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91. 发明授权

US09051176B2 Massively parallel assembly of composite structures using depletion attraction 有权
标题翻译：使用耗尽吸引力大量平行组装复合结构
公开(公告)号：US09051176B2
公开(公告)日：2015-06-09
申请号：US12524946
申请日：2008-02-04
申请人： Thomas G. Mason
发明人： Thomas G. Mason
IPC分类号： B81C3/00 , B81C99/00 , G03F7/40
CPC分类号： B81C99/008 , B81C3/002 , B81C3/005 , B81C2201/0149 , B81C2201/0159 , B81C2203/057 , G03F7/40 , Y10T428/24802
摘要： Producing composite structures includes dispersing a first plurality of objects, a second plurality of objects, and a third plurality of objects in a fluid, the third and second plurality of objects having an average maximum dimension that is smaller than the first plurality of objects The first plurality of objects comprise a first, a second, a third and a forth object, each having mating surface regions The first and second objects' mating surfaces are complimentary and the third and forth objects' mating surfaces are complementary The first and second object aggregate together in response to the dispersing of the second plurality of objects in the fluid due to a depletion attraction between the first and the second object The third and forth object aggregate together in response to dispersing the third plurality of objects in the fluid due to a depletion attraction between the third and the fourth object.
摘要翻译：生产复合结构包括将第一多个物体，第二多个物体和第三多个物体分散在流体中，第三和第二多个物体具有小于第一多个物体的平均最大尺寸。第一多个物体包括具有配合表面区域的第一，第二，第三和第四物体。第一和第二物体的配合表面是互补的，并且第三和第四物体的配合表面是互补的。第一和第二物体聚集在一起响应于由于第一和第二物体之间的耗尽引力而使第二多个物体在流体中的分散。第三和第四个物体响应于由于耗尽吸力而将第三多个物体分散在流体中而聚集在一起在第三和第四个物体之间。

92. 发明申请

US20140124898A1 CVD-FREE, SCALABLE PROCESSES FOR THE PRODUCTION OF SILICON MICRO- AND NANOSTRUCTURES 有权
标题翻译：无CVD，生产硅微结构和纳米结构的可扩展工艺
公开(公告)号：US20140124898A1
公开(公告)日：2014-05-08
申请号：US14076094
申请日：2013-11-08
申请人： Brewer Science Inc.
发明人： Jyoti K. Malhotra , Jeff Leith , Curtis Planje
IPC分类号： H01L21/308 , G03F1/22 , H01L29/06
CPC分类号： H01L29/0676 , B81C1/00111 , B81C99/008 , B82Y10/00 , B82Y40/00 , G03F1/50 , G03F7/0035 , H01L21/0259 , H01L21/02606 , H01L29/0665 , H01L29/0669 , H01L51/0048
摘要： Manufacturing-friendly and scalable methods for the production of silicon micro- and nanostructures, including silicon nanotubes, are described. The inventive methods utilize conventional integrated circuit and MEMS manufacturing processes, including spin-coating, photolithography, wet and dry silicon etching, and photoassisted electrochemical etch processes. The invention also provides a novel mask, for maximizing the number of tubes obtained per surface area unit of the silicon substrate on which the tubes are built. The resulting tubes have thick and straight outer walls, as well as high aspect ratios.
摘要翻译：描述了用于生产硅微纳米结构（包括硅纳米管）的制造友好且可扩展的方法。本发明的方法利用传统的集成电路和MEMS制造工艺，包括旋涂，光刻，湿和干硅蚀刻以及光辅助电化学蚀刻工艺。本发明还提供了一种新颖的掩模，用于最大化在其上构建管的硅衬底的每表面积单位获得的管的数目。所得到的管具有厚而直的外壁以及高纵横比。

93. 发明授权

US08709957B2 Spalling utilizing stressor layer portions 有权
标题翻译：剥落应力应力层部分
公开(公告)号：US08709957B2
公开(公告)日：2014-04-29
申请号：US13481062
申请日：2012-05-25
申请人： Stephen W. Bedell , Keith E. Fogel , Paul A. Lauro , Ning Li , Devendra K. Sadana , Ibrahim Alhomoudi
发明人： Stephen W. Bedell , Keith E. Fogel , Paul A. Lauro , Ning Li , Devendra K. Sadana , Ibrahim Alhomoudi
IPC分类号： H01L21/31 , H01L21/469
CPC分类号： H01L21/304 , B81C99/008 , H01L21/02002
摘要： A method for spalling local areas of a base substrate utilizing at least one stressor layer portion which is located on a portion, but not all, of an uppermost surface of a base substrate. The method includes providing a base substrate having a uniform thickness and a planar uppermost surface spanning across an entirety of the base substrate. At least one stressor layer portion having a shape is formed on at least a portion, but not all, of the uppermost surface of the base substrate. Spalling is performed which removes a material layer portion from the base substrate and provides a remaining base substrate portion. The material layer portion has the shape of the at least one stressor layer portion, while the remaining base substrate portion has at least one opening located therein which correlates to the shape of the at least one stressor layer.
摘要翻译：利用位于基底的最上表面的一部分但不是全部的至少一个应力层部分剥离基底基板的局部区域的方法。该方法包括提供具有均匀厚度的基底基底和跨越整个基底基底的平面最上表面。至少一个具有形状的应力层部分形成在基底基板的最上表面的至少一部分但不是全部。进行剥离，其从基底基板移除材料层部分并提供剩余的基底部分。材料层部分具有至少一个应力层部分的形状，而剩余的基底部分具有位于其中的至少一个与至少一个应力层的形状相关的开口。

94. 发明申请

US20130316542A1 SPALLING UTILIZING STRESSOR LAYER PORTIONS 有权
标题翻译：使用压力层的方法
公开(公告)号：US20130316542A1
公开(公告)日：2013-11-28
申请号：US13481062
申请日：2012-05-25
申请人： Stephen W. Bedell , Keith E. Fogel , Paul A. Lauro , Ning Li , Devendra K. Sadana , Ibrahim Alhomoudi
发明人： Stephen W. Bedell , Keith E. Fogel , Paul A. Lauro , Ning Li , Devendra K. Sadana , Ibrahim Alhomoudi
IPC分类号： H01L21/31
CPC分类号： H01L21/304 , B81C99/008 , H01L21/02002
摘要： A method for spalling local areas of a base substrate utilizing at least one stressor layer portion which is located on a portion, but not all, of an uppermost surface of a base substrate. The method includes providing a base substrate having a uniform thickness and a planar uppermost surface spanning across an entirety of the base substrate. At least one stressor layer portion having a shape is formed on at least a portion, but not all, of the uppermost surface of the base substrate. Spalling is performed which removes a material layer portion from the base substrate and provides a remaining base substrate portion. The material layer portion has the shape of the at least one stressor layer portion, while the remaining base substrate portion has at least one opening located therein which correlates to the shape of the at least one stressor layer.
摘要翻译：利用位于基底的最上表面的一部分但不是全部的至少一个应力层部分剥离基底基板的局部区域的方法。该方法包括提供具有均匀厚度的基底基底和横跨整个基底基底的平面最上表面。至少一个具有形状的应力层部分形成在基底基板的最上表面的至少一部分但不是全部。进行剥离，其从基底基板移除材料层部分并提供剩余的基底部分。材料层部分具有至少一个应力层部分的形状，而剩余的基底部分具有位于其中的至少一个与至少一个应力层的形状相关的开口。

95. 发明申请

US20130285267A1 FABRICATION METHOD OF NANOPARTICLE 有权
标题翻译：纳米材料的制备方法
公开(公告)号：US20130285267A1
公开(公告)日：2013-10-31
申请号：US13530104
申请日：2012-06-21
申请人： Chih-Chung Yang , Hung-Yu Tseng , Wei-Fang Chen , Che-Hao Liao , Yu-Feng Yao
发明人： Chih-Chung Yang , Hung-Yu Tseng , Wei-Fang Chen , Che-Hao Liao , Yu-Feng Yao
IPC分类号： B29B9/12 , B82Y40/00
CPC分类号： B82Y40/00 , B81C99/008
摘要： A fabrication method of nanoparticles is provided. A substrate having a plurality of pillar structures is provided and then a plurality of ring structures is formed to surround the plurality of the pillar structures. The inner wall of each ring structure surrounds the sidewall of each pillar structure. A portion of each pillar structure is removed to reduce the height of each pillar structure and to expose the inner wall of each ring structure. The ring structures are separated from the pillar structures to form a plurality of nanoparticles. Surface modifications are applied to the ring structures before the ring structures are separated from the pillar structures on the substrate.
摘要翻译：提供了纳米颗粒的制造方法。提供具有多个支柱结构的基板，然后形成多个环形结构以围绕多个支柱结构。每个环结构的内壁围绕每个支柱结构的侧壁。每个柱结构的一部分被去除以减小每个柱结构的高度并暴露每个环结构的内壁。环结构与柱结构分离以形成多个纳米颗粒。在将环结构与衬底上的柱结构分离之前，对环结构进行表面改性。

96. 发明授权

US08481248B2 Method for fabricating micromachine component of resin 失效
标题翻译：制造树脂微机械部件的方法
公开(公告)号：US08481248B2
公开(公告)日：2013-07-09
申请号：US11922529
申请日：2006-06-15
申请人： Nao Honda , Satoshi Mori , Shuji Tanaka , Masayoshi Esashi
发明人： Nao Honda , Satoshi Mori , Shuji Tanaka , Masayoshi Esashi
IPC分类号： G03F7/22
CPC分类号： F04D29/281 , B29C64/106 , B29C64/124 , B29L2031/7496 , B81C99/008 , F04D29/023 , F05D2230/31 , F05D2300/44
摘要： A method for fabricating a micromachine component of resin comprising step (a) of forming a sacrifice layer on a substrate, step (b) of forming at least two photosensitive resin composition layers sequentially on the sacrifice layer, and performing photolithography of each photosensitive resin composition layer to form an air gap portion defining the circumferential edge portion of the micromachine component and an air gap portion where an internal structure of the micromachine component is constituted to form a multilayer structure, step (c) for depositing dry film resist on the multilayer structure of the cured photosensitive resin composition layer, and performing photolithography of the dry film resist layer to form a cured dry film resist layer in which an air gap portion defining the circumferential edge of a shroud layer and an air gap where the structure of the shroud layer is constituted are formed, and step (d) for separating the micromachine component having the multilayer structure of the cured photosensitive resin composition layer and the cured dry film resist layer from the substrate by removing the sacrifice layer.
摘要翻译：一种用于制造树脂微机械部件的方法，包括在基板上形成牺牲层的步骤（a），在牺牲层上依次形成至少两个感光性树脂组合物层的步骤（b），并对各感光性树脂组合物进行光刻形成限定微机械部件的周缘部的气隙部和构成微机械部件的内部结构的气隙部，形成多层结构，在多层结构体上设置干膜抗蚀剂的工序（c）并进行干膜抗蚀剂层的光刻，形成固化的干膜抗蚀剂层，其中限定了护罩层的周缘的气隙部分和护罩层的结构的气隙形成，并且步骤（d）用于分离具有多层的微机械部件通过除去牺牲层从固化的光敏树脂组合物层和固化的干膜抗蚀剂层结构。

97. 发明申请

US20130095574A1 METHOD FOR PRODUCING MICROPARTICLES 有权
标题翻译：生产微生物的方法
公开(公告)号：US20130095574A1
公开(公告)日：2013-04-18
申请号：US13446499
申请日：2012-04-13
申请人： Nicolas DEMIERRE , Stephan GAMPER
发明人： Nicolas DEMIERRE , Stephan GAMPER
IPC分类号： B44C1/22
CPC分类号： B44C1/227 , B01J2219/00497 , B01J2219/00502 , B01J2219/00536 , B01J2219/00554 , B01J2219/00556 , B01J2219/00576 , B01J2219/00612 , B01J2219/00635 , B01J2219/00637 , B01J2219/00722 , B81C99/008 , G03F7/00 , H01L21/0272
摘要： Silicon microcarriers suitable for fluorescent assays as a well as a method of producing such microcarriers are provided. The method includes the steps of providing a SOI wafer having a bottom layer of monocristalline silicone, an insulator layer and a bottom layer of monocristalline silicon, delineating microparticles, etching away the insulator layer and then depositing an oxide layer on the wafer still holding the microparticles before finally lifting-off the microparticles.
摘要翻译：提供了适合于荧光测定的硅微载体以及生产这种微载体的方法。该方法包括以下步骤：提供具有单晶硅的底层的SOI晶片，绝缘层和单晶硅的底层，描绘微粒，蚀刻绝缘体层，然后在保持微粒的晶片上沉积氧化物层之后才能最终提起微粒。

98. 发明授权

US08423153B2 Method for producing implant structures for contacting or electrostimulation of living tissue cells or nerves 有权
标题翻译：用于生产用于接触或电刺激活组织细胞或神经的植入物结构的方法
公开(公告)号：US08423153B2
公开(公告)日：2013-04-16
申请号：US12296519
申请日：2007-01-26
申请人： Hans-Jurgen Tiedtke
发明人： Hans-Jurgen Tiedtke
IPC分类号： A61N1/04
CPC分类号： A61N1/05 , A61N1/0543 , A61N1/0551 , B81C99/008 , B81C2201/0107 , B81C2201/0181 , Y10T428/12493
摘要： The object, to create a method for producing multilayers or multilayer systems wherein the structures generated on a substrate can easily be jointly detached from the substrate and are preserved in a composite, is achieved by the present invention by means of a method for producing implant structures comprising generating a first metal layer on a substrate, generating a second metal layer above the first metal layer, producing a number of multilayered implant structures above the second metal layer, removing the first metal layer between the substrate and the second metal layer, and releasing the implant structures from the substrate in a coherent composite. With the method according to the invention, between the implant structures and the substrate a release layer is generated consisting of two or three metal layers which serve as sacrificial layer in the course of releasing the fully processed multilayers by means of an under-etching process. As a result, a uniform and reliable separation of the finished multilayers from the substrate in a composite is achieved, facilitating the subsequent technology for assembly and interconnection of the implant structures.
摘要翻译：本发明的目的是为了产生多层或多层体系的制造方法，其中在衬底上产生的结构可以容易地与衬底共同分离并且被保存在复合材料中，这通过本发明通过生产植入结构的方法来实现包括在衬底上产生第一金属层，在第一金属层上方产生第二金属层，在第二金属层之上产生多个多层植入结构，去除衬底和第二金属层之间的第一金属层，并释放在相干复合材料中来自基底的植入物结构。利用根据本发明的方法，在植入结构和衬底之间，产生剥离层，其由在蚀刻过程中释放完全处理的多层膜的过程中用作牺牲层的两个或三个金属层组成。结果，实现了在复合材料中完成的多层与基底的均匀可靠的分离，有助于随后的用于植入结构的组装和互连的技术。

99. 发明授权

US08398865B2 Method of manufacturing a micromechanical part 有权
标题翻译：微机械部件的制造方法
公开(公告)号：US08398865B2
公开(公告)日：2013-03-19
申请号：US12501009
申请日：2009-07-10
申请人： Rudolf Dinger , Thierry Ravenel
发明人： Rudolf Dinger , Thierry Ravenel
IPC分类号： C23F1/00
CPC分类号： B81C99/008 , B81B2201/035 , B81C1/00674 , B81C2201/112 , G04B13/02 , G04D3/0069 , Y10T29/49579
摘要： A method of manufacturing a mechanical part includes the steps of providing a micro-machinable substrate; etching a pattern which includes the part through the entire substrate using photolithography; mounting the etched substrate on a support so as to leave the top and bottom surfaces of said substrate accessible for coating; depositing a tribological quality improving coating of on the outer surface of the part; and releasing the part from the substrate.
摘要翻译：制造机械部件的方法包括提供可微加工的基板的步骤; 使用光刻法蚀刻通过整个基板包括该部分的图案; 将蚀刻的基板安装在支撑件上，以便使所述基板的顶表面和底表面可接近以进行涂覆; 在部件的外表面上沉积摩擦学质量改进涂层; 并从基底释放该部分。

100. 发明授权

US08338311B2 Method for the production of structured layers of titanium and nickel 失效
标题翻译：用于生产钛和镍结构层的方法
公开(公告)号：US08338311B2
公开(公告)日：2012-12-25
申请号：US12306646
申请日：2007-06-27
申请人： Eckhard Quandt , Clemens Schmutz , Christiane Zamponi
发明人： Eckhard Quandt , Clemens Schmutz , Christiane Zamponi
IPC分类号： H01L21/302
CPC分类号： C23C14/0005 , A61L27/06 , A61L31/022 , B81B2201/06 , B81C99/008 , Y10T428/24917
摘要： A method for the production of a structured metal layer (7) made from an alloy composed of titanium and nickel includes the following process steps: a sacrificial layer composite (3) is provided, which comprises a second sacrificial layer (2) applied onto a first sacrificial layer (1), the first sacrificial layer (1) is subjected for the purpose of structuring to a wet-chemical etching process in such a manner that undercutting of the sacrificial layer (1) occurs, a metal layer (7) of the alloy is applied indirectly or directly to the structured sacrificial layer composite (3). The first sacrificial layer (1) is at a greater distance from the metal layer (7). The second sacrificial layer (2) facing the metal layer (7) to be deposited is subjected to a dry etching process prior to wet-chemical etching of the first sacrificial layer (1) so that the second sacrificial layer (2) is provided with a structure that corresponds to the desired structure of the metal layer (7). The invention further relates to an object, particularly a stent or an implant, which comprises at least one metal layer (7) that is produced by applying the method for the production of the structured metal layer (7).
摘要翻译：制造由钛和镍组成的合金制成的结构金属层（7）的方法包括以下工艺步骤：提供牺牲层复合材料（3），该牺牲层复合材料（3）包括第二牺牲层（2）第一牺牲层（1），第一牺牲层（1）的目的是以如下方式进行湿法化学蚀刻工艺的构造：使牺牲层（1）发生底切，金属层（7）该合金间接或直接施加到结构化牺牲层复合材料（3）上。第一牺牲层（1）距离金属层（7）更大的距离。在第一牺牲层（1）的湿化学蚀刻之前，面对要沉积的金属层（7）的第二牺牲层（2）进行干蚀刻处理，使得第二牺牲层（2）设置有对应于金属层（7）的所需结构的结构。本发明还涉及一种物体，特别是支架或植入物，其包括通过施加用于生产结构化金属层（7）的方法而产生的至少一个金属层（7）。

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