会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 95. 发明授权
    • Method of removing copper ions from a bath containing same
    • 从含有它们的浴中除去铜离子的方法
    • US4187166A
    • 1980-02-05
    • US5602
    • 1979-01-22
    • Wayne A. Kruper
    • Wayne A. Kruper
    • F16C33/04C25D3/56C25D3/60C25D5/10C25D7/10C25D21/18C25D21/20C25C1/12
    • C25D7/10C25D21/20C25D3/56
    • A process is provided for electrodepositing a covering layer of lead-tin on the surface of a bearing structure formed by co-electrodepositing lead, copper and tin which process comprises providing a metallic substrate; placing said metallic substrate in an electroplating bath containing lead ions, tin ions and copper ions; passing electrical current through said bath to deposit a layer of lead-tin-copper on the surface of said substrate; removing said so-plated substrate from said bath; subjecting said so-plated substrate to an aqueous rinsing media to remove electrolyte drag-out from said plating bath from the said plated substrate; bring said aqueous rinse media into contact with a metal selected from the group consisting of lead, tin and alloys thereof for a period of time sufficient to cause copper ions in said media to be replaced by ions of said metal and said copper ions to deposit as copper metal on the remainder of said metal; placing said rinsed substrate in an electroplating bath which is essentially devoid of copper ion and which contains both lead ions and tin ions; and passing electrical current through said electroplating bath to deposit a layer of lead-tin on the surface of said substrate.
    • 提供了一种用于在通过共电沉积铅,铜和锡形成的轴承结构的表面上电沉积铅锡的覆盖层的方法,该方法包括提供金属基材; 将所述金属基板放置在含有铅离子,锡离子和铜离子的电镀浴中; 使电流通过所述浴以在所述衬底的表面上沉积铅 - 锡 - 铜层; 从所述浴中去除所述镀覆的基底; 使所述镀覆的基底经受水性漂洗介质以从所述镀覆的基底去除从所述电镀液中脱出的电解质; 使所述含水漂洗介质与选自铅,锡及其合金的金属接触足够长的时间以使所述介质中的铜离子被所述金属和所述铜离子的离子代替以沉积为 在所述金属的剩余部分上的铜金属; 将所述漂洗的基材置于基本上不含铜离子并且含有铅离子和锡离子的电镀浴中; 并使电流通过所述电镀浴以在所述衬底的表面上沉积铅锡层。
    • 98. 发明授权
    • Method of electroplating of aluminum and plating baths therefor
    • 铝电镀方法及电镀槽
    • US4003804A
    • 1977-01-18
    • US645552
    • 1975-12-31
    • Jack Yea Wong
    • Jack Yea Wong
    • C25D3/44C25D3/56C25D21/14C25D21/18
    • C25D3/56C25D21/18C25D3/44
    • Two improved methods are described for the electrodeposition of aluminum or an alloy thereof onto an electrically conducting, preferably metallic, substrate which methods comprise:A. reacting aluminum with hydrogen halide (preferably hydrogen bromide) in the absence of water, and in an aromatic hydrocarbon solvent (toluene) to form a plating hydro aluminum halide cation in solution, the concentration of the plating aluminum cation and the concentration of hydrogen ion, in solution being, respectively, below 7.5M and 1.1M and preferably below 4.2M and 0.5M. Various bromine getters are bubbled or passed through the region of the anode, to react with bromine produced, and to prevent attack of the plated aluminum by the bromine produced, or, alternatively.B. reacting aluminum with hydrogen halide (preferably hydrogen bromide) in an aromatic hydrocarbon solvent to form an anhydrous plating, hydro aluminum bromide cation, in solution, of the type set forth in (a) above, and then adding an alkyl halide to form a different plating species, the amount of alkyl halide added being preferably a small percentage of the amount of aromatic solvent employed.Also, the method of directing the said solutions to a separate electroplating zone and depositing aluminum on a cathode using an inert anode is described.
    • 描述了两种改进的方法,用于将铝或其合金电沉积到导电的,优选金属的基底上,所述方法包括: