会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 92. 发明申请
    • INTUMESCENT COATING COMPOSITION COMPRISING PARTICULATE POLY(PHENYLENE ETHER)
    • 包含颗粒状聚(苯乙烯)的包封组合物
    • US20150004402A1
    • 2015-01-01
    • US13930456
    • 2013-06-28
    • SABIC Innovative Plastics IP B.V.
    • EYLEM TARKIN-TASEDWARD NORMAN PETERS
    • C09D5/18
    • C09D5/185C09D4/06C09D133/12C09D163/00C09D171/12Y10T428/269Y10T428/31678C08L71/12
    • An intumescent coating composition having improved char yield, while maintaining its physical, mechanical, and esthetic properties comprises (a) particulate poly(phenylene ether), wherein the mean particle size of the poly(phenylene ether) is 1 to 100 micrometers; (b) a film-forming binder; (c) an acid source; (d) a blowing agent; and (e) optionally, a carbon source other than the particulate poly(phenylene ether); wherein polyolefins, homopolystyrenes, rubber-modified polystyrenes, styrene-containing copolymers, and hydrogenated and unhydrogenated block copolymers of an alkenyl aromatic compound and a conjugated diene are all absent from the composition. A method of forming the intumescent coating composition comprises: mixing the particulate poly(phenylene ether), the film-forming binder, the acid source, and the blowing agent, wherein the particulate poly(phenylene ether) has a glass transition temperature, and wherein the mixing is carried out at a temperature below the glass transition temperature of the particulate poly(phenylene ether).
    • 具有改善的焦炭产率,同时保持其物理,机械和美学性质的膨胀型涂料组合物包含(a)聚(苯醚)颗粒,其中聚(苯醚)的平均粒度为1至100微米; (b)成膜粘合剂; (c)酸源; (d)发泡剂; 和(e)任选地,除了聚(亚苯基醚)颗粒之外的碳源; 其中组合物中不存在烯烃芳族化合物和共轭二烯的聚烯烃,均聚苯乙烯,橡胶改性的聚苯乙烯,含苯乙烯的共聚物和氢化和未氢化的嵌段共聚物。 形成膨胀型涂料组合物的方法包括:将聚亚苯基醚,成膜粘合剂,酸源和发泡剂混合,其中聚苯醚颗粒具有玻璃化转变温度,其中 混合在低于聚(苯醚)颗粒的玻璃化转变温度的温度下进行。
    • 94. 发明申请
    • Release film for printed wiring board production
    • 印刷线路板生产用剥离膜
    • US20070003763A1
    • 2007-01-04
    • US10550063
    • 2004-04-15
    • Hiroshi KamoYuuji Kusumi
    • Hiroshi KamoYuuji Kusumi
    • B32B27/32B32B27/30
    • C08J5/18C08J2371/12C08L71/123C09D171/12Y10T428/31504Y10T428/31931Y10T428/31935
    • The present invention relates to a mold releasing film for printed circuit board production, which comprises a resin layer (P) containing (A) a polyphenylene ether-based resin in an amount of 50 wt % or more. According to the present invention, it is possible to provide a mold releasing film suitable for production of printed circuit boards, particularly flexible printed circuit boards, which is excellent in mold-releasing property, exhibits little heat shrinkage, hardly imparts wrinkles to printed circuit board products, itself hardly gets wrinkled, and is excellent in contamination resistance since no bleeding-out is observed, and which is also excellent in an anti-moisture absorbing property, shape-following property, less overflow of adhesive, adhesion between multilayer films and slipping property between films.
    • 本发明涉及一种用于印刷电路板制造的脱模膜,其包括含有(A)50重量%以上的聚苯醚系树脂的树脂层(P)。 根据本发明,可以提供一种适用于生产印刷电路板,特别是柔性印刷电路板的脱模膜,其脱模性优异,几乎没有热收缩,几乎不会对印刷电路板产生皱纹 产品本身几乎不起皱,耐污染性优异,因为没有观察到渗出,并且还具有优异的抗吸湿性,形状跟随性,较少的粘合剂溢出,多层膜之间的粘附和滑动 电影之间的财产。