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    • 4. 发明授权
    • Delivery device for deposition
    • 用于沉积的输送装置
    • US08420168B2
    • 2013-04-16
    • US13466507
    • 2012-05-08
    • Roger S. KerrDavid H. LevyJames T. Murray
    • Roger S. KerrDavid H. LevyJames T. Murray
    • C23C16/455C23F1/00H01L21/306C23C16/06C23C16/22
    • B05B1/005C23C16/45551C23C16/45574Y10T29/494Y10T29/49432Y10T29/49826Y10T137/0318Y10T137/87249
    • A delivery device for thin-film material deposition has at least first, second, and third inlet ports for receiving a common supply for a first, a second and a third gaseous material, respectively. Each of the first, second, and third elongated emissive channels allow gaseous fluid communication with one of corresponding first, second, and third inlet ports. The delivery device can be formed from apertured plates, superposed to define a network of interconnecting supply chambers and directing channels for routing each of the gaseous materials from its corresponding inlet port to a corresponding plurality of elongated emissive channels. The delivery device comprises a diffusing channel formed by a relief pattern between facing plates. Also disclosed is a process for thin film deposition. Finally, more generally, a flow diffuser and a corresponding method of diffusing flow is disclosed.
    • 用于薄膜材料沉积的递送装置具有至少第一,第二和第三入口端口,用于分别接收用于第一,第二和第三气态材料的共同供应。 第一,第二和第三细长发射通道中的每一个允许与对应的第一,第二和第三入口端口之一的气态流体连通。 输送装置可以由孔板形成,叠加以形成互连供应室的网络,并且引导通道用于将每个气态材料从其相应的入口端口路由到相应的多个细长的发射通道。 输送装置包括由相对板之间的浮雕图案形成的扩散通道。 还公开了一种用于薄膜沉积的方法。 最后,更一般地,公开了一种流扩散器和相应的扩散流的方法。
    • 8. 发明申请
    • PROCESS FOR FORMING THIN FILM ENCAPSULATION LAYERS
    • 形成薄膜包封层的方法
    • US20120070942A1
    • 2012-03-22
    • US13303513
    • 2011-11-23
    • Elena A. FedorovskayaMichael L. BorosonDavid H. LevyJohn A. Agostinelli
    • Elena A. FedorovskayaMichael L. BorosonDavid H. LevyJohn A. Agostinelli
    • H01L21/56
    • B05D5/00C23C16/403C23C16/405C23C16/45551C23C16/45574H01L51/5253
    • A thin film environmental barrier encapsulation process includes providing an electronic device on a substrate, a first reactant gaseous material, a second reactant gaseous material, an inert gaseous material; and a delivery head through which the reactant gaseous materials and the inert gaseous material are simultaneously directed toward the electronic device and the substrate. One or more of the reactant gaseous materials and the inert gaseous material flows through the delivery head. The flow of the one or more of the reactant gaseous materials and the inert gaseous material generates a pressure to create a gas fluid bearing that maintains a substantially uniform distance between the delivery head and the substrate. Relative motion between the delivery head and the substrate causes the second reactant gaseous material to react with at least a portion of the electronic device and the substrate that has been treated with the first reactant gaseous material.
    • 薄膜环境屏障封装方法包括在基底上提供电子器件,第一反应物气态材料,第二反应物气态物质,惰性气态物质; 以及输送头,反应物气体材料和惰性气体材料通过该输送头同时朝向电子装置和基板。 一种或多种反应物气态物质和惰性气体物质流过输送头。 一种或多种反应物气态物质和惰性气体物质的流动产生压力以产生在输送头和基底之间保持基本均匀距离的气体流体轴承。 输送头和基底之间的相对运动导致第二反应物气态物质与已经用第一反应物气态物质处理的电子器件和基底的至少一部分反应。