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    • 10. 发明申请
    • PATTERN FORMATION METHOD
    • 模式形成方法
    • US20080193882A1
    • 2008-08-14
    • US11958661
    • 2007-12-18
    • Masayuki EndoMasaru Sasago
    • Masayuki EndoMasaru Sasago
    • G03F7/20
    • G03F7/0035G03F7/2041
    • After forming a lower layer film, an intermediate layer film and a first resist film on a substrate, a first resist pattern is formed by performing first exposure. Then, after a first intermediate layer pattern is formed by transferring the first resist pattern onto the intermediate layer film, a second resist film is formed thereon, and a second resist pattern is formed by performing second exposure. Thereafter, a second intermediate layer pattern is formed by transferring the second resist pattern onto the intermediate layer film. After removing the second resist film, the lower layer film is etched by using the second intermediate layer pattern as a mask, so as to form a lower layer pattern.
    • 在基板上形成下层膜,中间层膜和第一抗蚀剂膜之后,通过进行第一曝光来形成第一抗蚀剂图案。 然后,在通过将第一抗蚀剂图案转印到中间层膜上形成第一中间层图案之后,在其上形成第二抗蚀剂膜,并通过进行第二曝光形成第二抗蚀剂图案。 此后,通过将第二抗蚀剂图案转印到中间层膜上来形成第二中间层图案。 在除去第二抗蚀剂膜之后,通过使用第二中间层图案作为掩模来蚀刻下层膜,以形成下层图案。