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    • 117. 发明授权
    • Method of producing electrical semiconductor devices
    • 电半导体器件的制造方法
    • US3271632A
    • 1966-09-06
    • US19580562
    • 1962-05-18
    • INT STANDARD ELECTRIC CORP
    • JOACHIM HARTMANN HORST
    • C30B13/10C30B19/00H01L21/00H01L21/20H01L27/102H01L29/00
    • H01L21/00C30B13/10C30B19/00H01L21/2022H01L27/1021H01L29/00
    • 998,386. Semi-conductor devices. STANDARD TELEPHONES & CABLES Ltd. May 25, 1962 [May 26, 1961], No. 20204/62. Heading H1K. A semi-conductor, e.g. silicon or germanium, device is made by evaporating a layer of amorphous semi-conductor doped with impurities of one conductivity type on a body or layer of the opposite conductivity type and then heating to melt a small area or areas of the layer so that upon recrystallization a PN junction is formed at each area. The body or layer may be cut from a grown crystal, or may be formed by deposition on a cooled substrate to give an amorphous layer which is subsequently crystallized by heating, or on a heated substrate to form a crystalline layer directly. Suitable materials for the substrate are metal, which also forms an electrode, glass, quartz, or ceramic coated with metal by evaporation, or monocrystalline high resistivity semi-conductor. In the latter case the layer may be deposited epitaxially by thermal decomposition of a compound of a semiconductor. Localized heating of the amorphous layer may be produced by bombardment with a beam of electrons. This results in a rapid heating and cooling suitable for producing the abrupt junctions required in tunnel diodes. More diffuse junctions are formed by extending the period of bombardment or by subsequent reheating. The impurities are introduced into the amorphous material prior to or during evaporation. In a typical embodiment, Fig. 2, after deposition of metal 2, semi-conductor 3, and amorphous semi-conductor 4 on glass or quartz substrate 1, area 6, is melted and large area metal contact 7 provided on the recrystallized layer by evaporation. In a similar method to form a diode matrix the amorphous layer is deposited through a mask to form isolated areas in each of which a localized PN junction is formed by scanning with an interrupted electron beam. A transistor configuration is produced by melting two closely spaced areas, or by depositing the amorphous material on both faces of a monocrystalline wafer and melting opposed areas thereof.