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91. 发明授权

US06402601B2 Web-format planarizing machines and methods for planarizing microelectronic substrate assemblies 有权
标题翻译：用于平面化微电子衬底组件的Web格式平面化机器和方法
公开(公告)号：US06402601B2
公开(公告)日：2002-06-11
申请号：US09907834
申请日：2001-07-17
申请人： Michael A. Walker , Scott E. Moore
发明人： Michael A. Walker , Scott E. Moore
IPC分类号： B24B2100
CPC分类号： B24B37/20 , B24B21/04 , B24B21/20 , B24B37/26
摘要： Methods and machines for planarizing microelectronic substrate assemblies using mechanical and/or chemical-mechanical planarizing processes. One machine in accordance with an embodiment of the invention includes a table having a support surface with a planarizing zone, an elongated polishing pad configured to move across the support surface of the table along a pad travel path, and a pad advancing mechanism coupled to the pad. The elongated pad can have a length along an elongated dimension extending along the pad travel path, an elongated first edge, an elongated second edge opposite the first edge, an elongated first side region extending along the first edge, an elongated second side region extending along the second edge, and an elongated medial region having a width between the first and second side regions. The pad advancing mechanism can include a first roller about which an unused portion of the pad is wrapped and a second roller about which a used portion of the pad is wrapped. The planarizing machine can further include a carrier assembly having a head and a drive system to translate the substrate assembly across an active section of the polishing pad in the planarizing zone. The planarizing machine further includes a pad tensioning system between the planarizing zone of the table and either the first roller or the second roller. The tensioning system, for example, can have a pneumatic or mechanical stretching assembly configured to push or pull the medial region of the pad more than the first and second side regions to compensate for the smaller diameter of the used portion of the pad wrapped around the second roller.
摘要翻译：用于使用机械和/或化学机械平面化工艺平面化微电子衬底组件的方法和机器。根据本发明的实施例的一台机器包括具有平坦化区域的支撑表面的台面，被配置成沿着垫移动路径跨越工作台的支撑表面移动的细长抛光垫，以及联接到垫。细长垫可以具有沿着衬垫行进路径延伸的细长尺寸的长度，细长的第一边缘，与第一边缘相对的细长的第二边缘，沿着第一边缘延伸的细长的第一侧区域，沿着第一边缘延伸的细长的第二侧面区域第二边缘，以及在第一和第二侧区域之间具有宽度的细长的中间区域。衬垫推进机构可以包括第一辊，衬垫的未使用部分围绕第一辊和第二辊，衬垫的使用部分围绕第二辊被包裹。平面化机器还可以包括具有头部和驱动系统的托架组件，以便在平坦化区域中平移衬底组件跨过抛光垫的有效部分。平面化机还包括在工作台的平坦化区与第一辊或第二辊之间的垫张紧系统。例如，张紧系统可以具有气动或机械拉伸组件，其构造成比第一和第二侧区域推或拉推动衬垫的中间区域，以补偿围绕着第二侧区域的垫的使用部分的较小直径第二辊。

92. 发明授权

US06361417B1 Method and apparatus for supporting a polishing pad during chemical-mechanical planarization of microelectronic substrates 有权
公开(公告)号：US06361417B1
公开(公告)日：2002-03-26
申请号：US09795248
申请日：2001-02-27
申请人： Michael A. Walker , Karl M. Robinson
发明人： Michael A. Walker , Karl M. Robinson
IPC分类号： B24B100
摘要： A method and apparatus for planarizing a microelectronic substrate. In one embodiment, the apparatus can include an elongated polishing pad that is moved over a platen either between or during the planarization cycles, and a support pad that is moved along with the polishing pad. The support pad can be an elongated member that extends between a supply roller and a take-up roller, or can include a continuous member that extends around the spaced apart rollers. The platen can also be movable along with the support pad and can be supported by fluid jets, rollers, or a rotating bladder. Cleaning devices and/or milling devices can treat the surfaces of the polishing pad, the support pad and/or the platen to reduce the likelihood for contaminants to become caught between these components as they engage with each other.

93. 发明授权

US06269511B1 Surface cleaning apparatus 有权
标题翻译：表面清洗装置
公开(公告)号：US06269511B1
公开(公告)日：2001-08-07
申请号：US09679806
申请日：2000-10-04
申请人： Michael T. Andreas , Michael A. Walker
发明人： Michael T. Andreas , Michael A. Walker
IPC分类号： B08B312
CPC分类号： B08B3/123 , B08B1/02 , Y10S134/902
摘要： Apparatuses and methods are disclosed for submerged cleaning of substrates and the like. The apparatus includes a container holding a bath of cleaning fluid and, within the container, the combination of a submerged brush scrubber, submerged megasonic transducer and Marangoni drying devices. In operation, at least a portion of a substrate is submerged in the bath of cleaning fluid where its surfaces are contacted by one or more brush scrubbers while beams produced by megasonic transducers are directed parallel to the surface of the substrate along the surface of the substrate. The substrate is removed from the bath of cleaning fluid and rinsed with rinse water. A Marangoni flow is induced on the surface of the substrate and the substrate is allowed to dry through one or more means of drying, thereby rendering the substrate free from particulate contamination and dried of any residual fluid from the cleaning process.
摘要翻译：公开了用于衬底等的浸没清洁的装置和方法。该装置包括容纳洗涤液的容器的容器，以及容器内的浸没式刷洗涤器，浸没式超声波换能器和马兰戈尼干燥装置的组合。在操作中，衬底的至少一部分浸没在清洁流体的浴中，其中其表面与一个或多个刷洗涤器接触，而由兆声换能器产生的光束沿着衬底的表面平行于衬底的表面指向。将衬底从洗涤液浴中取出并用冲洗水冲洗。在衬底的表面上诱导马兰戈尼流，并使衬底通过一种或多种干燥方式干燥，从而使得衬底没有颗粒污染，并干燥来自清洁过程的任何残余流体。

94. 发明授权

US06261163B1 Web-format planarizing machines and methods for planarizing microelectronic substrate assemblies 有权
公开(公告)号：US06261163B1
公开(公告)日：2001-07-17
申请号：US09385985
申请日：1999-08-30
申请人： Michael A. Walker , Scott E. Moore
发明人： Michael A. Walker , Scott E. Moore
IPC分类号： B24B2100
CPC分类号： B24B37/20 , B24B21/04 , B24B21/20 , B24B37/26
摘要： Methods and machines for planarizing microelectronic substrate assemblies using mechanical and/or chemical-mechanical planarizing processes. One machine in accordance with an embodiment of the invention includes a table having a support surface with a planarizing zone, an elongated polishing pad configured to move across the support surface of the table along a pad travel path, and a pad advancing mechanism coupled to the pad. The elongated pad can have a length along an elongated dimension extending along the pad travel path, an elongated first edge, an elongated second edge opposite the first edge, an elongated first side region extending along the first edge, an elongated second side region extending along the second edge, and an elongated medial region having a width between the first and second side regions. The pad advancing mechanism can include a first roller about which an unused portion of the pad is wrapped and a second roller about which a used portion of the pad is wrapped. The planarizing machine can further include a carrier assembly having a head and a drive system to translate the substrate assembly across an active section of the polishing pad in the planarizing zone. The planarizing machine further includes a pad tensioning system between the planarizing zone of the table and either the first roller or the second roller. The tensioning system, for example, can have a pneumatic or mechanical stretching assembly configured to push or pull the medial region of the pad more than the first and second side regions to compensate for the smaller diameter of the used portion of the pad wrapped around the second roller.

95. 发明授权

US06206769B1 Method and apparatus for stopping mechanical and chemical mechanical planarization of substrates at desired endpoints 有权
标题翻译：用于在期望的端点停止基板的机械和化学机械平坦化的方法和装置
公开(公告)号：US06206769B1
公开(公告)日：2001-03-27
申请号：US09222572
申请日：1998-12-28
申请人： Michael A. Walker
发明人： Michael A. Walker
IPC分类号： B24B722
CPC分类号： B24B37/013 , B24B37/04 , B24B37/042 , H01L21/31053 , H01L21/3212
摘要： A method and apparatus for forming a planar surface on a substrate at a desired endpoint. In one embodiment of the invention, material is removed from a substrate with an abrasive medium on a planarizing surface. As material is removed from the substrate, the abrasive medium is selectively inhibited from contacting a first exposed area at the desired endpoint on the substrate while it still contacts a second area on the substrate that is not yet at the endpoint. In this embodiment of the invention, therefore, polishing substantially stops at the first area on the substrate but continues at the second area on the substrate.
摘要翻译：一种用于在所需端点处在衬底上形成平面表面的方法和装置。在本发明的一个实施方案中，在平坦化表面上用研磨介质从衬底上去除材料。当从衬底移除材料时，磨料介质被选择性地禁止接触衬底上所需端点处的第一暴露区域，同时其仍接触到还没有在端点处的衬底上的第二区域。因此，在本发明的该实施例中，抛光基本上停留在基板上的第一区域上，但在基板上的第二区域继续。

96. 发明授权

US6090475A Polishing pad, methods of manufacturing and use 失效
标题翻译：抛光垫，制造和使用方法
公开(公告)号：US6090475A
公开(公告)日：2000-07-18
申请号：US832979
申请日：1997-04-04
申请人： Karl M. Robinson , Michael A. Walker , John K. Skrovan
发明人： Karl M. Robinson , Michael A. Walker , John K. Skrovan
IPC分类号： B24B37/22 , B24B37/24 , B24B37/26 , B24D3/34 , B24D11/00 , B24D13/14 , B32B3/00 , B32B3/26 , B32B27/06 , B32B27/20
CPC分类号： B24B37/245 , B24B37/22 , B24B37/24 , B24B37/26 , B24D11/00 , B24D3/34 , Y10S451/921 , Y10T428/21 , Y10T428/213 , Y10T428/24802 , Y10T428/24893 , Y10T428/24942
摘要： The present invention is directed to polishing pads useful in determining an end to the useful wear life thereof. In a simple embodiment of the present invention, a polishing pad that is used with slurries is dyed on one side in a manner that causes the dye to permeate the pad to a limited depth that does not cause total coloring. Another embodiment of the present invention involves a fixed abrasive pad that has fixed abrasives embedded into the pad to a selected depth where at least one color level is within the portion of the pad that contains the fixed abrasives. After dyeing the pad, the pad is attached to the polishing platen. During the polishing operation, a color change signals a time to stop the polishing operation and change the pad. With multiple colors in the pad, limited only by the ability to dye the pad with uniform depth levels, characteristic wear patterns can be observed and adjustments made accordingly to prolong and optimize pad life. A pad having voids and optional abrasives incorporated therein is also disclosed. The contents of each void facilitates the detection of the degree to which the polishing pad has been worn during a polishing operation. Substances may be stored within voids that are released by the breach of the voids caused abrasion during the polishing operation. Visual or audible diagnostics resulting from the breaching of voids are useful to control the polishing operation and thus increase yield.
摘要翻译：本发明涉及用于确定其有用磨损寿命结束的抛光垫。在本发明的一个简单实施例中，与浆料一起使用的抛光垫在一侧被染色，使得染料渗透到不会引起全部着色的有限深度的方式。本发明的另一个实施例涉及一种固定研磨垫，其具有嵌入到垫中的固定研磨剂至选定深度，其中至少一个颜色水平位于包含固定磨料的垫的部分内。在对该垫进行染色之后，该垫被附着到该研磨台板上。在抛光操作期间，颜色变化发出指示停止抛光操作并改变垫的时间。在衬垫中具有多种颜色，仅受到具有均匀深度水平染色垫的能力的限制，可以观察到特征磨损图案并相应地进行调整以延长并优化垫寿命。还公开了一种具有空隙的衬垫和其中并入的任选的研磨剂。每个空隙的内容有助于在抛光操作期间检测抛光垫已磨损的程度。物质可以存储在通过在抛光操作期间由于空隙引起磨损而释放的空隙中。由于破裂导致的视觉或听觉诊断有助于控制抛光操作，从而提高产量。

97. 发明授权

US5981396A Method for chemical-mechanical planarization of stop-on-feature semiconductor wafers 有权
标题翻译：停止特征半导体晶片的化学机械平面化方法
公开(公告)号：US5981396A
公开(公告)日：1999-11-09
申请号：US287953
申请日：1999-04-07
申请人： Karl M. Robinson , Michael A. Walker
发明人： Karl M. Robinson , Michael A. Walker
IPC分类号： B24B37/015 , B24B49/14 , H01L21/304 , H01L21/3105 , H01L21/00
CPC分类号： B24B37/015 , H01L21/31053
摘要： The present invention is a method for chemical-mechanical planarization of semiconductor wafers that is highly useful for planarizing stop-on-feature design wafers. Initially, the wafer is positioned against a liquid solution over a planarizing surface of a polishing pad. At least one of the wafer or the pad is moved with respect to the other at a relatively low velocity to maintain a substantially continuous film of liquid solution between the wafer and the pad. The temperature of a pad platen is also controlled to maintain a relatively low temperature of the liquid solution at which the solution is highly selective to a layer of material on the wafer.
摘要翻译：本发明是半导体晶片的化学机械平面化方法，其对于平坦化停止特征设计晶片是非常有用的。最初，将晶片相对于抛光垫的平坦化表面上的液体溶液定位。晶片或焊盘中的至少一个以相对低的速度相对于另一个移动，以在晶片和焊盘之间维持基本上连续的液体溶液膜。焊盘压板的温度也被控制以保持溶液对晶片上的材料层具有高度选择性的液体溶液的相对较低的温度。

98. 发明授权

US5779522A Directional spray pad scrubber 失效
标题翻译：定向喷淋洗涤器
公开(公告)号：US5779522A
公开(公告)日：1998-07-14
申请号：US824664
申请日：1997-03-26
申请人： Michael A. Walker , Karl M. Robinson
发明人： Michael A. Walker , Karl M. Robinson
IPC分类号： B08B3/02 , B24B53/007 , B24B53/017 , B24B53/00
CPC分类号： B24B53/017 , B08B3/02 , B08B3/022
摘要： The present invention is a pad scrubber that cleans the planarizing surface of a polishing pad used in CMP processing of semiconductor wafers. The pad scrubber has a fluid manifold, a first nozzle attached to one side of the manifold, and a second nozzle attached to another side of the manifold. The first nozzle directs a first fluid stream generally outwardly toward a peripheral edge of the pad, and the second nozzle directs a second fluid stream generally outwardly to the peripheral edge of the pad and also toward the first fluid stream. The first and second fluid streams converge on the planarizing surface of the pad to separate accumulated waste matter from the polishing pad and to create a contained stream of separated particles that flows across the planarizing surface to the peripheral edge of the pad.
摘要翻译：本发明是一种洗涤器，其清洁在半导体晶片的CMP处理中使用的抛光垫的平坦化表面。垫洗涤器具有流体歧管，附接到歧管的一侧的第一喷嘴和附接到歧管的另一侧的第二喷嘴。第一喷嘴将第一流体流大致向外引导到衬垫的周边边缘，并且第二喷嘴将第二流体流大致向外引导到衬垫的周边边缘并且还朝向第一流体流。第一和第二流体流会聚到衬垫的平坦化表面上，以将累积的废物与抛光垫分离，并产生流过平坦化表面的包含的分离的颗粒流到衬垫的周边边缘。

99. 发明授权

US5518948A Method of making cup-shaped DRAM capacitor having an inwardly overhanging lip 失效
标题翻译：制造具有向内突出的唇缘的杯形DRAM电容器的方法
公开(公告)号：US5518948A
公开(公告)日：1996-05-21
申请号：US534572
申请日：1995-09-27
申请人： Michael A. Walker
发明人： Michael A. Walker
IPC分类号： H01L21/8242 , H01L27/108
CPC分类号： H01L27/10852 , H01L27/10817
摘要： This invention is a cup-shaped capacitor having an inwardly-overhanging lip on the upper edge of the cylindrical wall portion of the cup, as well as a method for making the capacitor. The overhanging lip on the upper edge prevents sharpening of the upper edge during singulation of the storage-node capacitor plates and the attendant problems. The capacitor is formed by depositing a mold layer on a substrate, depositing an etch stop layer on top of the mold layer (the etch stop layer having an etch rate that is lower than that of the mold layer), enlarging the mold layer portion of the cavity such that the mold layer is recessed beneath the edge of the etch stop layer, depositing a first capacitive layer which covers the upper surface of the etch stop layer and fully lines the cavity, performing an isotropic etch-back step which removes at least the portion of the first capacitive layer which overlies the upper surface of the etch stop layer to form a singulated first capacitive plate, removing the etch stop layer, removing at least a portion of the mold layer to expose an outer surface of the first capacitive plate, depositing a dielectric layer, and depositing a second capacitive layer.
摘要翻译：本发明是一种杯形电容器，其具有在杯的圆筒壁部分的上边缘上具有向内突出的唇缘，以及制造该电容器的方法。上边缘的突出唇缘防止存储节点电容器板的分离期间上边缘的磨损和伴随的问题。电容器通过在衬底上沉积模具层而形成，在模具层的顶部沉积蚀刻停止层（蚀刻停止层具有低于模具层的蚀刻速率），扩大模具层部分的模具层部分所述腔使得所述模具层凹陷在所述蚀刻停止层的边缘下方，沉积覆盖所述蚀刻停止层的上表面并完全对所述腔进行排列的第一电容层，执行各向同性回蚀步骤，其至少去除所述第一电容层的覆盖所述蚀刻停止层的上表面的部分形成单个的第一电容板，去除所述蚀刻停止层，去除所述模制层的至少一部分以暴露所述第一电容板的外表面，沉积介电层，以及沉积第二电容层。

100. 发明授权

US5486684A Multipass induction heating for thermoplastic welding 失效
标题翻译：多层感应加热用于热塑性焊接
公开(公告)号：US5486684A
公开(公告)日：1996-01-23
申请号：US367546
申请日：1995-01-03
申请人： Todd R. Peterson , Michael A. Walker
发明人： Todd R. Peterson , Michael A. Walker
IPC分类号： B23K13/01 , B29C65/00 , B29C65/36 , B29K79/00 , B29K105/08 , B29L31/30 , H05B6/02 , H05B6/10
CPC分类号： B29C66/721 , B29C65/3644 , B29C66/0342 , B29C66/1122 , B29C66/301 , B29C66/524 , B29C66/5326 , B29C66/73921 , B29C66/80 , B29C66/81241 , B29C66/836 , B29C66/91641 , B29C66/91645 , B29C66/91651 , B29C66/91655 , B29C65/3668 , B29C66/71 , B29C66/7212 , B29C66/7394 , B29C66/91221 , B29C66/91411 , B29C66/961 , B29L2007/002 , B29L2024/00 , B29L2031/3076
摘要： An induction coil is passed over an interface between two resinous parts to be welded and an alternating magnetic field generated by the coil induces eddy currents in a foraminous susceptor positioned in the interface between the two parts. Pressure is applied to squeeze the two parts together while the induction heating of the susceptor raises the temperature of the resin in the faying surfaces of the two parts to the softening temperature so that resin flows through the interstices in the susceptor and bonds the two parts together. The induction heating and pressure application passes are repeated four or more times, increasing the power to the induction coil in the later passes to increase the heat input. The strength and continuity of the weld improves with each pass, although the incremental improvement diminishes after about four passes.
摘要翻译：感应线圈通过待焊接的两个树脂部件之间的界面，并且由线圈产生的交变磁场在位于两部分之间的界面中的有孔基座中引起涡流。施加压力以将两部分挤压在一起，同时感受器的感应加热将两部分的接合表面中的树脂的温度升高到软化温度，使得树脂流过基座中的间隙并将两部分结合在一起。感应加热和压力施加通过重复四次或更多次，增加后续通过中的感应线圈的功率以增加热量输入。焊接的强度和连续性随着每次通过而提高，尽管增量改进在大约四次通过后减小。

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