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    • 176. 发明授权
    • Method for evaluating semiconductor device
    • 半导体器件评估方法
    • US08471585B2
    • 2013-06-25
    • US12805273
    • 2010-07-21
    • Mitsuyoshi MiyazonoShigekazu KomatsuDai ShinozakiMasahiro KatoAtsushi Yoshida
    • Mitsuyoshi MiyazonoShigekazu KomatsuDai ShinozakiMasahiro KatoAtsushi Yoshida
    • G01R31/26
    • H01L22/20G01R31/2831H01L22/14
    • A yield and productivity of a semiconductor module are improved. A sheet having electrical conductivity is fixed to a main surface of a semiconductor substrate on which a plurality of semiconductor devices having a surface structure and a rear surface electrode are arranged. The semiconductor substrate is divided into semiconductor chips on a first support stage in the state where the sheet is fixed to its main surface. The plurality of divided semiconductor chips are mounted on a second support stage via the sheet and further, the plurality of mounted semiconductor chips are continuously subjected to a dynamic characteristic test on the second support stage. The proposed semiconductor device evaluation method permits a fissure growing and propagating from a crack occurring in the dynamic characteristic test of the vertical semiconductor devices to be suppressed, and the yield and productivity of the semiconductor module to be improved.
    • 提高半导体模块的产量和生产率。 具有导电性的片材固定在其上布置有多个具有表面结构的半导体器件和背面电极的半导体衬底的主表面上。 半导体衬底在片材固定到其主表面的状态下在第一支撑台上分成半导体芯片。 多个划分的半导体芯片通过片材安装在第二支撑台上,并且多个安装的半导体芯片在第二支撑台上连续进行动态特性测试。 所提出的半导体器件评估方法允许抑制在垂直半导体器件的动态特性测试中发生的裂纹的裂缝生长和传播,并且提高半导体模块的产量和生产率。