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141. 发明授权

US09052104B2 Lighting device and method manufacturing holder of lighting device 有权
标题翻译：照明装置照明装置及方法制造持有人
公开(公告)号：US09052104B2
公开(公告)日：2015-06-09
申请号：US13978770
申请日：2012-01-20
申请人： Masashi Watanabe , Takashi Akiyama , Atsushi Tonosaki , Takashi Shimura , Ken Kobayashi
发明人： Masashi Watanabe , Takashi Akiyama , Atsushi Tonosaki , Takashi Shimura , Ken Kobayashi
IPC分类号： F21V29/00 , B29C45/14 , F21V19/00 , F21K99/00 , F21Y101/02
CPC分类号： F21V29/83 , B29C45/14467 , F21K9/23 , F21K9/90 , F21V19/0055 , F21V29/713 , F21V29/74 , F21V29/773 , F21V29/85 , F21V29/89 , F21Y2115/10
摘要： A lighting device includes a light source that includes at least one LED element and a module including a substrate on which the light source is mounted, and a holder in which at least a part of the module is arranged and held. The holder includes a cylindrical portion that includes a stepped portion and a flange of a heat conductor extending from an outer peripheral edge of the stepped portion on which the substrate is arranged, and the holder includes an insulation layer that covers at least outer peripheral surface of the cylindrical portion.
摘要翻译：照明装置包括：光源，其包括至少一个LED元件和包括其上安装有光源的基板的模块;以及保持器，其中所述模块的至少一部分被布置和保持。保持器包括圆柱形部分，其包括阶梯部分和从其上布置有基底的台阶部分的外周边缘延伸的热导体的凸缘，并且保持器包括至少覆盖至少外周面的绝缘层圆柱形部分。

142. 发明授权

US09041272B2 Control of lumen loss in a liquid-filled LED bulb 有权
标题翻译：控制液体填充LED灯泡中的管腔损失
公开(公告)号：US09041272B2
公开(公告)日：2015-05-26
申请号：US14105102
申请日：2013-12-12
申请人： Switch Bulb Company, Inc.
发明人： Brian Cumpston , David Horn , Ronan Le Toquin
IPC分类号： H01J7/26 , H01J61/52 , H01K1/58 , F21V29/00 , F21K99/00 , F21V3/00 , F21Y101/02 , F21Y111/00
CPC分类号： F21V29/56 , F21K9/232 , F21V3/00 , F21V29/004 , F21V29/58 , F21V29/85 , F21Y2107/00 , F21Y2115/10 , Y02B20/30
摘要： A liquid-filled light emitting diode (LED) bulb including a base, a shell connected to the base forming an enclosed volume, a thermally conductive liquid held within the enclosed volume, a support structure connected to the base, and several LEDs attached to the support structure. The thermally conductive liquid has an oxygen content of at least 5 cubic centimeters of oxygen per liter of the thermally conductive fluid.
摘要翻译：一种充满液体的发光二极管（LED）灯泡，包括基座，连接到形成封闭容积的基座的外壳，保持在封闭容积内的导热液体，连接到基座的支撑结构以及连接到基座的几个LED 支撑结构。导热液体每升导热流体的氧含量至少为5立方厘米。

143. 发明授权

US09004722B2 Low-profile LED heat management system 有权
标题翻译：低调LED热管理系统
公开(公告)号：US09004722B2
公开(公告)日：2015-04-14
申请号：US13562923
申请日：2012-07-31
申请人： Matthew B. Sampsell , Robert L. Holman
发明人： Matthew B. Sampsell , Robert L. Holman
IPC分类号： F21V29/00 , F21V29/02 , F21K99/00
CPC分类号： F21V29/77 , F21K9/20 , F21K9/52 , F21K9/61 , F21S8/04 , F21V29/02 , F21V29/67 , F21V29/773 , F21V29/80 , F21V29/85 , F21V2200/20 , F21Y2115/10 , G02B6/0021 , G02B6/003 , G02B6/0038 , G02B6/0046 , G02B6/0073 , G02B6/0085 , Y10T29/49002
摘要： This disclosure provides systems, methods and apparatus for low-profile lighting systems. In one aspect, an LED-based light engine, which may be thinner and/or lighter than conventional light engines, may be retained in both conventionally-dimensioned and low-profile light fixtures. In another aspect, a light engine can include both convective and conductive heat transfer components, the efficacy of which will vary based on the dimensions of a light fixture in which the light engine is installed.
摘要翻译：本公开提供了用于低调照明系统的系统，方法和装置。在一个方面，可以比常规的光引擎更薄和/或更轻的基于LED的光引擎可以保留在常规尺寸和低轮廓的灯具中。在另一方面，光引擎可以包括对流和导电传热部件，其功效将根据其中安装光引擎的灯具的尺寸而变化。

144. 发明授权

US08939595B2 Backlight assembly and display device including the same 有权
标题翻译：背光组件和显示装置包括它们
公开(公告)号：US08939595B2
公开(公告)日：2015-01-27
申请号：US14166847
申请日：2014-01-28
申请人： G&CS Co., Ltd
发明人： Suk-Hong Choi , Sang-Hee Park
IPC分类号： F21V29/00 , G02F1/1335 , F21V8/00 , G02F1/1333
CPC分类号： F21V29/85 , G02B6/0085 , G02B6/009 , G02F1/133615 , G02F2001/133317 , G02F2001/133628 , H01L2924/0002 , H01L2924/00
摘要： This invention relates to a backlight assembly having improved heat dissipation performance and a simplified structure and to a display device including the same. The backlight assembly includes a light source unit for generating light, a housing for accommodating the light source unit and having an aperture, a middle frame coupled to the housing and receiving the light source unit, and an LED fixing frame which is adjacent to the light source unit and is coupled to the housing and at least a part of which is exposed through the aperture.
摘要翻译：本发明涉及具有改善的散热性能和简化结构的背光组件以及包括该背光组件的显示装置。背光组件包括用于产生光的光源单元，用于容纳光源单元并具有孔的壳体，耦合到壳体并接收光源单元的中间框架以及与该光源单元相邻的LED固定框架源单元并且耦合到壳体，并且其至少一部分通过孔露出。

145. 发明授权

US08905577B2 Lamp housing with clamping lens 有权
标题翻译：带夹紧镜头的灯罩
公开(公告)号：US08905577B2
公开(公告)日：2014-12-09
申请号：US13075467
申请日：2011-03-30
申请人： William Henry Meurer , Stan Levy
发明人： William Henry Meurer , Stan Levy
IPC分类号： F21V29/00 , F21S4/00 , F21K99/00 , F21Y103/00 , F21V19/00
CPC分类号： F21K9/27 , F21K9/00 , F21V3/02 , F21V19/0035 , F21V29/70 , F21V29/85 , F21V29/89 , F21Y2103/10 , F21Y2115/10
摘要： A lamp housing uses a tubular metal support functional as a heat radiator within which is an electrical circuit board having a component mounting surface, and in opposition thereto, a thermal transfer surface positioned for conducting heat, from the circuit board to the metal support. A clear lens is secured to the metal support, and a pair of ribs integral to the clear lens extend into contact with the component mounting surface of the circuit board thereby urging the thermal transfer surface toward the metal support for good thermal contact and heat transfer. A thermal transfer tape or paste may be used between the circuit board and the metal support surface upon which it rests. The circuit board may be laid onto the metal support without sliding it into grooves and the clear lens may be snapped into place over the circuit board engaging grooves in the metal support.
摘要翻译：灯壳体使用作为散热器的管状金属支撑件，其中是具有部件安装表面的电路板，并且与其相对地设置有用于传导热量的热传递表面，其从电路板到金属支撑件。透明透镜固定在金属支架上，与透明透镜成一体的一对肋条与电路板的元件安装表面相接触，从而将热传递表面推向金属支架，以获得良好的热接触和热传递。可以在电路板和其所在的金属支撑表面之间使用热转印带或糊状物。电路板可以被放置在金属支撑件上而不将其滑入槽中，并且透明透镜可以卡扣在电路板上接合在金属支撑件中的凹槽中的位置。

146. 发明授权

US08858027B2 Light bulb shaped lamp and lighting apparatus 有权
标题翻译：灯泡形灯和照明装置
公开(公告)号：US08858027B2
公开(公告)日：2014-10-14
申请号：US13872321
申请日：2013-04-29
申请人： Panasonic Corporation
发明人： Nobuyoshi Takeuchi , Tsugihiro Matsuda , Hideo Nagai , Masahiro Miki , Takaari Uemoto
IPC分类号： F21V29/00 , F21V19/00 , F21V3/00 , F21V23/00 , F21K99/00 , F21V3/04 , F21Y103/00 , F21Y105/00 , F21Y101/02
CPC分类号： F21V23/002 , F21K9/232 , F21V3/061 , F21V19/003 , F21V23/001 , F21V29/85 , F21Y2103/10 , F21Y2105/10 , F21Y2115/10 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/4903 , H01L2224/49107 , H01L2224/73265 , H01L2924/181 , H01L2924/19107 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A light bulb shaped lamp according to the present invention includes: a hollow globe; an LED module including a base platform and an LED chip mounted on the base platform, the LED module being provided in the globe; a lead wire for supplying power to the LED module; and a stem extending toward the interior of the globe, in which the base platform is directly fixed to the stem.
摘要翻译：根据本发明的灯泡形灯包括：中空球体; LED模块，其包括基座平台和安装在所述基台上的LED芯片，所述LED模块设置在所述球体中; 用于向LED模块供电的引线; 以及朝向球体内部延伸的杆，其中基座平台直接固定到杆上。

147. 发明授权

US08833431B2 Aluminum alloy material and method of manufacturing aluminum alloy backboard 有权
标题翻译：铝合金材料和铝合金背板的制造方法
公开(公告)号：US08833431B2
公开(公告)日：2014-09-16
申请号：US13059634
申请日：2010-12-30
申请人： Deyuan Xiao , Richard Rugin Chang , Mengjan Cherng , Qing Rao
发明人： Deyuan Xiao , Richard Rugin Chang , Mengjan Cherng , Qing Rao
IPC分类号： B22D17/00
CPC分类号： C22C21/00 , B22D17/00 , C22C1/026 , C22C1/1036 , C22C26/00 , F21V29/85 , H01L23/3733 , H01L23/3736 , H01L33/641 , H01L2924/0002 , H01L2924/12044 , H01L2933/0075 , H01L2924/00
摘要： The present invention discloses an aluminum alloy material, which is made of raw material of aluminum alloy. The raw material of aluminum alloy consists of the following constituents by percentage of weight: graphene: 0.1%˜1%, carbon nano tube: 1%˜5%, the rest being Al. The aluminum alloy material of the present invention has a good performance of heat dissipation, the thermal conductivity is higher than 200 W/m. Meanwhile, the present invention further provides a method of manufacturing aluminum alloy backboard, in which method, the raw material of aluminum alloy is heated and melted in a heating furnace, afterwards, the raw material of aluminum alloy after melting is formed into an aluminum alloy backboard by die-casting, in this way, the utilization rate of material is increased and the manufacturing cost of the backboard is reduced.
摘要翻译：本发明公开了一种由铝合金原料制成的铝合金材料。铝合金原料由以下重量百分比组成：石墨烯：0.1％〜1％，碳纳米管：1％〜5％，其余为Al。本发明的铝合金材料具有良好的散热性能，导热系数高于200W / m。同时，本发明还提供一种制造铝合金背板的方法，其中将铝合金原料在加热炉中加热熔化，之后将熔融后的铝合金原料形成为铝合金通过压铸，通过这种方式，材料的利用率提高，背板的制造成本降低。

148. 发明授权

US08827507B2 Lighting assemblies, methods of installing same, and methods of replacing lights 有权
标题翻译：照明组件，安装方法和更换灯的方法
公开(公告)号：US08827507B2
公开(公告)日：2014-09-09
申请号：US11859048
申请日：2007-09-21
申请人： Antony Paul Van De Ven , Gerald H. Negley
发明人： Antony Paul Van De Ven , Gerald H. Negley
IPC分类号： B60Q1/06 , F21S6/00 , F21V15/00 , F21S8/02 , F21V17/16 , F21V23/02 , F21V29/00 , F21Y101/02 , F21Y105/00
CPC分类号： F21V29/70 , F21S8/02 , F21V17/164 , F21V23/026 , F21V29/004 , F21V29/74 , F21V29/80 , F21V29/85 , F21Y2105/10 , F21Y2115/10
摘要： A lighting assembly comprising a light engine housing, a circuit board, a heat transfer material, an electrically conductive leg and a solid state light emitter. The emitter is in contact with a first end of the leg. The leg extends through the circuit board. A second end of the leg extends into the heat transfer material. Also, a lighting assembly as described above, which further comprises a fixture housing, in which the heat transfer material is in contact with the light engine housing and the light engine housing is connected to the fixture housing. In addition, a method of installing a lighting assembly, comprising connecting an electrical conductor and inserting the lighting assembly through a hole in a construction element such that clips attached to a fixture housing engage the construction element. Also, a method of changing a light emitter in a lighting assembly.
摘要翻译：一种照明组件，包括光引擎壳体，电路板，传热材料，导电腿和固态光发射器。发射器与腿的第一端接触。腿部延伸穿过电路板。腿的第二端延伸到传热材料中。而且，如上所述的照明组件还包括固定器壳体，其中传热材料与光引擎壳体接触，并且光引擎壳体连接到固定器壳体。另外，一种安装照明组件的方法，包括连接电导体并将照明组件通过构造元件中的孔插入，使得附接到固定器壳体的夹子与构造元件接合。另外，改变照明组件中的发光体的方法。

149. 发明申请

US20140240994A1 LIGHTING DEVICE 有权
标题翻译：照明设备
公开(公告)号：US20140240994A1
公开(公告)日：2014-08-28
申请号：US14177453
申请日：2014-02-11
申请人： LG Innotek Co., Ltd.
发明人： Dong Nyung LIM , Do Hwan KIM , Jae Jin KIM , Cheon Joo KIM , Sang Hoon LEE , Keun Tak JOO , Tae Young CHOI
IPC分类号： F21V29/00
CPC分类号： F21K9/232 , F21K9/23 , F21K9/235 , F21K9/237 , F21K9/238 , F21V3/00 , F21V3/0625 , F21V23/006 , F21V29/00 , F21V29/20 , F21V29/503 , F21V29/507 , F21V29/70 , F21V29/713 , F21V29/74 , F21V29/763 , F21V29/773 , F21V29/83 , F21V29/85 , F21V29/89 , F21Y2101/00 , F21Y2115/10 , Y02B20/30
摘要： A lighting device includes a heat sink including a first heat radiation part and a second heat radiation part; a light source module including a substrate disposed on the first heat radiation part, and a light emitting device disposed on the substrate; and a power supply unit which is disposed within the second heat radiation part and supplies power to the light source module. The second heat radiation part includes an inner portion receiving the power supply unit therewithin, an outer portion enclosing the inner portion, and a first receiver disposed between the inner portion and the outer portion. The first heat radiation part includes an upper portion which is disposed on the inner portion of the second heat radiation part and on which the substrate of the light source module is disposed, and a lower portion disposed in the first receiver of the second heat radiation part.
摘要翻译：照明装置包括：散热器，包括第一散热部和第二散热部; 包括设置在所述第一散热部上的基板的光源模块和设置在所述基板上的发光元件; 以及电源单元，其设置在第二散热部内，并向光源模块供电。第二散热部包括容纳内部的电源单元的内部部分，封闭内部部分的外部部分和设置在内部部分和外部部分之间的第一接收器。第一散热部包括设置在第二散热部的内部并且配置有光源模块的基板的上部，以及设置在第二散热部的第一接收部中的下部。

150. 发明申请

US20140237814A1 LED LIGHTING ASSEMBLIES WITH THERMAL OVERMOLDING 审中-公开
标题翻译： LED照明组件与热过度模拟
公开(公告)号：US20140237814A1
公开(公告)日：2014-08-28
申请号：US14268476
申请日：2014-05-02
申请人： Jeffrey Nall , Matthew Mrakovich
发明人： Jeffrey Nall , Matthew Mrakovich
IPC分类号： F21V29/00
CPC分类号： H05K1/0203 , F21K9/90 , F21S4/10 , F21S4/20 , F21V3/02 , F21V3/0481 , F21V3/10 , F21V3/12 , F21V9/16 , F21V9/30 , F21V23/001 , F21V23/005 , F21V23/007 , F21V23/023 , F21V29/004 , F21V29/70 , F21V29/85 , F21V31/04 , F21Y2101/00 , F21Y2115/10 , G09F9/33 , H05K1/0209 , H05K1/181 , H05K3/284 , H05K3/32 , H05K2201/0129 , H05K2201/0209 , H05K2201/10106 , H05K2203/1316 , Y10T29/4913 , Y10T29/49146
摘要： One or more light emitting diode diodes (LEDs) are attached to a printed circuit board. The attached LEDs are connectable with a power source via circuitry of the printed circuit board. An overmolding material is insert molded an over at least portions of the printed circuit board proximate to the LEDs to form a free standing high thermal conductivity material overmolding that covers at least portions of the printed circuit board proximate to the LEDs. The free standing high thermal conductivity material has a melting temperature greater than about 100° C. and has a thermal conductivity greater than or about 1 W/m·K. In some embodiments, the free standing high thermal conductivity material is a thermoplastic material.
摘要翻译：一个或多个发光二极管二极管（LED）连接到印刷电路板。所连接的LED可通过印刷电路板的电路与电源连接。包覆成型材料在印刷电路板的靠近LED的至少部分上嵌入模制，以形成覆盖印刷电路板的靠近LED的至少部分的独立高导热材料。独立的高导热性材料的熔化温度大于约100℃，并具有大于或约1W / m·K的导热系数。在一些实施例中，自由高的导热材料是热塑性材料。

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