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    • 116. 发明授权
    • Multichamber sputtering apparatus
    • 多层溅射装置
    • US5925227A
    • 1999-07-20
    • US859077
    • 1997-05-20
    • Masahiko KobayashiMasahito IshiharaNobuyuki Takahashi
    • Masahiko KobayashiMasahito IshiharaNobuyuki Takahashi
    • C23C14/34C23C14/56H01L21/203H01L21/677
    • C23C14/568
    • A multichamber sputtering apparatus which is used for manufacturing a semiconductor device and the like. In the apparatus, a plurality of sputter chambers and a degas chamber are airtightly connected to and arranged around a center transfer chamber, and processes including sputtering are continuously conducted in a vacuum. A plurality of heat stages are disposed in the degas chamber so that a plurality of substrates are simultaneously heated. In each heat stage, as required, a heating gas introducing unit for introducing a heating gas with causing the heating gas to make contact with the rear face of the substrate, a pressing mechanism which presses the substrate against the heat stage so as to enhance the surface contact between the heat stage and the substrate, or an electrostatic chucking mechanism is disposed.
    • 用于制造半导体器件等的多层溅射装置。 在该装置中,多个溅射室和脱气室与中心传送室气密连接并布置,并且包括溅射在内的处理在真空中连续进行。 多个加热台设置在脱气室中,使多个基板同时加热。 在每个加热阶段,根据需要,加热气体引入单元,用于引入加热气体,使加热气体与基板的背面接触;按压机构,将基板压靠在加热台上,以增强 设置热台和基板之间的表面接触,或静电吸附机构。
    • 120. 发明授权
    • Integrated module multi-chamber CVD processing system and its method for
processing subtrates
    • 集成模块多室CVD处理系统及其处理方法
    • US5534072A
    • 1996-07-09
    • US77687
    • 1993-06-16
    • Shigeru MizunoYoshihiro KatsumataNobuyuki Takahashi
    • Shigeru MizunoYoshihiro KatsumataNobuyuki Takahashi
    • C23C16/44C23C16/455C23C16/458C23C16/54C23C16/00
    • C23C16/45519C23C16/4401C23C16/45521C23C16/4585C23C16/54Y10S414/135Y10S438/908
    • In a CVD processing system for depositing a blanket tungsten film, a distinct shadow is formed without causing any micro-peeling when the substrate fixture is separated from the substrate so as to prevent any blanket tungsten from being deposited on SiO.sub.2, thus reducing the occurrence of fine dust particles. A CVD processing system for depositing a blanket tungsten film, includes a susceptor (4); a ring chuck (9) for affixing the peripheral portion of a substrate (3) on the susceptor; reactive gas supply mechanisms (17, 18 and 19) for supplying reactive gas; and an exhaust mechanism (2) for exhausting unreacted gas and the like, wherein: the ring chuck has at least three point contact members (10) in contact with the peripheral portion of the substrate; the point contact members are provided at positions outside the inner periphery of the ring chuck; a gap (11) is formed at the point contact members between the ring chuck and the substrate; and purge gas supply mechanisms (20 and 21) are provided to blow off purge gas through the gap in order to prevent reactive gas from entering the gap (11). A ratio of the size of the gap to the flow rate of purge gas is set to such an optimum value as to satisfy a condition in which the position of the peripheral portion of the thin film coincides with the position of the inner periphery of the ring chuck.
    • 在用于沉积覆盖钨膜的CVD处理系统中,当衬底夹具与衬底分离时,形成不同的阴影,而不会发生任何微剥离,以防止任何覆盖的钨沉积在SiO 2上,从而减少 细尘粒子。 一种用于沉积覆盖钨膜的CVD处理系统,包括基座(4); 环形卡盘(9),用于将基板(3)的周边部分固定在基座上; 用于供应反应性气体的反应气体供应机构(17,18和19) 以及用于排出未反应气体等的排气机构(2),其中:所述环卡盘具有与所述基板的周边部分接触的至少三点接触构件(10) 点接触构件设置在环卡盘的内周的外侧的位置; 在环卡盘和基板之间的点接触构件处形成间隙(11); 并且提供吹扫气体供给机构(20和21)以吹扫通过间隙的吹扫气体,以防止反应性气体进入间隙(11)。 将间隙尺寸与吹扫气体的流量的比率设定为最佳值,以满足薄膜的周边部分的位置与环的内周的位置一致的条件 卡盘