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11. 发明授权

US06791194B1 Circuit tape having adhesive film, semiconductor device, and a method for manufacturing the same 失效
标题翻译：具有粘合膜的电路带，半导体器件及其制造方法
公开(公告)号：US06791194B1
公开(公告)日：2004-09-14
申请号：US09493210
申请日：2000-01-28
申请人： Akira Nagai , Shuji Eguchi , Masahiko Ogino , Masanori Segawa , Toshiak Ishii , Nobutake Tsuyuno , Hiroyoshi Kokaku , Rie Hattori , Makoto Morishima , Ichiro Anjoh , Kunihiro Tsubosaki , Chuichi Miyazaki , Makoto Kitano , Mamoru Mita , Norio Okabe
发明人： Akira Nagai , Shuji Eguchi , Masahiko Ogino , Masanori Segawa , Toshiak Ishii , Nobutake Tsuyuno , Hiroyoshi Kokaku , Rie Hattori , Makoto Morishima , Ichiro Anjoh , Kunihiro Tsubosaki , Chuichi Miyazaki , Makoto Kitano , Mamoru Mita , Norio Okabe
IPC分类号： H01L2348
CPC分类号： H01L24/50 , H01L23/3107 , H01L23/4951 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/10329 , H01L2924/15153 , H01L2924/15165 , H01L2924/181 , H01L2924/30107 , H01L2924/351 , H01L2924/00
摘要： A semiconductor device having a superior connection reliability is obtained by providing a buffer body for absorbing the difference of thermal expansion between the mounting substrate and the semiconductor element in a semiconductor package structure, even if an organic material is used for mounting substrate. A film material is used as the body for buffering the thermal stress generated by the difference in thermal expansion between the mounting substrate and the semiconductor element. The film material has modulus of elasticity of at least 1 MPa in the reflow temperature range (200-250° C.).
摘要翻译：通过在半导体封装结构中设置用于吸收安装基板和半导体元件之间的热膨胀差的缓冲体，即使使用有机材料来安装基板，也可获得具有优异的连接可靠性的半导体器件。使用薄膜材料作为用于缓冲由安装基板和半导体元件之间的热膨胀差异产生的热应力的本体。膜材料在回流温度范围（200-250℃）中的弹性模量至少为1MPa。

12. 发明申请

US20110075334A1 Transmission Control Apparatus and Mechanically and Electrically Integrated Type Electronic Control Apparatus 失效
标题翻译：传动控制装置及机电一体型电子控制装置
公开(公告)号：US20110075334A1
公开(公告)日：2011-03-31
申请号：US12831737
申请日：2010-07-07
申请人： Nobutake TSUYUNO , Itaru TANABE , Toshiaki ISHII , Hiroshi KAMEYAMA
发明人： Nobutake TSUYUNO , Itaru TANABE , Toshiaki ISHII , Hiroshi KAMEYAMA
IPC分类号： H05K7/00 , H05K13/00
CPC分类号： H05K5/0034 , H05K3/202 , H05K2201/0969 , H05K2201/10409 , H05K2201/10598 , Y10T29/49002
摘要： An object of the present invention is to provide a mechanically and electrically integrated type electronic control apparatus which can be embedded in a compact mechanical part, and has a compact structure while having a high wiring freedom, a high heat dissipation and a high reliability. In a mechanically and electrically integrated type electronic control apparatus provided with a control signal generating part, and an angular wiring member connecting the control signal generating part and a controlled part controlled by a control signal of the control signal generating part, installed within a conductive casing, at least the wiring member has a fixed hole, a surface including the fixed hole is coated in an insulative manner, and the fixed hole is fixed to the conductive casing mechanically while keeping an insulating property.
摘要翻译：本发明的目的是提供一种可以嵌入在紧凑的机械部件中的机电一体型的电子控制装置，并且具有紧凑的结构，同时具有高布线自由度，高散热和高可靠性。在具有控制信号生成部件的机电一体化型电子控制装置中，以及连接控制信号生成部和被控制信号生成部的控制信号控制的受控部的角配线部件，至少布线构件具有固定孔，包括固定孔的表面以绝缘的方式被涂覆，并且固定孔在保持绝缘性的同时机械地固定到导电壳体上。

13. 发明申请

US20090086437A1 ELECTRONIC CONTROL DEVICE USING LC MODULE STRUCTURE 失效
标题翻译：使用LC模块结构的电子控制装置
公开(公告)号：US20090086437A1
公开(公告)日：2009-04-02
申请号：US12190624
申请日：2008-08-13
申请人： Nobutake Tsuyuno , Hideto Yoshinari , Hiroshi Hozoji , Masahiko Asano , Masahide Harada , Shinya Kawakita
发明人： Nobutake Tsuyuno , Hideto Yoshinari , Hiroshi Hozoji , Masahiko Asano , Masahide Harada , Shinya Kawakita
IPC分类号： H05K5/04 , H05K7/20 , H05K13/00
CPC分类号： H05K7/20454 , H05K1/0203 , H05K1/141 , H05K7/20854 , H05K2201/10015 , H05K2201/1003 , H05K2201/10189 , H05K2201/10303 , H05K2201/1056 , Y10T29/49147
摘要： In an electronic control device that includes two or more kinds of lead-insertion-type parts, including at least a coil and a capacitor, the parts are installed on a support that has a wiring, a terminal structure and mechanically fixing portions; the leads of the above parts are respectively inserted in and electrically connected to holes formed in the wiring portion of the support; the parts and the support are fixed to each other with an adhesion material for fixation; the upper surfaces of the parts are attached to a metallic chasis with a thermally conductive material of a low elasticity modulus interposed in between; the mechanically fixing portions of the support are fixed to the metallic chasis; and the terminal structure of the support is electrically connected to a circuit board that mounts at least a controlling element.
摘要翻译：在包括至少包括线圈和电容器的两种或更多种引线插入型部件的电子控制装置中，将部件安装在具有布线，端子结构和机械固定部分的支撑件上; 上述部件的引线分别插入形成在支撑体的布线部分中的孔并与其电连接; 部件和支撑件用粘合材料固定在一起，用于固定; 部件的上表面附着在介于其间的具有低弹性模量的导热材料的金属凹槽; 支撑体的机械固定部分固定在金属凹槽上; 并且支撑件的端子结构电连接到安装至少一个控制元件的电路板。

14. 发明申请

US20080294324A1 Engine Control Unit 有权
标题翻译：发动机控制单元
公开(公告)号：US20080294324A1
公开(公告)日：2008-11-27
申请号：US12126504
申请日：2008-05-23
申请人： Hideto Yoshinari , Yujiro Kaneko , Masahiko Asano , Nobutake Tsuyuno , Takehide Yokozuka
发明人： Hideto Yoshinari , Yujiro Kaneko , Masahiko Asano , Nobutake Tsuyuno , Takehide Yokozuka
IPC分类号： F02D45/00 , H05K7/20
CPC分类号： F02D41/20 , F02D41/3005 , F02D2041/2006 , F02D2400/18 , H01L25/162 , H01L25/165 , H01L2924/0002 , H01L2924/00
摘要： An engine control unit for controlling an automobile engine, which is equipped with a booster circuit for boosting the voltage of battery power source, an injector driving circuit for driving an injector by making use of a boosted high voltage, and a microcomputer for controlling the engine; wherein the engine control unit is featured in that an LC module mounted with a booster coil constituting the booster circuit and with an electrolytic capacitor, a power module mounted with a rectifying device constituting the booster circuit and the injector driving circuit and with a switching device, and a control circuit board mounted with the microcomputer and with a connector acting as an interface for an external member of the engine control unit are laminated each other. The power module is partitioned into at least two portions and fixedly contacted, through a heat radiation part, with a housing cover, and heat radiation fins are arranged on an outer surface of the housing cover where the power module is disposed.
摘要翻译：一种用于控制汽车发动机的发动机控制单元，其配备有用于升压电池电源的电压的升压电路，通过利用升压高压驱动喷射器的喷射器驱动电路和用于控制发动机的微型计算机 ; 其特征在于，安装有构成升压电路的升压线圈和电解电容器的LC模块，安装有构成升压电路的整流装置的电源模块和喷射器驱动电路以及开关装置，并且安装有微型计算机的控制电路板和用作发动机控制单元的外部构件的接口的连接器彼此层叠。功率模块被分隔成至少两个部分，并通过散热部分与壳体盖固定接触，并且散热翅片布置在壳体盖的设置功率模块的外表面上。

15. 发明授权

US07202570B2 Circuit tape having adhesive film semiconductor device and a method for manufacturing the same 失效
标题翻译：具有粘合膜半导体器件的电路带及其制造方法
公开(公告)号：US07202570B2
公开(公告)日：2007-04-10
申请号：US10724092
申请日：2003-12-01
申请人： Akira Nagai , Shuji Eguchi , Masahiko Ogino , Masanori Segawa , Toshiak Ishii , Nobutake Tsuyuno , Hiroyoshi Kokaku , Rie Hattori , Makoto Morishima , Ichiro Anjoh , Kunihiro Tsubosaki , Chuichi Miyazaki , Makoto Kitano , Mamoru Mita , Norio Okabe
发明人： Akira Nagai , Shuji Eguchi , Masahiko Ogino , Masanori Segawa , Toshiak Ishii , Nobutake Tsuyuno , Hiroyoshi Kokaku , Rie Hattori , Makoto Morishima , Ichiro Anjoh , Kunihiro Tsubosaki , Chuichi Miyazaki , Makoto Kitano , Mamoru Mita , Norio Okabe
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40 , H01L21/44 , H01L21/48 , B32B3/06 , B32B7/12
CPC分类号： H01L24/06 , H01L23/3107 , H01L23/4951 , H01L2224/0401 , H01L2224/04042 , H01L2224/05553 , H01L2224/06136 , H01L2224/48 , H01L2224/48091 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/014 , H01L2924/10329 , H01L2924/12042 , H01L2924/15311 , H01L2924/1532 , H01L2924/30107 , H01L2924/351 , Y10T156/107 , Y10T428/249955 , Y10T428/28 , Y10T428/2848 , H01L2924/00014 , H01L2924/00
摘要： A semiconductor device having a superior connection reliability is obtained by providing a buffer body for absorbing the difference of thermal expansion between the mounting substrate and the semiconductor element in a semiconductor package structure, even if an organic material is used for the mounting substrate. A film material is used as the body for buffering the thermal stress generated by the difference in thermal expansion between the mounting substrate and the semiconductor element. The film material has modulus of elasticity of at least 1 MPa in the reflow temperature range (200–250° C.).
摘要翻译：具有优异的连接可靠性的半导体器件通过在半导体封装结构中设置用于吸收安装基板和半导体元件之间的热膨胀差的缓冲体，即使将有机材料用于安装基板也是可以获得的。使用薄膜材料作为用于缓冲由安装基板和半导体元件之间的热膨胀差异产生的热应力的本体。膜材料在回流温度范围（200-250℃）中的弹性模量至少为1MPa。

16. 发明授权

US06888230B1 Semiconductor device, semiconductor wafer, semiconductor module, and a method of manufacturing semiconductor device 失效
标题翻译：半导体装置，半导体晶片，半导体模块以及半导体装置的制造方法
公开(公告)号：US06888230B1
公开(公告)日：2005-05-03
申请号：US09429297
申请日：1999-10-28
申请人： Masahiko Ogino , Takumi Ueno , Shuji Eguchi , Akira Nagai , Toshiya Satoh , Toshiaki Ishii , Hiroyoshi Kokaku , Tadanori Segawa , Nobutake Tsuyuno , Asao Nishimura , Ichiro Anjoh
发明人： Masahiko Ogino , Takumi Ueno , Shuji Eguchi , Akira Nagai , Toshiya Satoh , Toshiaki Ishii , Hiroyoshi Kokaku , Tadanori Segawa , Nobutake Tsuyuno , Asao Nishimura , Ichiro Anjoh
IPC分类号： H01L23/12 , H01L21/301 , H01L21/46 , H01L21/48 , H01L21/50 , H01L21/60 , H01L23/28 , H01L23/31 , H01L23/50 , H01L23/52 , H01L29/40
CPC分类号： H01L23/3171 , H01L23/3114 , H01L23/3164 , H01L24/45 , H01L24/48 , H01L2224/05001 , H01L2224/05008 , H01L2224/05026 , H01L2224/05569 , H01L2224/05571 , H01L2224/1147 , H01L2224/16 , H01L2224/32225 , H01L2224/45144 , H01L2224/48227 , H01L2224/73265 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/01322 , H01L2924/12042 , H01L2924/12044 , H01L2924/15311 , H01L2924/181 , H01L2924/30107 , H01L2924/3025 , H01L2924/00 , H01L2224/05599 , H01L2224/05144 , H01L2224/05147 , H01L2924/00012
摘要： Semiconductor devices, semiconductor wafers, and semiconductor modules are provided, wherein: the semiconductor device has a small warp; damage at the chip edge and cracks occurring in a dropping test are scarcely generated; and the semiconductor device is superior in mounting reliability and mass producibility. The semiconductor includes a semiconductor chip 64; a porous stress relaxing layer 3 provided on the plane, whereon circuits and electrodes are formed, of the semiconductor chip; a circuit layer 2 provided on the stress relaxing layer and connected to the electrodes; and external terminals 10 provided on the circuit layer; wherein an organic protecting film 7 is formed on the plane, opposite to the stress relaxing layer, of the semiconductor chip, and respective side planes of the stress relaxing layer, the semiconductor chip 6, and the protecting film 7 are exposed outside on the same plane.
摘要翻译：提供半导体器件，半导体晶片和半导体模块，其中：半导体器件具有小的翘曲; 几乎不产生芯片边缘的损伤和在滴下试验中发生的裂纹; 半导体装置的安装可靠性和大规模生产性优异。该半导体包括半导体芯片64; 设置在半导体芯片的形成有电路和电极的平面上的多孔应力缓和层3; 设置在应力缓和层上并与电极连接的电路层2; 和设置在电路层上的外部端子10; 其中在半导体芯片的与应力缓和层相反的平面上形成有机保护膜7，并且应力缓和层，半导体芯片6和保护膜7的各个侧面在外部暴露在外部飞机

17. 发明授权

US08952525B2 Semiconductor module and method for manufacturing semiconductor module 有权
标题翻译：半导体模块及半导体模块制造方法
公开(公告)号：US08952525B2
公开(公告)日：2015-02-10
申请号：US13983291
申请日：2011-03-04
申请人： Eiichi Ide , Takeshi Tokuyama , Nobutake Tsuyuno , Kinya Nakatsu , Tokihito Suwa , Yuujiro Kaneko
发明人： Eiichi Ide , Takeshi Tokuyama , Nobutake Tsuyuno , Kinya Nakatsu , Tokihito Suwa , Yuujiro Kaneko
IPC分类号： H01L23/367 , H01L21/52 , H01L23/36 , H01L23/42 , H01L23/495 , H01L23/433 , H01L23/31 , H01L23/00 , H01L23/373
CPC分类号： H01L23/3675 , H01L21/52 , H01L23/3107 , H01L23/36 , H01L23/3735 , H01L23/42 , H01L23/433 , H01L23/473 , H01L23/49575 , H01L24/32 , H01L24/33 , H01L24/40 , H01L24/45 , H01L24/48 , H01L24/73 , H01L25/072 , H01L2224/32245 , H01L2224/33 , H01L2224/33181 , H01L2224/40137 , H01L2224/40247 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/73221 , H01L2224/73265 , H01L2924/014 , H01L2924/13055 , H01L2924/13091 , H01L2924/181 , H01L2924/30107 , H01L2924/3025 , H05K7/20927 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A semiconductor module includes a case including a receiving space that is formed by a frame portion and a pair of wall portions disposed to face each other with the frame portion therebetween. The wall portion includes a heat-dissipation portions and a support wall that supports the heat-dissipation portions at the frame portion, and the wall portion includes a heat-dissipation portion and a support wall that supports the heat-dissipation portion at the frame portion. The heat-dissipation portions provided at the wall portion are separately provided by being disposed to face a plurality of semiconductor device blocks respectively. A plurality of separate heat-dissipation portions is surrounded by the support wall, the support wall is deformed to recessed from the frame portion through the separate heat-dissipation portions inside the case such that a plurality of insulating sheets is closely joined to a plurality of lead frames and the plurality of heat-dissipation portions.
摘要翻译：半导体模块包括壳体，该壳体包括由框架部分形成的容纳空间以及设置成彼此面对的壁对部分。壁部包括散热部和在框架部分处支撑散热部的支撑壁，壁部包括散热部和支撑壁，该支撑壁在框架部分处支撑散热部。设置在壁部的散热部分别设置成面对多个半导体器件块。多个单独的散热部被支撑壁包围，支撑壁变形为通过壳体内部的分离的散热部从框架部分凹陷，使得多个绝缘片紧密接合到多个引线框架和多个散热部分。

18. 发明授权

US08847374B2 Power semiconductor module and manufacturing method thereof 有权
标题翻译：功率半导体模块及其制造方法
公开(公告)号：US08847374B2
公开(公告)日：2014-09-30
申请号：US13818490
申请日：2011-09-05
申请人： Eiichi Ide , Shinji Hiramitsu , Hiroshi Hozoji , Nobutake Tsuyuno , Kinya Nakatsu , Takeshi Tokuyama , Akira Matsushita , Yusuke Takagi
发明人： Eiichi Ide , Shinji Hiramitsu , Hiroshi Hozoji , Nobutake Tsuyuno , Kinya Nakatsu , Takeshi Tokuyama , Akira Matsushita , Yusuke Takagi
IPC分类号： H01L23/06 , H01L21/48 , H01L23/495 , H01L23/36 , H01L23/34 , H01L23/00 , H01L23/433 , H01L23/492 , H01L25/18 , H01L25/07
CPC分类号： H01L23/34 , H01L21/4825 , H01L23/36 , H01L23/4334 , H01L23/473 , H01L23/492 , H01L23/49524 , H01L23/49575 , H01L24/29 , H01L24/33 , H01L24/35 , H01L24/37 , H01L24/40 , H01L24/83 , H01L24/84 , H01L25/072 , H01L25/18 , H01L2224/29111 , H01L2224/32245 , H01L2224/32503 , H01L2224/33 , H01L2224/33181 , H01L2224/3521 , H01L2224/37013 , H01L2224/37124 , H01L2224/37147 , H01L2224/37639 , H01L2224/37644 , H01L2224/37655 , H01L2224/40137 , H01L2224/48091 , H01L2224/4847 , H01L2224/48472 , H01L2224/73265 , H01L2224/83801 , H01L2224/84801 , H01L2924/00014 , H01L2924/1203 , H01L2924/13055 , H01L2924/13091 , H01L2924/181 , H01L2924/30107 , H01L2924/351 , H01L2924/00 , H01L2924/1306 , H01L2924/1305 , H01L2924/00012 , H01L2224/45099 , H01L2224/05599 , H01L2924/01047 , H01L2924/01029
摘要： A power semiconductor module includes a power semiconductor element formed with a plurality of control electrodes on one main surface, a first conductor plate bonded by way of a first solder material to one of the main surfaces of the power semiconductor element, and a second conductor plate bonded by way of a second solder material on the other main surface of the power semiconductor element. A first protrusion section protruding from the base section of the applicable first conductor plate and including a first protrusion surface formed over the upper side, is formed over the first conductor plate. A second protrusion section including a second protrusion surface formed facing opposite one of the main surfaces of the power semiconductor element. The first solder material is interposed between the power semiconductor element and the first conductor plate while avoiding the plural control electrodes. If there is an projection from a perpendicular direction by one of the main surfaces of the power semiconductor element, the second protrusion section is formed so that the projecting section on a specified side of the second protrusion surface overlaps the projecting section of the step section formed between the base section of the first conductor plate and the first protrusion section. The plural control electrodes on the power semiconductor element are formed along the specified side of the second protrusion surface.
摘要翻译：功率半导体模块包括在一个主表面上形成有多个控制电极的功率半导体元件，通过第一焊料材料连接到功率半导体元件的主表面之一的第一导体板和第二导体板通过第二焊料材料在功率半导体元件的另一个主表面上接合。在第一导体板上形成有从可应用的第一导体板的基部突出并且包括形成在上侧的第一突起表面的第一突出部。第二突起部分，包括形成在与功率半导体元件的主表面相对的一个表面上的第二突起表面。第一焊料材料插入在功率半导体元件和第一导体板之间，同时避免多个控制电极。如果通过功率半导体元件的一个主面从垂直方向突出，则第二突起部形成为使得第二突起表面的特定侧的突出部与形成的台阶部的突出部重叠在第一导体板的基部与第一突起部之间。功率半导体元件上的多个控制电极沿第二突出面的规定侧形成。

19. 发明申请

US20140197532A1 Semiconductor Module and Method for Manufacturing Semiconductor Module 有权
标题翻译：半导体模块和半导体模块制造方法
公开(公告)号：US20140197532A1
公开(公告)日：2014-07-17
申请号：US13983291
申请日：2011-03-04
申请人： Eiichi Ide , Takeshi Tokuyama , Nobutake Tsuyuno , Kinya Nakatsu , Tokihito Suwa , Yuujiro Kaneko
发明人： Eiichi Ide , Takeshi Tokuyama , Nobutake Tsuyuno , Kinya Nakatsu , Tokihito Suwa , Yuujiro Kaneko
IPC分类号： H01L23/367 , H01L21/52
CPC分类号： H01L23/3675 , H01L21/52 , H01L23/3107 , H01L23/36 , H01L23/3735 , H01L23/42 , H01L23/433 , H01L23/473 , H01L23/49575 , H01L24/32 , H01L24/33 , H01L24/40 , H01L24/45 , H01L24/48 , H01L24/73 , H01L25/072 , H01L2224/32245 , H01L2224/33 , H01L2224/33181 , H01L2224/40137 , H01L2224/40247 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/73221 , H01L2224/73265 , H01L2924/014 , H01L2924/13055 , H01L2924/13091 , H01L2924/181 , H01L2924/30107 , H01L2924/3025 , H05K7/20927 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A semiconductor module includes a case including a receiving space that is formed by a frame portion and a pair of wall portions disposed to face each other with the frame portion therebetween. The wall portion includes a heat-dissipation portions and a support wall that supports the heat-dissipation portions at the frame portion, and the wall portion includes a heat-dissipation portion and a support wall that supports the heat-dissipation portion at the frame portion. The heat-dissipation portions provided at the wall portion are separately provided by being disposed to face a plurality of semiconductor device blocks respectively. A plurality of separate heat-dissipation portions is surrounded by the support wall, the support wall is deformed to recessed from the frame portion through the separate heat-dissipation portions inside the case such that a plurality of insulating sheets is closely joined to a plurality of lead frames and the plurality of heat-dissipation portions.
摘要翻译：半导体模块包括壳体，该壳体包括由框架部分形成的容纳空间以及设置成彼此面对的壁对部分。壁部包括散热部和在框架部分处支撑散热部的支撑壁，壁部包括散热部和支撑壁，该支撑壁在框架部分处支撑散热部。设置在壁部的散热部分别设置成面对多个半导体器件块。多个单独的散热部被支撑壁包围，支撑壁变形为通过壳体内部的分离的散热部从框架部分凹陷，使得多个绝缘片紧密接合到多个引线框架和多个散热部分。

20. 发明授权

US08653652B2 Semiconductor device, power semiconductor module and power conversion device equipped with power semiconductor module 有权
标题翻译：半导体器件，功率半导体模块和功率转换器件配备功率半导体模块
公开(公告)号：US08653652B2
公开(公告)日：2014-02-18
申请号：US13499520
申请日：2010-08-24
申请人： Takeshi Tokuyama , Kinya Nakatsu , Ryuichi Saito , Toshiya Satoh , Hideaki Ishikawa , Nobutake Tsuyuno , Shigeo Amagi
发明人： Takeshi Tokuyama , Kinya Nakatsu , Ryuichi Saito , Toshiya Satoh , Hideaki Ishikawa , Nobutake Tsuyuno , Shigeo Amagi
IPC分类号： H01L23/34
CPC分类号： H02M7/003 , H01L23/473 , H01L23/49562 , H01L23/49575 , H01L24/34 , H01L25/072 , H01L2224/33 , H01L2224/48247 , H01L2224/48472 , H01L2224/73265 , H01L2224/83801 , H01L2224/8384 , H01L2224/84801 , H01L2224/8484 , H01L2924/00014 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/181 , H01L2924/30107 , H01L2924/3025 , H05K7/1432 , H01L2924/00 , H01L2924/00012 , H01L2224/37099
摘要： A semiconductor device includes: a case with an opening formed thereat; a semiconductor element housed inside the case; a first conductor plate housed inside the case and positioned at one surface side of the semiconductor element; a second conductor plate housed inside the case and positioned at another surface side of the semiconductor element; a positive bus bar electrically connected to the first conductor plate, through which DC power is supplied; a negative bus bar electrically connected to the second conductor plate, through which DC power is supplied; a first resin member that closes off the opening at the case; and a second resin member that seals the semiconductor element, the first conductor plate and the second conductor plate and is constituted of a material other than a material constituting the first resin member.
摘要翻译：一种半导体器件包括：形成有开口的壳体; 容纳在壳体内的半导体元件; 容纳在壳体内并位于半导体元件的一个表面侧的第一导体板; 第二导体板，容纳在所述壳体内并且位于所述半导体元件的另一表面侧; 电连接到第一导体板的正母线，通过其提供直流电力; 电连接到第二导体板的负母线，通过其提供直流电力; 封闭壳体上的开口的第一树脂构件; 以及第二树脂构件，其密封半导体元件，第一导体板和第二导体板，并且由构成第一树脂构件的材料以外的材料构成。

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