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    • 16. 发明授权
    • Multilayer ceramic package with low-variance embedded resistors
    • 具有低方位嵌入式电阻器的多层陶瓷封装
    • US6100787A
    • 2000-08-08
    • US864300
    • 1997-05-28
    • Rong-Fong HuangRobert A. Burr
    • Rong-Fong HuangRobert A. Burr
    • H01C13/02H01L23/538H05K1/03H05K1/09H05K1/16H05K3/46H01C7/18
    • H01C13/02H01L23/5383H05K1/167H01L2924/0002H01L2924/09701H05K1/0306H05K1/092H05K2201/09672H05K2201/10045H05K2203/1453H05K3/4611H05K3/4629
    • A multilayer electronic component (200) is provided. The component includes a substrate package assembly (202) with a set of stacked insulated sheets of a dielectric ceramic material (204, 206, 208, 210, 212). Also included are a set of embedded resistors (214), each of the embedded resistors including an electrical input port pad (216) and an electrical output port pad (218) provided in layers between the set of stacked insulated sheets. Each of the insulated sheets has a trough (220) of a predetermined length aligned between and transverse to the electrical input port pad (216) and the electrical output port pad (218). The trough (220) reduces the resistance value variability in the multilayer electronic component (200). The trough (220) is substantially filled with a resistive paste material and an internal circuit (222) connects the embedded resistors inside the substrate package assembly (202). A method of forming the substrate package assembly (202) is also provided.
    • 提供了一种多层电子部件(200)。 该组件包括具有介电陶瓷材料(204,206,208,210,212)的一组堆叠的绝缘片的衬底封装组件(202)。 还包括一组嵌入式电阻器(214),每个嵌入式电阻器包括设置在该组堆叠绝缘片材之间的层中的电输入端口衬垫(216)和电输出端口衬垫(218)。 每个绝缘片具有在电输入端口衬垫(216)和电输出端口衬垫(218)之间并且横向于电输入端口衬垫(216)并且横向于电输入端口衬垫(216)的预定长度的槽(220)。 槽(220)降低了多层电子部件(200)中的电阻值变化。 槽(220)基本上被电阻浆料材料填充,并且内部电路(222)连接衬底封装组件(202)内的嵌入式电阻器。 还提供了一种形成衬底封装组件(202)的方法。
    • 19. 发明授权
    • Integration of a receiver front-end in multilayer ceramic integrated circuit technology
    • 将接收机前端集成在多层陶瓷集成电路技术中
    • US06289204B1
    • 2001-09-11
    • US09112733
    • 1998-07-09
    • John EstesRong-Fong HuangRich Kommrusch
    • John EstesRong-Fong HuangRich Kommrusch
    • H04B144
    • H01P1/15
    • A multilayer ceramic integrated circuit module for a receiver front-end of a wireless communication device is provided. The module contains an embedded component portion, which has a plurality of thick film capacitors; a plurality of multilayer capacitors; and a plurality of transmission lines deposited internal to the multilayer ceramic integrated circuit module to interconnect the plurality of thick film capacitors and the plurality of multilayer capacitors. The module also contains a mounted component portion, which has a pair of pin diodes; a transistor and a plurality of resistors coupled thereto, for controlling the bias of the pair of pin diodes; and a low-noise-amplifier. The module reduces the size and weight of wireless devices and combines multiple functions into a highly integrated device.
    • 提供了一种用于无线通信设备的接收机前端的多层陶瓷集成电路模块。 该模块包含嵌入式组件部分,其具有多个厚膜电容器; 多层叠层电容器; 以及沉积在多层陶瓷集成电路模块内部的多个传输线,以互连多个厚膜电容器和多个多层电容器。 该模块还包含一个安装的组件部分,它具有一对pin二极管; 晶体管和耦合到其上的多个电阻器,用于控制所述一对pin二极管的偏置; 和低噪声放大器。 该模块降低了无线设备的尺寸和重量,并将多种功能组合到高度集成的设备中。
    • 20. 发明授权
    • Dielectric ceramic composition
    • 介电陶瓷组合物
    • US06242376B1
    • 2001-06-05
    • US09399978
    • 1999-09-21
    • Jeffrey Richard JacquinRong Fong HuangRandy Elvin Rose
    • Jeffrey Richard JacquinRong Fong HuangRandy Elvin Rose
    • C04B35478
    • C04B35/111C04B35/478
    • An alumina based dielectric ceramic composition comprising a base material and an additive material. The base material is represented by the general formula (x) Al2O3+(y) TiO2 wherein x and y are percentages of the total weight of the base material, and x is in the range of about 60 to about 96, more preferably about 94 to about 96, and y is in the range of about 4 to about 40, more preferably about 4 to about 6. In one embodiment the additive material comprises Nb2O5. In a second embodiment the additive material further comprises at least one additional component selected from the group consisting of BaCO3, SnO2, Mn2O3, MnCO3, Mg(OH)2, and Y2O3. The composition requires a relatively lower peak soak temperature (as compared to conventional alumina ceramics) of about 1320 to about 1400° C., more optimally about 1350 to about 1370° C., and is particularly suited for use in high frequency applications. The resulting sintered compositions exhibit a low dielectric constant (about 10 to about 12, more preferably about 11.5 to about 12); a high Q factor (about 10,000 to about 55,000, more preferably about 30,000 to about 50,000); a low temperature coefficient (about −30 to about 30 ppm/° C., more preferably about −3 to about 1); and a high percent fired density (about 95 to about 100, more preferably about 98.33 to about 99.20).
    • 一种氧化铝基介电陶瓷组合物,其包含基材和添加剂材料。 基材由通式(x)Al 2 O 3 +(y)TiO 2表示,其中x和y是基材的总重量的百分比,x在约60至约96的范围内,更优选约94至 约96,y在约4至约40,更优选约4至约6的范围内。在一个实施方案中,添加剂材料包含Nb 2 O 5。 在第二实施方案中,添加剂材料还包含至少一种选自由BaCO 3,SnO 2,Mn 2 O 3,MnCO 3,Mg(OH)2和Y 2 O 3组成的组的另外的组分。 该组合物需要约1320至约1400℃的相对较低的峰值浸泡温度(与常规氧化铝陶瓷相比),更优选约1350至约1370℃,并且特别适用于高频应用。 所得烧结组合物表现出低介电常数(约10至约12,更优选约11.5至约12); 高Q因子(约10,000至约55,000,更优选约30,000至约50,000); 低温度系数(约-30至约30ppm /℃,更优选约-3至约1); 和高百分比燃烧密度(约95至约100,更优选约98.33至约99.20)。