专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US4187166A Method of removing copper ions from a bath containing same 失效
标题翻译：从含有它们的浴中除去铜离子的方法
公开(公告)号：US4187166A
公开(公告)日：1980-02-05
申请号：US5602
申请日：1979-01-22
申请人： Wayne A. Kruper
发明人： Wayne A. Kruper
IPC分类号： F16C33/04 , C25D3/56 , C25D3/60 , C25D5/10 , C25D7/10 , C25D21/18 , C25D21/20 , C25C1/12
CPC分类号： C25D7/10 , C25D21/20 , C25D3/56
摘要： A process is provided for electrodepositing a covering layer of lead-tin on the surface of a bearing structure formed by co-electrodepositing lead, copper and tin which process comprises providing a metallic substrate; placing said metallic substrate in an electroplating bath containing lead ions, tin ions and copper ions; passing electrical current through said bath to deposit a layer of lead-tin-copper on the surface of said substrate; removing said so-plated substrate from said bath; subjecting said so-plated substrate to an aqueous rinsing media to remove electrolyte drag-out from said plating bath from the said plated substrate; bring said aqueous rinse media into contact with a metal selected from the group consisting of lead, tin and alloys thereof for a period of time sufficient to cause copper ions in said media to be replaced by ions of said metal and said copper ions to deposit as copper metal on the remainder of said metal; placing said rinsed substrate in an electroplating bath which is essentially devoid of copper ion and which contains both lead ions and tin ions; and passing electrical current through said electroplating bath to deposit a layer of lead-tin on the surface of said substrate.
摘要翻译：提供了一种用于在通过共电沉积铅，铜和锡形成的轴承结构的表面上电沉积铅锡的覆盖层的方法，该方法包括提供金属基材; 将所述金属基板放置在含有铅离子，锡离子和铜离子的电镀浴中; 使电流通过所述浴以在所述衬底的表面上沉积铅 - 锡 - 铜层; 从所述浴中去除所述镀覆的基底; 使所述镀覆的基底经受水性漂洗介质以从所述镀覆的基底去除从所述电镀液中脱出的电解质; 使所述含水漂洗介质与选自铅，锡及其合金的金属接触足够长的时间以使所述介质中的铜离子被所述金属和所述铜离子的离子代替以沉积为在所述金属的剩余部分上的铜金属; 将所述漂洗的基材置于基本上不含铜离子并且含有铅离子和锡离子的电镀浴中; 并使电流通过所述电镀浴以在所述衬底的表面上沉积铅锡层。

2. 发明授权

US4399019A Ultra-high current density electroplating cell 失效
标题翻译：超高电流密度电镀电池
公开(公告)号：US4399019A
公开(公告)日：1983-08-16
申请号：US285593
申请日：1981-07-21
申请人： Wayne A. Kruper , Ralph R. Green
发明人： Wayne A. Kruper , Ralph R. Green
IPC分类号： C25D17/00 , C25D5/08 , C25D7/10 , C25D17/10 , C25D17/12 , C25D21/00 , C25D21/04
CPC分类号： C25D5/08 , C25D7/10
摘要： The electroplating cell includes a reservoir of electroplating solution into which a workpiece supporting and locating structure is able to be lowered. The workpiece supporting structure supports and locates a plurality of semi-cylindrical bearing elements in a column around a cylindrical anode structure. A plating cavity is defined between the bearing elements and the anode structure. The anode structure includes a tubular anode basket having a plurality of apertures therein and a woven liner along its interior. A copper rod is attached to the anode basket and extends along its central axis for supplying electrical potential to pellets of the plating metal disposed within the anode basket and for rotating the anode basket. A plurality of vanes are attached to the exterior of the anode basket for rotation through the plating cavity to stir the plating solution. A first pump circulates plating solution from the reservoir into the plating cavity at a rate of about 20 to 60 gallons per minute and a second pump draws plating solution out of the anode basket at a rate of less than 10 gallons per minute. The remaining solution escapes from the top of the plating cavity and returns to the plating reservoir.
摘要翻译：电镀电池包括电镀溶液的储存器，工件支撑和定位结构能够被降低到其中。工件支撑结构支撑和定位围绕圆柱形阳极结构的列中的多个半圆柱形支承元件。在轴承元件和阳极结构之间限定电镀腔。阳极结构包括其中具有多个孔的管状阳极篮和沿其内部的编织衬里。铜杆附接到阳极筐并沿其中心轴线延伸，以将电位提供给设置在阳极筐内的电镀金属的颗粒并用于旋转阳极筐。多个叶片附接到阳极篮的外部，用于旋转穿过电镀腔以搅拌电镀液。第一泵以约20至60加仑/分钟的速率将电镀溶液从储存器循环到电镀腔中，并且第二泵以小于10加仑/分钟的速率将电镀溶液从阳极筐中抽出出来。剩余的溶液从电镀腔的顶部逸出并返回到电镀槽。

3. 发明授权

US4379031A Evaporation driven counterflow rinse system and method 失效
标题翻译：蒸发驱动逆流冲洗系统及方法
公开(公告)号：US4379031A
公开(公告)日：1983-04-05
申请号：US225709
申请日：1981-01-16
申请人： James A. Krotkiewicz , Wayne A. Kruper , Otto C. Niederer
发明人： James A. Krotkiewicz , Wayne A. Kruper , Otto C. Niederer
IPC分类号： C25D19/00 , C25D17/02 , C25D21/08 , C25D21/16
CPC分类号： C25D21/08
摘要： An electroplating apparatus comprises a plating tank, first, intermediate, and final rinse tanks, and a plurality of weirs which connect the plating tank and the first rinse tank, the first and intermediate rinse tanks, and the intermediate and final rinse tanks. The plating tank is filled to a predetermined level with a plating solution including plating chemicals and water. The rinse tanks are each filled to the predetermined level with rinse solution including water and plating chemicals which have been rinsed from preceding workpieces. The final rinse tank has an overflow outlet at the predetermined level and receives a continuous flow of water. As water evaporates from the plating tank, rinse solution flows by gravity through the connecting weir to the plating tank to replace it. Similarly, rinse solution flows by gravity through the connecting weir from the intermediate rinse tank to the first rinse tank and flows by gravity through the connecting weir from the final rinse tank to the intermediate rinse tank. The continuous flow of water into the final rinse tank replaces the solution flowing by gravity to the intermediate rinse tank thus maintaining the plating and rinse tanks at the predetermined level. To prevent plating chemicals from migrating from more concentrated solutions to less concentrated solutions, baffles are placed in each of the weirs. The baffles render the flow paths sufficiently long and tortuous so that the evaporation replacing flow offsets the migration of plating chemicals toward less concentrated solutions.
摘要翻译：电镀设备包括电镀槽，第一，中间和最终漂洗槽以及连接镀槽和第一漂洗槽，第一和中间漂洗槽以及中间和最终冲洗槽的多个堰。电镀槽用包括电镀化学品和水的电镀液填充到预定水平。冲洗槽各自用前述工件冲洗的包括水和电镀化学品的冲洗溶液填充到预定水平。最终的漂洗槽具有预定水平的溢流出口并且接收连续的水流。当水从镀槽蒸发时，冲洗液通过重力流经连接的堰流到镀槽以更换。类似地，漂洗溶液通过重力通过连接的堰从中间漂洗槽流到第一冲洗槽，并通过重力通过连接的堰从最终的漂洗槽流到中间漂洗槽。将水连续流入最终的漂洗槽将重力流动的溶液替换到中间漂洗槽，从而将镀液和漂洗池保持在预定水平。为了防止电镀化学品从更浓缩的溶液迁移到较不浓缩的溶液中，将挡板放置在每个堰中。挡板使得流动路径足够长且曲折，使得蒸发置换流量抵消电镀化学品向较不集中的溶液的迁移。

4. 发明授权

US4170525A Process for plating a composite structure 失效
标题翻译：复合结构电镀工艺
公开(公告)号：US4170525A
公开(公告)日：1979-10-09
申请号：US900953
申请日：1978-04-28
申请人： Lyle E. Kirman , Wayne A. Kruper
发明人： Lyle E. Kirman , Wayne A. Kruper
IPC分类号： C23C18/31 , C25D5/36 , C25D5/44
CPC分类号： C23C18/31 , Y10T428/12736
摘要： A process is provided for plating a composite structure which includes one surface composed of an aluminum base metal and another surface composed of a ferrous base metal with a thin adherent layer of tin or an alloy of tin. The process comprises contacting the composite structure with a mineral acid containing a source of ions selected from the group consisting of fluoride ions, fluoride containing ions or mixtures thereof to activate the surface of the aluminum base metal and then immersing the composite structure in an aqueous plating bath which contains a mineral acid, a source of ions selected from the group consisting of fluoride ions, fluoride containing ions or mixtures thereof and a source of stannous ions with the stannous ions being present in an amount ranging from about 1 to about 75 grams per liter, for a period of time sufficient to cause tin or tin alloy to be deposited concurrently on the aluminum base metal surface by the exchange of aluminum ions for tin ions and on the ferrous base surface by means of a galvanic couple formed between the aluminum base metal and the ferrous base metal.
摘要翻译：提供了一种用于电镀复合结构的方法，该复合结构包括由铝基底金属构成的一个表面和由铁基金属组成的另一表面，其具有薄的锡的粘附层或锡的合金。该方法包括使复合结构与含有选自氟离子，含氟离子或其混合物的离子源的无机酸接触以活化铝贱金属的表面，然后将复合结构浸入含水电镀液包含无机酸的洗涤液，选自氟离子，含氟离子或其混合物的离子源和亚锡离子源，其中亚锡离子的量为约1至约75克/ 升一段时间，足以使锡或锡合金通过铝离子交换锡离子同时沉积在铝基金属表面上，并且通过在铝基体之间形成的电耦合而在铁基材表面上金属和铁基金属。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式