会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 142. 发明授权
    • Substrate transfer shuttle having a magnetic drive
    • 具有磁力驱动的基板转移梭
    • US06471459B2
    • 2002-10-29
    • US09447930
    • 1999-11-23
    • Wendell T. BloniganJohn M. White
    • Wendell T. BloniganJohn M. White
    • B65G4907
    • H01L21/67742H01L21/67709H01L21/6776Y10S414/139
    • A magnetic drive system for moving a substrate transfer shuttle along a linear path between chambers in a semiconductor fabrication apparatus. A rack with rack magnets is secured to the shuttle, and a rotatable pinion with pinion magnets is positioned adjacent the rack so that the pinion magnets can magnetically engage the rack magnets. Thus, rotation of the pinion will cause the shuttle to move along the linear path. The magnets may be oriented with a helix angle between their primary axis and the axis of rotation of the pinion. One rack and one pinion are located on each side of the shuttle. A set of lower guide rollers supports the shuttle, and a set of upper guide rollers prevents the shuttle from lifting off the lower guide rollers.
    • 一种磁性驱动系统,用于在半导体制造装置中沿着室之间的线性路径移动基板传送梭。 具有齿条磁体的机架固定到梭子上,并且具有小齿轮磁体的可旋转小齿轮定位成邻近齿条,使得小齿轮磁体可以磁性地接合齿条磁体。 因此,小齿轮的旋转将使梭子沿线性路径移动。 磁体可以在其主轴线和小齿轮的旋转轴线之间具有螺旋角度定向。 一个机架和一个小齿轮位于梭子的每一侧。 一组下导辊支撑梭子,一组上导辊防止梭子从下导辊上脱落。
    • 146. 发明授权
    • Automated door assembly for use in semiconductor wafer manufacturing
    • 用于半导体晶圆制造的自动门组件
    • US06447233B1
    • 2002-09-10
    • US09641996
    • 2000-08-18
    • Jeffrey M. Denker
    • Jeffrey M. Denker
    • B65G4902
    • H01L21/67772Y10S414/139Y10S414/14
    • An automated door assembly is provided for sealing an opening in a barrier to a contaminant-free environment suitable for semiconductor wafer processing. The door assembly comprises a base pivotable toward and away from the opening along an arcuate path and a closure plate linearly movably coupled to the base and configured to a seal the opening in the barrier. The closure plate is removable in synchronization with the pivoting of the base to traverse a horizontal linear path into contact with the barrier to close the opening. A vacuum system is provided in conjunction with the door assembly to extract particles from the sealed environment. A sensor disposed on the closure plate is operable to sense the position of wafers or other objects disposed adjacent the opening, to detect misalignment or omission thereof. The closure plate can be provided in a number of sizes for interchangeability to accommodate different sized pods; similarly, bezel inserts having different sized openings therein can be provided in the barrier. A latching apparatus for latching a wafer pod or cassette is also provided. The latching apparatus includes a pod support and a platform linearly movably coupled to the pod support. A locking mechanism configured to mate with a corresponding mechanism on the pod is rotatably mounted to the pod support and coupled to the platform for linear motion therewith, such that linear motion of the platform is operative to rotate the locking mechanism into locking engagement with the pod. The platform includes three beveled pins matable with corresponding openings having beveled surfaces on the pod.
    • 提供了一种自动门组件,用于将屏障中的开口密封到适合于半导体晶片处理的无污染物环境。 门组件包括可沿着弧形路径朝向和远离开口枢转的基座,以及可线性地可移动地联接到基座并且构造成密封屏障中的开口的封闭板。 闭合板可与基座的枢转同步移动,以横过与屏障接触的水平线性路径以闭合开口。 与门组件一起提供真空系统以从密封环境中提取颗粒。 设置在封闭板上的传感器可操作以感测与开口相邻设置的晶片或其它物体的位置,以检测其未对准或省略。 封闭板可以提供多种尺寸以便互换,以适应不同尺寸的荚; 类似地,可以在屏障中提供具有不同尺寸开口的挡板插入件。 还提供了用于锁定晶片盒或盒的闭锁装置。 闩锁装置包括荚状物支架和可直线地可移动地联接到荚状物支架的平台。 配置成与舱上的对应机构配合的锁定机构可旋转地安装到舱支架并联接到平台以与其平行运动,使得平台的直线运动可操作以将锁定机构旋转成与舱架锁定接合 。 该平台包括三个斜面销,可与具有在荚上的斜面的相应开口相配合。
    • 147. 发明授权
    • Thermal treatment apparatus, semiconductor device fabrication apparatus, load-lock chamber, and method of fabricating semiconductor device
    • 热处理装置,半导体装置制造装置,负载锁定室以及半导体装置的制造方法
    • US06444480B1
    • 2002-09-03
    • US08413163
    • 1995-03-29
    • Masaki Saito
    • Masaki Saito
    • C23C1600
    • C23C16/54C23C16/4401Y10S414/137Y10S414/139Y10S438/909
    • A semiconductor device fabrication apparatus includes a thermal treatment device for thermally processing a semiconductor substrate, a first oxygen monitor for monitoring the density of oxygen in said thermal treatment device, a load-lock chamber separably coupled to said thermal treatment device for housing the semiconductor substrate before thermal treatment thereof by said thermal treatment device, and a second oxygen monitor for monitoring the density of oxygen in said load-lock chamber. First, the semiconductor substrate is introduced into the load-lock chamber, and then the load-lock chamber is evacuated. Thereafter, the density of oxygen in the load-lock chamber is measured by the second oxygen monitor, and the thermal treatment device is evacuated, after which the density of oxygen in the thermal treatment device is measured by the first oxygen monitor. The semiconductor substrate is introduced from the load-lock chamber into the thermal treatment device after the densities of oxygen in the load-lock chamber and the thermal treatment device as measured by the first and second oxygen monitors, respectively, have dropped below a predetermined level. A thin film is deposited on the semiconductor substrate in the thermal treatment device.
    • 半导体器件制造装置包括用于热处理半导体衬底的热处理装置,用于监测所述热处理装置中的氧浓度的第一氧监测器,可分离地耦合到所述用于容纳半导体衬底的热处理装置的负载锁定室 在通过所述热处理装置进行热处理之前,以及第二氧气监测器,用于监测所述装载锁定室中的氧浓度。 首先,将半导体基板引入负载锁定室,然后将负载锁定室抽真空。 此后,通过第二氧监测器测量装载锁定室中的氧浓度,并将热处理装置抽真空,之后通过第一氧监测器测量热处理装置中的氧浓度。 在由第一和第二氧气监测器测量的负载锁定室和热处理装置中的氧气密度分别下降到预定水平以下之后,将半导体衬底从负载锁定室引入热处理装置中 。 在热处理装置中的半导体衬底上沉积有薄膜。