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    • 111. 发明授权
    • Method for selective deposition and devices
    • 选择性沉积和器件的方法
    • US08153529B2
    • 2012-04-10
    • US12622506
    • 2009-11-20
    • David H. Levy
    • David H. Levy
    • H01L21/302
    • C23C16/04C23C16/45551C23C16/545H01L21/02554H01L21/02642H01L2924/0002H01L2924/00
    • A chemical vapor deposition method such as an atomic-layer-deposition method for forming a patterned thin film includes applying a deposition inhibitor material to a substrate. The deposition inhibitor material is a hydrophilic polymer that is a neutralized acid having a pKa of 5 or less, wherein at least 90% of the acid groups are neutralized. The deposition inhibitor material is patterned simultaneously or subsequently to its application to the substrate, to provide selected areas of the substrate effectively not having the deposition inhibitor material. A thin film is substantially deposited only in the selected areas of the substrate not having the deposition inhibitor material.
    • 用于形成图案化薄膜的诸如原子层沉积方法的化学气相沉积方法包括将沉积抑制剂材料施加到基底上。 沉积抑制剂材料是亲水性聚合物,其是pKa为5或更小的中和酸,其中至少90%的酸基被中和。 沉积抑制剂材料被图案化同时或随后被应用于基底,以提供有效地不具有沉积抑制剂材料的基底的选定区域。 薄膜仅基本沉积在不具有沉积抑制剂材料的基底的选定区域中。