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    • 14. 发明授权
    • DRAM cell arrangement
    • DRAM单元布置
    • US6097049A
    • 2000-08-01
    • US272077
    • 1999-03-18
    • Bernd GoebelEve Marie MartinEmmerich Bertagnolli
    • Bernd GoebelEve Marie MartinEmmerich Bertagnolli
    • H01L21/8242H01L27/108H01L29/76
    • H01L27/10852H01L27/10823H01L27/10876Y10S257/906Y10S257/907
    • A DRAM cell arrangement and method for manufacturing same, wherein a storage capacitor is connected via a first source/drain zone of a vertical selection transistor and a bit line. Since the storage capacitor and the bit line are arranged substantially above a substrate, the bit line can be manufactured of materials having high electrical conductivity, and materials having a high dielectric constant can be utilized for the storage capacitor. At least the first source/drain zone and a channel zone are parts of a projection-like semiconductor structure that is laterally limited by at least two sidewalls. A respective word line can be arranged at the two sidewalls. An element that prevents the drive of the selection transistor by this word line is arranged between the channel zone and one of the word lines. A second source/drain zone of the selection transistor is buried in the substrate and, for example, is part of a doped layer or of a grid-shaped doped region or is connected to the substrate via a buried contact. A memory cell can be manufactured given open bit lines as well as given folded bit lines, wherein it is manufactured with an area of 4F.sup.2.
    • 一种DRAM单元布置及其制造方法,其中存储电容器经由垂直选择晶体管的第一源极/漏极区域和位线连接。 由于存储电容器和位线布置在基板的大致上方,所以位线可以由具有高导电性的材料制造,并且具有高介电常数的材料可用于存储电容器。 至少第一源极/漏极区域和沟道区域是由至少两个侧壁横向限制的突起状半导体结构的部分。 相应的字线可以布置在两个侧壁处。 阻止由该字线驱动选择晶体管的元件被布置在通道区域和一条字线之间。 选择晶体管的第二源极/漏极区域被掩埋在衬底中,并且例如是掺杂层或栅格形掺杂区域的一部分,或者通过埋入触点连接到衬底。 可以制造给定的开放位线以及给定的折叠位线的存储器单元,其中制造的面积为4F2。
    • 15. 发明授权
    • DRAM cell arrangement and method for its fabrication
    • DRAM单元布置及其制造方法
    • US6075265A
    • 2000-06-13
    • US105235
    • 1998-06-26
    • Bernd GoebelEmmerich Bertagnolli
    • Bernd GoebelEmmerich Bertagnolli
    • G11C11/34G11C11/405H01L21/82H01L21/8242H01L27/108
    • H01L27/10844H01L27/108H01L27/10876H01L27/10852
    • The DRAM cell arrangement has three transistors per memory cell, at least one of which transistors is designed as a vertical transistor. The transistors may be formed on sidewalls (1F1, 1F2, 2F2) of trenches (G1, G2). In order to fabricate contact regions (K) which respectively connect together three source/drain regions (1 S/D1, 3 S/D2, 2 S/D 2) of different transistors, it is advantageous to arrange the trenches (G1, G2) alternately with a larger distance and a smaller distance from one another. Gate electrodes (Ga1, Ga3) of transistors may be formed as parts of writing word lines (WS) or read-out word lines (WA) in the form of spacers on sidewalls (1F1, 1F2) of the trenches (G1). Connections between gate electrodes (Ga2) and source/drain regions (3 S/D1) may be made via conductive structures (L).
    • 每个存储单元DRAM单元布置具有三个晶体管,其中至少一个晶体管被设计为垂直晶体管。 晶体管可以形成在沟槽(G1,G2)的侧壁(1F1,1F2,2F2)上。 为了制造分别连接不同晶体管的三个源极/漏极区域(1S / D1,3S / D2,2S / D 2)的接触区域(K),有利的是将沟槽(G1,G2) )交替地具有较大的距离和彼此较小的距离。 晶体管的栅电极(Ga1,Ga3)可以形成为在沟槽(G1)的侧壁(1F1,1F2)上的间隔物形式的写入字线(WS)或读出字线(WA)的部分。 栅电极(Ga2)和源/漏区(3S / D1)之间的连接可以通过导电结构(L)制成。