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1. 发明授权

US08471585B2 Method for evaluating semiconductor device 有权
标题翻译：半导体器件评估方法
公开(公告)号：US08471585B2
公开(公告)日：2013-06-25
申请号：US12805273
申请日：2010-07-21
申请人： Mitsuyoshi Miyazono , Shigekazu Komatsu , Dai Shinozaki , Masahiro Kato , Atsushi Yoshida
发明人： Mitsuyoshi Miyazono , Shigekazu Komatsu , Dai Shinozaki , Masahiro Kato , Atsushi Yoshida
IPC分类号： G01R31/26
CPC分类号： H01L22/20 , G01R31/2831 , H01L22/14
摘要： A yield and productivity of a semiconductor module are improved. A sheet having electrical conductivity is fixed to a main surface of a semiconductor substrate on which a plurality of semiconductor devices having a surface structure and a rear surface electrode are arranged. The semiconductor substrate is divided into semiconductor chips on a first support stage in the state where the sheet is fixed to its main surface. The plurality of divided semiconductor chips are mounted on a second support stage via the sheet and further, the plurality of mounted semiconductor chips are continuously subjected to a dynamic characteristic test on the second support stage. The proposed semiconductor device evaluation method permits a fissure growing and propagating from a crack occurring in the dynamic characteristic test of the vertical semiconductor devices to be suppressed, and the yield and productivity of the semiconductor module to be improved.
摘要翻译：提高半导体模块的产量和生产率。具有导电性的片材固定在其上布置有多个具有表面结构的半导体器件和背面电极的半导体衬底的主表面上。半导体衬底在片材固定到其主表面的状态下在第一支撑台上分成半导体芯片。多个划分的半导体芯片通过片材安装在第二支撑台上，并且多个安装的半导体芯片在第二支撑台上连续进行动态特性测试。所提出的半导体器件评估方法允许抑制在垂直半导体器件的动态特性测试中发生的裂纹的裂缝生长和传播，并且提高半导体模块的产量和生产率。

2. 发明申请

US20110050269A1 Method for evaluating semiconductor device 有权
标题翻译：半导体器件评估方法
公开(公告)号：US20110050269A1
公开(公告)日：2011-03-03
申请号：US12805273
申请日：2010-07-21
申请人： Mitsuyoshi Miyazono , Shigekazu Komatsu , Dai Shinozaki , Masahiro Kato , Atsushi Yoshida
发明人： Mitsuyoshi Miyazono , Shigekazu Komatsu , Dai Shinozaki , Masahiro Kato , Atsushi Yoshida
IPC分类号： G01R31/26
CPC分类号： H01L22/20 , G01R31/2831 , H01L22/14
摘要： A yield and productivity of a semiconductor module are improved. A sheet having electrical conductivity is fixed to a main surface of a semiconductor substrate on which a plurality of semiconductor devices having a surface structure and a rear surface electrode are arranged. The semiconductor substrate is divided into semiconductor chips on a first support stage in the state where the sheet is fixed to its main surface. The plurality of divided semiconductor chips are mounted on a second support stage via the sheet and further, the plurality of mounted semiconductor chips are continuously subjected to a dynamic characteristic test on the second support stage. The proposed semiconductor device evaluation method permits a fissure growing and propagating from a crack occurring in the dynamic characteristic test of the vertical semiconductor devices to be suppressed, and the yield and productivity of the semiconductor module to be improved.
摘要翻译：提高半导体模块的产量和生产率。具有导电性的片材固定在其上布置有多个具有表面结构的半导体器件和背面电极的半导体衬底的主表面上。半导体衬底在片材固定到其主表面的状态下在第一支撑台上分成半导体芯片。多个划分的半导体芯片通过片材安装在第二支撑台上，并且多个安装的半导体芯片在第二支撑台上连续进行动态特性测试。所提出的半导体器件评估方法允许抑制在垂直半导体器件的动态特性测试中发生的裂纹的裂缝生长和传播，并且提高半导体模块的产量和生产率。

3. 发明授权

US08159245B2 Holding member for inspection, inspection device and inspecting method 有权
标题翻译：检验检验机构检验方法
公开(公告)号：US08159245B2
公开(公告)日：2012-04-17
申请号：US12444695
申请日：2007-10-17
申请人： Shigekazu Komatsu , Mitsuyoshi Miyazono , Kazuya Asaoka
发明人： Shigekazu Komatsu , Mitsuyoshi Miyazono , Kazuya Asaoka
IPC分类号： G01R31/20
CPC分类号： G01R1/0408
摘要： Installed in a probe device is a holding member for inspection which can be mounted on a chuck. The holding member for inspection includes a support plate capable of mounting thereon a chip in which the power device is formed; pins for positioning the chip mounted on the support plate; and a metal film formed on a surface of the support plate in a range from a mounting area on which the chip is mounted to an exposed area on which the chip is not mounted. When inspecting the power device, the chip is fixed onto the mounting area in the holding member for inspection, one probe pin is brought into contact with a terminal on a top surface of the chip; and another probe pin is brought into contact with the metal film in the exposed area.
摘要翻译：安装在探针装置中的是用于检查的保持构件，其可以安装在卡盘上。用于检查的保持构件包括能够安装在其上形成有动力装置的芯片的支撑板; 用于定位安装在支撑板上的芯片的销; 以及金属膜，其在从安装有芯片的安装区域到未安装芯片的暴露区域的范围内形成在支撑板的表面上。当检查动力装置时，将芯片固定在保持构件的安装区域上进行检查，一个探针与芯片顶表面上的端子接触; 另一个探针与暴露区域中的金属膜接触。

4. 发明申请

US20100033199A1 HOLDING MEMBER FOR INSPECTION, INSPECTION DEVICE AND INSPECTING METHOD 有权
标题翻译：监督检查检查机构和检查方法
公开(公告)号：US20100033199A1
公开(公告)日：2010-02-11
申请号：US12444695
申请日：2007-10-17
申请人： Shigekazu Komatsu , Mitsuyoshi Miyazono , Kazuya Asaoka
发明人： Shigekazu Komatsu , Mitsuyoshi Miyazono , Kazuya Asaoka
IPC分类号： G01R31/02 , H01H31/02
CPC分类号： G01R1/0408
摘要： Installed in a probe device is a holding member for inspection which can be mounted on a chuck. The holding member for inspection includes a support plate capable of mounting thereon a chip in which the power device is formed; pins for positioning the chip mounted on the support plate; and a metal film formed on a surface of the support plate in a range from a mounting area on which the chip is mounted to an exposed area on which the chip is not mounted. When inspecting the power device, the chip is fixed onto the mounting area in the holding member for inspection, one probe pin is brought into contact with a terminal on a top surface of the chip; and another probe pin is brought into contact with the metal film in the exposed area.
摘要翻译：安装在探针装置中的是用于检查的保持构件，其可以安装在卡盘上。用于检查的保持构件包括能够安装在其上形成有动力装置的芯片的支撑板; 用于定位安装在支撑板上的芯片的销; 以及金属膜，其在从安装有芯片的安装区域到未安装芯片的暴露区域的范围内形成在支撑板的表面上。当检查动力装置时，将芯片固定在保持构件的安装区域上进行检查，一个探针与芯片顶表面上的端子接触; 另一个探针与暴露区域中的金属膜接触。

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