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    • 131. 发明申请
    • Pattern formation method
    • 图案形成方法
    • US20050069814A1
    • 2005-03-31
    • US10859121
    • 2004-06-03
    • Masayuki EndoMasaru Sasago
    • Masayuki EndoMasaru Sasago
    • G03F7/40G03C5/00G03F7/00H01L21/027
    • G03F7/40
    • A resist film is formed on a substrate, and pattern exposure is performed by selectively irradiating the resist film with exposing light. A first resist pattern is formed by developing the resist film after the pattern exposure, and subsequently, a water-soluble film including a crosslinking agent that crosslinks a material of the resist and an acid, that is, a crosslinkage accelerator for accelerating a crosslinking reaction of the crosslinking agent, is formed over the substrate including the first resist pattern. Thereafter, a crosslinking reaction is caused by annealing between a portion of the water-soluble film and a portion of the first resist pattern in contact with each other on the sidewall of the first resist pattern, and then, a portion of the water-soluble film not reacted with the first resist pattern is removed. Thus, a second resist pattern made of the first resist pattern and the water-soluble film remaining on the sidewall of the first resist pattern is formed.
    • 在基板上形成抗蚀剂膜,并通过用曝光光选择性地照射抗蚀剂膜来进行图案曝光。 在图案曝光之后,通过显影抗蚀剂膜形成第一抗蚀剂图案,随后形成包含交联抗蚀剂材料和酸的交联剂的水溶性膜,即用于加速交联反应的交联促进剂 的交联剂形成在包括第一抗蚀剂图案的基板上。 此后,通过在第一抗蚀剂图案的侧壁上的水溶性膜的一部分和第一抗蚀剂图案的一部分之间的接触退火引起交联反应,然后,将一部分水溶性 除去与第一抗蚀剂图案不反应的膜。 因此,形成由第一抗蚀剂图案和保留在第一抗蚀剂图案的侧壁上的水溶性膜制成的第二抗蚀剂图案。
    • 133. 发明授权
    • Method of producing a stencil mask
    • 生产模板掩模的方法
    • US5401932A
    • 1995-03-28
    • US13100
    • 1993-02-03
    • Kazuhiko HashimotoMasayuki EndoMasaru Sasago
    • Kazuhiko HashimotoMasayuki EndoMasaru Sasago
    • B23H9/00B23H9/14G03F1/20B23H1/00G03F1/16
    • G03F1/20B23H9/00B23H9/14
    • The reverse side of a substrate made of stainless steel is subjected to electro-discharge machining using a thick electrode having a diameter of about 10 .mu.m, thus selectively etching other part than the edge of the reverse side of the substrate. This electro-discharge machining causes the other part than the edge of the substrate to be thinned to a thickness of about 10 .mu.m. The surface of the substrate thus thinned is subjected to electro-discharge machining using a slender electrode having a diameter of about 3 .mu.m, thus forming a pattern having a predetermined configuration in the surface of the substrate. Further, the surface of the substrate is etched with the use of the slender electrode, so that the pattern of the silicon substrate is pierced, thus forming a pattern having vertical through-holes. Thus, by using, as a mask material, a substrate solely made of stainless steel as it is, there can be produced a stencil mask which is excellent in mechanical strength and thermal stability and which is not thermally distorted.
    • 使用直径约10μm的厚电极对由不锈钢制成的基板的背面进行放电加工,从而选择性地蚀刻比衬底背面的其它部分的其它部分。 这种放电加工使得除了衬底的边缘之外的其它部分被减薄到约10μm的厚度。 使用直径约3μm的细长电极对如此减薄的基板的表面进行放电加工,从而在基板的表面形成具有预定构造的图案。 此外,利用细长的电极蚀刻衬底的表面,使得硅衬底的图案被刺穿,从而形成具有垂直通孔的图案。 因此,通过使用仅由不锈钢制成的基材作为掩模材料,可以制造机械强度和热稳定性优异且不发生热变形的模板掩模。
    • 137. 发明申请
    • PATTERN FORMATION METHOD
    • 模式形成方法
    • US20110189616A1
    • 2011-08-04
    • US13085232
    • 2011-04-12
    • Masayuki ENDOMasaru Sasago
    • Masayuki ENDOMasaru Sasago
    • G03F7/20
    • G03F7/0035G03F7/2041
    • After forming a lower layer film, an intermediate layer film and a first resist film on a substrate, a first resist pattern is formed by performing first exposure. Then, after a first intermediate layer pattern is formed by transferring the first resist pattern onto the intermediate layer film, a second resist film is formed thereon, and a second resist pattern is formed by performing second exposure. Thereafter, a second intermediate layer pattern is formed by transferring the second resist pattern onto the intermediate layer film. After removing the second resist film, the lower layer film is etched by using the second intermediate layer pattern as a mask, so as to form a lower layer pattern.
    • 在基板上形成下层膜,中间层膜和第一抗蚀剂膜之后,通过进行第一曝光来形成第一抗蚀剂图案。 然后,在通过将第一抗蚀剂图案转印到中间层膜上形成第一中间层图案之后,在其上形成第二抗蚀剂膜,并通过进行第二曝光形成第二抗蚀剂图案。 此后,通过将第二抗蚀剂图案转印到中间层膜上来形成第二中间层图案。 在除去第二抗蚀剂膜之后,通过使用第二中间层图案作为掩模来蚀刻下层膜,以形成下层图案。