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    • 91. 发明授权
    • Resist pattern forming method using anti-reflective layer, resist pattern formed, and method of etching using resist pattern and product formed
    • 使用抗反射层的抗蚀剂图案形成方法,形成的抗蚀剂图案,以及形成的抗蚀剂图案和产品的蚀刻方法
    • US06255036B1
    • 2001-07-03
    • US09664554
    • 2000-09-18
    • Toshihiko TanakaShoichi UchinoNaoko Asai
    • Toshihiko TanakaShoichi UchinoNaoko Asai
    • G03C500
    • G03F7/091Y10S430/151
    • Disclosed are methods for forming a resist pattern which solve a problem (dimensional precision degradation) caused by halation and interference phenomena due to reflected light from the substrate, and which are fine and have high precision even with substrates having high reflectivity or substrates having a transparent film or substrates with an uneven surface. A first method forms between the substrate and resist film an anti-reflective film whose photoabsorbance of the exposure light is greater on the substrate surface side than on the resist surface side. A second method forms between the substrate and resist film a two-layer anti-reflective film made up of an upper-layer film which is an interference film for the exposure light and a lower-layer film which has higher exposure light absorbance than the upper-layer film and functions as a light shielding film. A third method forms between the substrate and resist film a two-layer anti-reflective film consisting of a lower-layer film that reflects the exposure light and an upper-layer film that is an interference film for the exposure light. A very high anti-reflection effect can be obtained without aspect ratio problems during the process of forming the anti-reflective film and without being influenced by the kind of substrate including those having a transparent film. With these methods, it is possible to form a fine and highly precise resist pattern. These methods can be used to form patterned resist films to etch object films, e.g., in forming microcircuits and/or gates (and word lines) of semiconductor devices.
    • 公开了形成抗蚀剂图案的方法,其解决了由于来自基板的反射光引起的由于偏光和干涉现象引起的问题(尺寸精度降低),即使具有高反射率的基板或具有透明度的基板也是精细且具有高精度 膜或具有不平坦表面的基底。 在基板和抗蚀剂膜之间形成第一种方法,其中在基板表面侧的曝光光的光吸收性大于在抗蚀剂表面侧上的抗反射膜。 在基板和抗蚀剂膜之间形成由作为曝光用的干涉膜的上层膜构成的双层抗反射膜的第二种方法和具有比上层的曝光吸光度高的下层膜 并且用作遮光膜。 在基板和抗蚀剂膜之间形成由反射曝光光的下层膜构成的两层抗反射膜和作为曝光用光的干涉膜的上层膜的第三种方法。 在形成抗反射膜的过程中可以获得非常高的抗反射效果,而不受包括具有透明膜的基板的种类的影响。 利用这些方法,可以形成精细且高精度的抗蚀剂图案。 这些方法可以用于形成图案化的抗蚀剂膜以蚀刻对象膜,例如在形成半导体器件的微电路和/或栅极(和字线)中。
    • 92. 发明授权
    • Objective lens switching device
    • 物镜切换装置
    • US6154312A
    • 2000-11-28
    • US158471
    • 1998-09-22
    • Yasuteru TakahamaMitsuhiko SaitoToshihiko Tanaka
    • Yasuteru TakahamaMitsuhiko SaitoToshihiko Tanaka
    • G02B21/24G02B21/00
    • G02B21/248
    • An objective lens switching device of the present invention is a device in which assembly and adjustment in order to correctly position each objective lens on an optical axis are easy and a switching action can quickly be performed with certainty without receiving an influence of a mounting condition of objective lenses or a change in the revolver over time in use. A CPU reads an angular displacement from an angle sensor from a revolution position of a turret outside a detection range of an engagement sensor and issues a command of start braking to a driver when the angular displacement reaches a predetermined given angle. A revolution position of the turret at which the CPU starts the braking is correctly set all the time since the detection range of the engagement sensor and an engagement position of the turret are correctly adjusted.
    • 本发明的物镜切换装置是将各物镜在光轴上正确地进行组装和调整的装置,容易地进行切换动作,而不会受到安装条件的影响 物镜或随着时间推移使用的左轮手枪的变化。 CPU从角度传感器从接合传感器的检测范围之外的转台的旋转位置读取角位移,并且当角位移达到预定的给定角度时向驾驶员发出开始制动的命令。 由于接合传感器的检测范围和转台的接合位置被正确调整,所以始终正确地设置CPU开始制动的转塔的转动位置。
    • 97. 发明授权
    • Resist pattern forming method using anti-reflective layer, resist
pattern formed, and method of etching using resist pattern and product
formed
    • 使用抗反射层的抗蚀剂图案形成方法,形成的抗蚀剂图案,以及形成的抗蚀剂图案和产品的蚀刻方法
    • US5733712A
    • 1998-03-31
    • US601361
    • 1996-02-16
    • Toshihiko TanakaShoichi UchinoNaoko Asai
    • Toshihiko TanakaShoichi UchinoNaoko Asai
    • G03F7/09G03C1/825
    • G03F7/091Y10S430/151
    • A first method forms between the substrate and resist film an anti-reflective film whose photoabsorbance of the exposure light is greater on the substrate surface side than on the resist surface side. A second method forms between the substrate and resist film a two-layer anti-reflective film made up of an upper-layer film which is an interference film for the exposure light and a lower-layer film which has higher exposure light absorbance than the upper-layer film and functions as a light shielding film. A third method forms between the substrate and resist film a two-layer anti-reflective film consisting of a lower-layer film that reflects the exposure light and an upper-layer film that is an interference film for the exposure light. A very high anti-reflection effect can be obtained without aspect ratio problems during the process of forming the anti-reflective film and without being influenced by the kind of substrate including those having a transparent film. With these methods, it is possible to form a fine and highly precise resist pattern. These methods can be used to form patterned resist films to etch object films, e.g., in forming microcircuits and/or gates (and word lines) of semiconductor devices.
    • 在基板和抗蚀剂膜之间形成第一种方法,其中在基板表面侧的曝光光的光吸收性大于在抗蚀剂表面侧上的抗反射膜。 在基板和抗蚀剂膜之间形成由作为曝光用的干涉膜的上层膜构成的双层抗反射膜的第二种方法和具有比上层的曝光吸光度高的下层膜 并且用作遮光膜。 在基板和抗蚀剂膜之间形成由反射曝光光的下层膜构成的两层抗反射膜和作为曝光用光的干涉膜的上层膜的第三种方法。 在形成抗反射膜的过程中可以获得非常高的抗反射效果,而不受包括具有透明膜的基板的种类的影响。 利用这些方法,可以形成精细且高精度的抗蚀剂图案。 这些方法可以用于形成图案化的抗蚀剂膜以蚀刻对象膜,例如在形成半导体器件的微电路和/或栅极(和字线)中。
    • 99. 发明授权
    • Resist patterns and method of forming resist patterns
    • 抗蚀剂图案和形成抗蚀剂图案的方法
    • US5326672A
    • 1994-07-05
    • US964715
    • 1992-10-22
    • Toshihiko TanakaMitsuaki MorigamiIwao HigashikawaTakeo Watanabe
    • Toshihiko TanakaMitsuaki MorigamiIwao HigashikawaTakeo Watanabe
    • G03F7/30G03C5/00
    • G03F7/30
    • In accordance with a proposed resist pattern forming method, contact angles between the surface of a resist and a rinse is adjusted within a predetermined range, a volatil surfactant which does not remain by drying is mixed in the rinse so as to reduce a surface tension, the rinse is dried under a critical condition of the rinse in order not to cause the surface tension to exert. The occurrence of an attractive force between the resist patterns may be thereby weakened or nullified, so that falling of the patterns can be effectively prevented which very often happened at forming fine resist patterns or resist patterns of high aspect. On the other hand, depending upon structure of said resist pattern, it is possible to effectively prevent outermost main patterns of gathering resist patterns from falling down. By providing such effects, yielding of products are increased. Further, the present invention may be also applied to a lithography illumination sources of which are light, electron, X-ray, ion beam, etc.
    • 根据所提出的抗蚀剂图案形成方法,将抗蚀剂表面和冲洗液之间的接触角调节到预定范围内,将不保持干燥的挥发性表面活性剂在冲洗液中混合以降低表面张力, 冲洗液在冲洗的临界条件下干燥,以免引起表面张力。 因此抗蚀剂图案之间的吸引力的发生可能被削弱或消失,从而可以有效地防止图形的下降,这在形成精细抗蚀剂图案或高方面的抗蚀剂图案时经常发生。 另一方面,根据所述抗蚀剂图案的结构,可以有效地防止聚集抗蚀剂图案的最外面的主要图案掉落。 通过提供这种效果,产品的产量增加。 此外,本发明还可以应用于光,电子,X射线,离子束等的光刻照明源
    • 100. 发明授权
    • Method for forming fine pattern of conjugated polymer film
    • 用于形成共轭聚合物薄膜精细图案的方法
    • US4988608A
    • 1991-01-29
    • US431178
    • 1989-11-03
    • Toshihiko TanakaShuji Doi
    • Toshihiko TanakaShuji Doi
    • G03F7/038H01L21/027
    • G03F7/038Y10S430/115
    • Disclosed is a method for forming a fine pattern of a conjugated polymer according to which the fine pattern can be formed even by using a high pressure mercury lamp as a light source for irradiation. This method comprises irradiating a coat containing a precursor for conjugated polymers which has a recurring unit represented by the formula (1): ##STR1## wherein R.sub.1 represents ##STR2## ps in which R.sub.3 and R.sub.4 each represents a hydrogen atom or an alkyl or alkoxy group of 1-5 carbon atoms, R.sub.5 represents a hydrocarbon group of 1-5 carbon atoms and m is 1 or 2; and R.sub.2 represents a hydrogen atom or a hydrocarbon group of 1-10 carbon atoms with a light of 200-500 nm in wavelength in pattern form and then dissolving and removing the polymer of unirradiated portion. It is preferred to heat treat the resulting fine pattern. Furthermore, the resulting pattern can have electrical conductivity by doping it with an electron donating or accepting dopant.
    • 公开了一种用于形成共轭聚合物的精细图案的方法,通过使用高压汞灯作为照射光源,可以形成精细图案。 该方法包括:照射含有共轭聚合物前体的涂层,该共聚物具有式(1)表示的重复单元:其中R 1表示其中R 3和R 4各自表示氢原子或 1-5个碳原子的烷基或烷氧基,R5代表1-5个碳原子的烃基,m是1或2; R2表示氢原子或1-10个碳原子的烃基,其波长为200-500nm的图案形式,然后溶解并除去未照射部分的聚合物。 优选热处理所得到的精细图案。 此外,所得到的图案可以通过用给电子或接受掺杂剂掺杂而具有导电性。