力; 将所述树脂施加到所述第一图案形成区域并通过所述第一纳米压印工艺将模具的图案转移到所述树脂; 并且将所述第二图案形成区域修饰为与所述第二亲和力高于树脂的区域，然后将所述树脂施加到所述改性区域，并进行所述第二纳米压印处理以处理所述第二图案化区域，从而将形成在所述第一图案形成区域和第二图案形成区域彼此。

6. 发明授权

US07981304B2 Process for producing a chip using a mold 有权
标题翻译：使用模具制造芯片的工艺
公开(公告)号：US07981304B2
公开(公告)日：2011-07-19
申请号：US12388179
申请日：2009-02-18
申请人： Atsunori Terasaki , Junichi Seki , Nobuhito Suehira , Hideki Ina , Shingo Okushima
发明人： Atsunori Terasaki , Junichi Seki , Nobuhito Suehira , Hideki Ina , Shingo Okushima
IPC分类号： C03C15/00
CPC分类号： B29C59/00 , B82Y10/00 , B82Y40/00 , G03F7/0002 , G03F7/0017 , G03F9/7042
摘要： A mold capable of a highly accurate alignment with a member to be processed in such a state that a photocurable resin material is disposed between the mold and the member to be processed, and is constituted by a substrate 2010 formed of a first material and an alignment mark 2102 formed of a second material different from the first material. The first material and the second material have transmissivities to light in a part of an ultraviolet wavelength range. The second material has a refractive index of not less than 1.7.
摘要翻译：该模具能够在将待固化的树脂材料设置在模具和待加工构件之间的状态下与要处理的构件高度准确地对准，并且由第一材料和对准构成的基板2010构成标记2102由与第一材料不同的第二材料形成。第一材料和第二材料在紫外线波长范围的一部分中具有透光性。第二种材料的折射率不小于1.7。

7. 发明授权

US07510388B2 Mold, imprint method, and process for producing chip 有权
标题翻译：模具，压印方法和生产芯片的工艺
公开(公告)号：US07510388B2
公开(公告)日：2009-03-31
申请号：US11468876
申请日：2006-08-31
申请人： Atsunori Terasaki , Junichi Seki , Nobuhito Suehira , Hideki Ina , Shingo Okushima
发明人： Atsunori Terasaki , Junichi Seki , Nobuhito Suehira , Hideki Ina , Shingo Okushima
IPC分类号： B29C59/00
CPC分类号： B29C59/00 , B82Y10/00 , B82Y40/00 , G03F7/0002 , G03F7/0017 , G03F9/7042
摘要： A mold capable of effecting alignment of the mold and the member to be processed with high accuracy even in such a state that a photocurable resin material is disposed between the mold and the member to be processed is constituted by a substrate 2010 formed of a first material and an alignment mark 2102 formed of a second material different from the first material. The first material and the second material have transmittivities to light in a part of an ultraviolet wavelength range of the ultraviolet light. The second material has a refractive index of not less than 1.7.
摘要翻译：即使在光固化树脂材料配置在模具和待加工构件之间的状态下，能够高精度地进行模具和被处理部件的对准的模具由基板2010构成，基板2010由第一材料以及由不同于第一材料的第二材料形成的对准标记2102。第一材料和第二材料在紫外线的紫外线波长范围的一部分中具有透光性。第二种材料的折射率不小于1.7。

8. 发明授权

US08562846B2 Process for producing a chip using a mold 有权
标题翻译：使用模具制造芯片的工艺
公开(公告)号：US08562846B2
公开(公告)日：2013-10-22
申请号：US13175071
申请日：2011-07-01
申请人： Atsunori Terasaki , Junichi Seki , Nobuhito Suehira , Hideki Ina , Shingo Okushima
发明人： Atsunori Terasaki , Junichi Seki , Nobuhito Suehira , Hideki Ina , Shingo Okushima
IPC分类号： C03C15/00
CPC分类号： B29C59/00 , B82Y10/00 , B82Y40/00 , G03F7/0002 , G03F7/0017 , G03F9/7042
摘要： A mold capable of a highly accurate alignment with a member to be processed in such a state that a photocurable resin material is disposed between the mold and the member to be processed, and is constituted by a substrate 2010 formed of a first material and an alignment mark 2102 formed of a second material different from the first material. The first material and the second material have transmissivities to light in a part of an ultraviolet wavelength range. The second material has a refractive index of not less than 1.7.
摘要翻译：该模具能够在将待固化的树脂材料设置在模具和待加工构件之间的状态下与要处理的构件高度准确地对准，并且由第一材料和对准构成的基板2010构成标记2102由与第一材料不同的第二材料形成。第一材料和第二材料在紫外线波长范围的一部分中具有透光性。第二种材料的折射率不小于1.7。

9. 发明申请

US20100072664A1 IMPRINT APPARATUS AND METHOD OF MANUFACTURING ARTICLE 有权
标题翻译：印刷装置及其制造方法
公开(公告)号：US20100072664A1
公开(公告)日：2010-03-25
申请号：US12566572
申请日：2009-09-24
申请人： Eigo Kawakami , Hideki Ina , Junichi Seki , Atsunori Terasaki , Shingo Okushima , Motoki Okinaka
发明人： Eigo Kawakami , Hideki Ina , Junichi Seki , Atsunori Terasaki , Shingo Okushima , Motoki Okinaka
IPC分类号： B29C59/02
CPC分类号： G03F7/0002 , B82Y10/00 , B82Y40/00 , G03F9/00
摘要： An imprint apparatus for pressing resin and a mold to each other in a Z-axis direction to form a resin pattern on a shot region includes: a mold chuck; an X-Y stage; a reference mark formed on the stage; a first scope configured to measure a positional deviation in an x-y plane between a mold mark and the reference mark; a second scope configured to measure a position of a substrate mark in the plane not via the mold mark; and a dispenser configured to dispense resin. In the plane, the dispenser center is deviated in position from the mold chuck center by a first distance in a first direction, and the second scope center is deviated in position from the dispenser center by a distance smaller than twice the first distance in the first direction or a second direction opposite thereto.
摘要翻译：在Z轴方向上按压树脂和模具以在射出区域形成树脂图案的压印装置包括：模具卡盘; X-Y舞台; 在舞台上形成参考标记; 第一范围，被配置为测量模具标记和参考标记之间的x-y平面中的位置偏差; 第二范围，被配置为不经由模具标记来测量所述平面中的基板标记的位置; 以及配置成分配树脂的分配器。在平面中，分配器中心从第一方向偏离模具卡盘中心第一距离，并且第二范围中心从分配器中心偏离距离小于第一距离的距离的距离方向或与其相反的第二方向。

10. 发明申请

US20090166317A1 METHOD OF PROCESSING SUBSTRATE BY IMPRINTING 审中-公开
标题翻译：通过印刷加工基板的方法
公开(公告)号：US20090166317A1
公开(公告)日：2009-07-02
申请号：US12337155
申请日：2008-12-17
申请人： Shingo Okushima , Atsunori Terasaki , Junichi Seki
发明人： Shingo Okushima , Atsunori Terasaki , Junichi Seki
IPC分类号： C03C15/00
CPC分类号： G03F7/0002 , B82Y10/00 , B82Y40/00
摘要： A method of processing a substrate includes applying a resin on the substrate, imprinting a pattern of a mold onto the resin, the pattern including protrusions and recesses, forming a protective layer over the resin, etching the protective layer so that the protrusions of the pattern imprinted in the resin are exposed and the protective layer in the recesses of the pattern in the resin remains, etching the exposed protrusions of the pattern, to expose the substrate, while using the protective layer as a mask to prevent areas covered by the protective layer from being etched, so that a reverse pattern is formed on the protective layer, which has a structure reversed from the pattern imprinted on the resin, and etching the exposed substrate, to etch a pattern in the substrate, while using the reverse pattern as a mask to prevent areas covered by the protective layer from being etched.
摘要翻译：一种处理基板的方法包括在基板上施加树脂，将模具图案压印在树脂上，图案包括突起和凹陷，在树脂上形成保护层，蚀刻保护层，使得图案的突起在树脂中印刷，并且树脂中的图案的凹部中的保护层保留，蚀刻图案的露出的突起，露出基板，同时使用保护层作为掩模，以防止被保护层覆盖的区域从而被蚀刻，使得在保护层上形成反向图案，该保护层具有与印刷在树脂上的图案相反的结构，并蚀刻暴露的基板，以蚀刻基板中的图案，同时使用反向图案作为掩模以防止被保护层覆盖的区域被蚀刻。

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