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101. 发明授权

US06673655B2 Method of making semiconductor device having improved heat radiation plate arrangement 失效
标题翻译：制造具有改进的散热板布置的半导体器件的方法
公开(公告)号：US06673655B2
公开(公告)日：2004-01-06
申请号：US10152726
申请日：2002-05-23
申请人： Fujio Ito , Hiroaki Tanaka , Hiromichi Suzuki , Tokuji Toida , Takafumi Konno , Kunihiro Tsubosaki , Shigeki Tanaka , Kazunari Suzuki , Akihiko Kameoka
发明人： Fujio Ito , Hiroaki Tanaka , Hiromichi Suzuki , Tokuji Toida , Takafumi Konno , Kunihiro Tsubosaki , Shigeki Tanaka , Kazunari Suzuki , Akihiko Kameoka
IPC分类号： H01L2348
CPC分类号： H01L24/32 , H01L23/4334 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/05554 , H01L2224/29007 , H01L2224/32014 , H01L2224/32055 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/484 , H01L2224/48599 , H01L2224/49171 , H01L2224/49431 , H01L2224/49433 , H01L2224/73265 , H01L2224/85385 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01028 , H01L2924/01029 , H01L2924/01047 , H01L2924/01074 , H01L2924/01079 , H01L2924/0132 , H01L2924/10162 , H01L2924/14 , H01L2924/181 , H01L2924/00 , H01L2924/01026 , H01L2924/00012 , H01L2924/3512 , H01L2224/85399 , H01L2224/05599
摘要： In a semiconductor device having a heat radiation plate, the tips of inner leads connected to a semiconductor chip have a lead width w and a lead thickness t, the width being less than the thickness. The inner leads are secured to the heat radiation plate. Fastening the inner leads to the heat radiation plate supports the latter and eliminates the need for suspending leads. A lead pitch p, the lead width w and lead thickness t of the inner lead tips connected to the semiconductor chip have the relations of w
摘要翻译：在具有散热板的半导体器件中，连接到半导体芯片的内部引线的尖端具有引线宽度w和引线厚度t，宽度小于厚度。内引线固定在散热板上。将内部引线固定到散热板上，支撑后者，并且不需要悬挂引线。引线间距p，连接到半导体芯片的内引线头的引线宽度w和引线厚度t具有w

102. 发明授权

US06553657B2 Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：US06553657B2
公开(公告)日：2003-04-29
申请号：US10277872
申请日：2002-10-23
申请人： Yoshinori Miyaki , Hiromichi Suzuki
发明人： Yoshinori Miyaki , Hiromichi Suzuki
IPC分类号： H01R4300
CPC分类号： H01L23/49541 , H01L21/4842 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/49171 , H01L2924/00014 , H01L2924/01013 , H01L2924/01029 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/181 , Y10T29/49121 , Y10T29/49146 , Y10T29/49171 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： In order to suppress defective lead forming and defective mounting, a semiconductor device comprises a sealing body which has a square planar shape, a semiconductor chip which lies within the sealing body, and a plurality of leads which are electrically connected with electrodes of the semiconductor chip, which extend inside and outside the sealing body and which are arrayed along latera of the sealing body, wherein an outer lead portion of each of the leads is such that a root part which protrudes out of the sealing body is formed at a lead width being equal to or greater than a lead thickness, and that a mounting part which joins to the root part through an intermediate part is formed at a lead width being less than the lead thickness.
摘要翻译：为了抑制铅的形成不良和安装不良，半导体装置包括具有正方形平面形状的密封体，位于密封体内的半导体芯片，以及与半导体芯片的电极电连接的多个引线其在密封体的内部和外部延伸并且沿着密封体的后端排列，其中每个引线的外引线部分使得从引线宽度形成从密封体突出的根部，等于或大于引线厚度，并且通过中间部分连接到根部的安装部分形成为小于引线厚度的引线宽度。

103. 发明授权

US5637914A Lead frame and semiconductor device encapsulated by resin 失效
标题翻译：引线框架和树脂封装的半导体器件
公开(公告)号：US5637914A
公开(公告)日：1997-06-10
申请号：US438467
申请日：1995-05-10
申请人： Naotaka Tanaka , Akihiro Yaguchi , Makoto Kitano , Tatsuya Nagata , Tetsuo Kumazawa , Atsushi Nakamura , Hiromichi Suzuki , Masayoshi Tsugane
发明人： Naotaka Tanaka , Akihiro Yaguchi , Makoto Kitano , Tatsuya Nagata , Tetsuo Kumazawa , Atsushi Nakamura , Hiromichi Suzuki , Masayoshi Tsugane
IPC分类号： H01L21/56 , H01L23/495
CPC分类号： H01L23/49558 , H01L21/565 , H01L23/49541 , H01L23/49548 , H01L2224/451 , H01L2224/48091 , H01L2224/48247 , H01L2224/49171 , H01L24/48 , H01L24/49 , H01L2924/00014 , H01L2924/01078 , H01L2924/01087 , H01L2924/181
摘要： A lead frame for use with a plastic encapsulated semiconductor device includes a tab on which the semiconductor chip is mounted, chip pad supporting leads, inner leads to be electrically coupled with the semiconductor chip, outer leads formed in a monoblock structure together with the inner leads, and a frame for supporting the chip pad supporting leads and outer leads. In the lead frame, there is disposed a dam member only between the outer leads. Alternatively, dummy outer leads are formed between the frame and leads adjacent thereto so as to connect the dummy leads to the outer leads by the dam member. The frame is removed after the semiconductor device is assembled.
摘要翻译：与塑料封装的半导体器件一起使用的引线框架包括其上安装有半导体芯片的突片，芯片焊盘支撑引线，与半导体芯片电耦合的内部引线，与内部引线一起形成为整体结构的外部引线以及用于支撑芯片焊盘支撑引线和外引线的框架。在引线框架中，仅在外引线之间设置阻挡构件。或者，在框架和与其相邻的导线之间形成虚设外引线，以便通过坝构件将虚拟引线连接到外引线。在组装半导体器件之后移除框架。

104. 发明授权

US5250839A Multi-layer leadframes, electrically conductive plates used therefor and production of such conductive plates 失效
标题翻译：多层引线框，用于此的导电板和这种导电板的生产
公开(公告)号：US5250839A
公开(公告)日：1993-10-05
申请号：US765146
申请日：1991-09-25
申请人： Kazunori Katoh , Yuji Yamaguchi , Hiromichi Suzuki , Takayuki Okinaga , Takashi Emata , Osamu Horiuchi
发明人： Kazunori Katoh , Yuji Yamaguchi , Hiromichi Suzuki , Takayuki Okinaga , Takashi Emata , Osamu Horiuchi
IPC分类号： H01L23/495 , H01L23/48 , H01L23/50
CPC分类号： H01L23/49544 , H01L23/49527 , H01L23/49534 , H01L23/49558 , H01L2924/0002
摘要： A multi-layer leadframe according to this invention is formed by laminating on a leadframe body an insulating layer and an electrically conductive layer in this order. The electrically conductive plate includes a planar portion and a given number of terminal portions extending therefrom, said planar portion extending across said insulating layer laminated on said leadframe body. The planar portion is made thinner than the terminal portions. A thin portion of this planar portion is formed by an etching technique, and at least a part of the terminal portions of the electrically conductive plate is fixedly connected with an inner lead of the leadframe body.
摘要翻译：根据本发明的多层引线框架依次层压在引线框体上绝缘层和导电层。导电板包括平面部分和从其延伸的给定数量的端子部分，所述平面部分延伸穿过层压在所述引线框体上的所述绝缘层。平面部分比端子部分薄。通过蚀刻技术形成该平面部分的一部分，并且导电板的端子部分的至少一部分与引线框体的内引线固定连接。

105. 发明授权

US5032895A Semiconductor device and method of producing the same 失效
标题翻译：半导体装置及其制造方法
公开(公告)号：US5032895A
公开(公告)日：1991-07-16
申请号：US510844
申请日：1990-04-18
申请人： Osamu Horiuchi , Gen Murakami , Hiromichi Suzuki , Hajime Hasebe , Kanji Otsuka , Yuuji Shirai , Takayuki Okinaga , Takashi Emata
发明人： Osamu Horiuchi , Gen Murakami , Hiromichi Suzuki , Hajime Hasebe , Kanji Otsuka , Yuuji Shirai , Takayuki Okinaga , Takashi Emata
IPC分类号： H01L21/60 , H01L23/495 , H01L23/498
CPC分类号： H01L23/49527 , H01L23/49537 , H01L23/49558 , H01L23/49861 , H01L24/49 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/49109 , H01L2224/49111 , H01L2224/49171 , H01L24/45 , H01L24/48 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01013 , H01L2924/01014 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/181 , H01L2924/19107 , H01L2924/30107
摘要： A semiconductor device comprising the fact that a semiconductor pellet is arranged on a substantially central part of a film base in which a metal plate is overlaid with an insulating member, while inner leads are arranged on a peripheral part of the film base in a state in which they are electrically isolated from the metal plate of the film base, and that external terminals for a power source among external terminals of the semiconductor pellet and middle parts of the metal plate of the film base, and inner leads for the power source among the inner leads and peripheral parts of the metal plate are electrically connected by pieces of bonding wire, respectively.
摘要翻译：一种半导体器件，包括半导体芯片布置在薄膜基座的大致中央部分，其中金属板覆盖有绝缘构件，而内部引线以薄膜基底的周边部分布置在它们与膜基底的金属板电隔离，并且在半导体芯片的外部端子和膜基底的金属板的中间部分之间的电源的外部端子和用于电源的内部引线金属板的内部引线和外围部分分别通过接合线电连接。

106. 发明授权

US09259176B2 Biological optical measurement instrument and operation method therefor 有权
标题翻译：生物光学测量仪器及其操作方法
公开(公告)号：US09259176B2
公开(公告)日：2016-02-16
申请号：US13880744
申请日：2011-11-02
申请人： Hiromichi Suzuki
发明人： Hiromichi Suzuki
IPC分类号： A61B5/1455 , G01J3/10 , G01J3/28 , G01J3/42 , A61B5/145 , G01N21/31 , G01N21/359
CPC分类号： A61B5/14552 , A61B5/14546 , A61B5/1455 , A61B2560/0252 , A61B2560/0437 , G01J3/10 , G01J3/28 , G01J3/42 , G01N21/359 , G01N2021/3133 , G01N2021/3144 , G01N2021/3155
摘要： A biological optical measurement instrument includes a single temperature sensor that detects a radiation temperature from a plurality of light emitting elements that emit light of a predetermined wavelength, and an absorption coefficient correcting unit that corrects an absorption coefficient value of a notable substance inside the object on the basis of the radiation temperature detected by the temperature sensor, referring to data indicating a correspondence relationship between a temperature obtained in advance for each emitted light of the plurality of light emitting elements and an absorption coefficient value that varies according to the temperature.
摘要翻译：一种生物光学测量仪器，包括从发出预定波长的光的多个发光元件检测辐射温度的单一温度传感器，以及将物体内的显着物质的吸收系数值校正为吸收系数值的吸收系数校正单元，以温度传感器检测出的辐射温度为基础，参照表示多个发光元件的每个发光的预先获得的温度与根据温度变化的吸收系数值之间的对应关系的数据。

107. 发明授权

US09013057B2 Starter circuit for motor vehicle 有权
标题翻译：机动车起动电路
公开(公告)号：US09013057B2
公开(公告)日：2015-04-21
申请号：US13158848
申请日：2011-06-13
申请人： Joaquin A. Pelaez , Brian Reynolds , Kevin Ireland , Hiromichi Suzuki
发明人： Joaquin A. Pelaez , Brian Reynolds , Kevin Ireland , Hiromichi Suzuki
IPC分类号： B60R25/04 , F02N11/08
CPC分类号： F02N11/0862 , F02N11/087
摘要： A starter circuit includes a battery, a starter electrically coupled with the battery, a relay disposed between the battery and the starter, and a starter switch mounted remotely from the starter. The starter includes a switch assembly and a starter motor. The switch assembly includes an actuator and a start signal switch. The relay is configured to operate to provide current to the switch assembly to close the start signal switch in response to a received signal. The starter switch closes in response to the start signal switch being closed, whereby the battery delivers current to the starter motor when the starter switch is closed. A starter unit is also disclosed.
摘要翻译：起动器电路包括电池，与电池电耦合的起动器，设置在电池和起动器之间的继电器以及远离起动器安装的起动开关。起动器包括开关组件和起动电动机。开关组件包括致动器和启动信号开关。继电器被配置为操作以响应于接收到的信号向开关组件提供电流以关闭起始信号开关。启动器开关响应于启动信号开关关闭而关闭，由此当起动器开关闭合时，电池将电流输送到起动电动机。还公开了一个启动器单元。

108. 发明授权

US08757119B2 Engine stopping and restarting system 有权
标题翻译：发动机停机和重启系统
公开(公告)号：US08757119B2
公开(公告)日：2014-06-24
申请号：US13162301
申请日：2011-06-16
申请人： Hiromichi Suzuki
发明人： Hiromichi Suzuki
IPC分类号： F02N11/02 , F02N15/02 , F16H3/44 , H02K7/10 , F02B67/08
CPC分类号： F16H55/36 , B60K6/00
摘要： A system that automatically stops an engine when the vehicle is stopped and restarts the engine in response to a predetermined condition is disclosed. The system may generally include an engine and a motor for restarting the engine and driving an auxiliary machine when the engine is stopped, and an electrical power source for supplying electrical power to the motor. The motor may be disposed within a crank pulley housing and configured to be connected to a crankshaft. The motor may restart the engine in response to a predetermined condition. The system may include a gear reduction system for amplifying the torque provided by the motor. The motor may drive an auxiliary machine when the engine is stopped. The engine may drive the auxiliary machine when the engine is operating in drive.
摘要翻译：公开了一种在车辆停止时自动停止发动机并且响应于预定条件重新启动发动机的系统。该系统通常可以包括用于在发动机停止时重新启动发动机和驱动辅助机器的发动机和马达，以及用于向马达供电的电源。电动机可以设置在曲柄皮带轮壳体内并且被配置为连接到曲轴。电机可以响应于预定条件重新启动发动机。该系统可以包括用于放大由电动机提供的扭矩的齿轮减速系统。发动机停止时，电机可能会驱动辅机。当发动机在驱动器中运行时，发动机可以驱动辅助机器。

109. 发明授权

US08471371B2 Semiconductor wiring assembly, semiconductor composite wiring assembly, and resin-sealed semiconductor device 有权
标题翻译：半导体布线组件，半导体复合布线组件和树脂密封半导体器件
公开(公告)号：US08471371B2
公开(公告)日：2013-06-25
申请号：US12701053
申请日：2010-02-05
申请人： Susumu Baba , Masachika Masuda , Hiromichi Suzuki
发明人： Susumu Baba , Masachika Masuda , Hiromichi Suzuki
IPC分类号： H01L23/495
CPC分类号： H01L24/49 , H01L23/3107 , H01L23/49503 , H01L23/4952 , H01L23/49531 , H01L23/49541 , H01L23/49548 , H01L23/49568 , H01L24/16 , H01L24/28 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/743 , H01L2224/05554 , H01L2224/16 , H01L2224/32225 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48233 , H01L2224/484 , H01L2224/48599 , H01L2224/48647 , H01L2224/48847 , H01L2224/49171 , H01L2224/73265 , H01L2224/743 , H01L2224/85447 , H01L2224/92 , H01L2224/92247 , H01L2924/01005 , H01L2924/01006 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/078 , H01L2924/10162 , H01L2924/12041 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/15173 , H01L2924/15311 , H01L2924/1532 , H01L2924/181 , H01L2924/19107 , H01L2924/00014 , H01L2924/00 , H01L2924/3512 , H01L2924/00012
摘要： A semiconductor composite wiring assembly includes a wiring assembly and a lead frame. A copper wiring layer of the wiring assembly includes first terminals, second terminals, and wiring sections connecting the terminals. The second terminals and the lead frame are electrically connected by connecting members. The lead frame includes a die pad for mounting the wiring assembly, and lead sections located at outer positions. The die pad includes a central area in which a semiconductor chip is mounted via the wiring assembly, and a peripheral area connected to the central area with spaces formed therebetween that serve as resin-seal inflow spaces. The wiring assembly is positioned over the central area and the peripheral area so as to cover the central area completely and the peripheral area partially, and at least the central area and the peripheral area of the die pad are glued to the wiring assembly by resin paste.
摘要翻译：半导体复合布线组件包括布线组件和引线框架。布线组件的铜布线层包括第一端子，第二端子和连接端子的布线部分。第二端子和引线框架通过连接构件电连接。引线框架包括用于安装布线组件的管芯焊盘和位于外部位置的引线部分。芯片焊盘包括通过布线组件安装半导体芯片的中心区域和连接到中心区域的周边区域，其间形成有用作树脂密封流入空间的空间。布线组件位于中心区域和外围区域之上，以完全覆盖中心区域和周边区域，并且至少芯片垫的中心区域和周边区域通过树脂浆料粘合到布线组件。

110. 再颁专利

USRE43443E1 Leadframe semiconductor integrated circuit device using the same, and method of and process for fabricating the two 有权
标题翻译：使用其的引线框半导体集成电路器件及其制造方法和工艺
公开(公告)号：USRE43443E1
公开(公告)日：2012-06-05
申请号：US09987978
申请日：2001-11-16
申请人： Yujiro Kajihara , Kazunari Suzuki , Kunihiro Tsubosaki , Hiromichi Suzuki , Yoshinori Miyaki , Takahiro Naito , Sueo Kawai
发明人： Yujiro Kajihara , Kazunari Suzuki , Kunihiro Tsubosaki , Hiromichi Suzuki , Yoshinori Miyaki , Takahiro Naito , Sueo Kawai
IPC分类号： H01L23/495
CPC分类号： H01L24/743 , H01L21/4842 , H01L23/49503 , H01L23/49513 , H01L23/49541 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/83 , H01L2224/02166 , H01L2224/29007 , H01L2224/2919 , H01L2224/32014 , H01L2224/32055 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/49171 , H01L2224/73265 , H01L2224/743 , H01L2224/82181 , H01L2224/83192 , H01L2224/83194 , H01L2224/838 , H01L2224/85181 , H01L2224/859 , H01L2224/92 , H01L2224/92247 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/14 , H01L2924/1433 , H01L2924/181 , Y10T29/49121 , H01L2924/00012 , H01L2924/00 , H01L2924/3512 , H01L2224/05599
摘要： In order to improve the package body cracking resistance of an LSI package at the reflow soldering and to provide both a leadframe suitable for fabricating the LSI package according to the flexible manufacturing system and an LSI using the leadframe, the adhered area between a semiconductor chip 2 and a resin is enlarged by making the external size of a die pad 3 smaller than that of the semiconductor chip to be mounted thereon. Moreover, a variety of semiconductor chips 2 having different external sizes can be mounted on the die pad 3 by cutting the leading ends of leads 5 to a suitable length in accordance with the external sizes of the semiconductor chips 2.
摘要翻译：为了提高回流焊时的LSI封装的封装体抗开裂性，并且提供适用于制造根据柔性制造系统的LSI封装的引线框和使用引线框的LSI，半导体芯片2 并且通过使管芯焊盘3的外部尺寸小于要安装在其上的半导体芯片的外部尺寸来扩大树脂。此外，通过根据半导体芯片2的外部尺寸将引线5的前端切割成合适的长度，可以将不同的外部尺寸的各种半导体芯片2安装在管芯焊盘3上。

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