专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US06309282B1 Variable abrasive polishing pad for mechanical and chemical-mechanical planarization 失效
公开(公告)号：US06309282B1
公开(公告)日：2001-10-30
申请号：US09657764
申请日：2000-09-08
申请人： David Q. Wright , John K. Skrovan
发明人： David Q. Wright , John K. Skrovan
IPC分类号： B24B100
CPC分类号： B24B37/11 , B24B37/24 , B24D7/14
摘要： An abrasive polishing pad for planarizing a substrate. In one embodiment, the abrasive polishing pad has a planarizing surface with a first planarizing region and a second planarizing region. The first planarizing region has a first abrasiveness and the second planarizing region has a second abrasiveness different than the first abrasiveness of the first region. The polishing pad preferably has a plurality of abrasive elements at the planarizing surface in at least one of the first or second planarizing regions. The abrasive elements may be abrasive particles fixedly suspended in a suspension medium, contact/non-contact regions on the pad, or other elements that mechanically remove material from the wafer. In operation of a preferred embodiment, the lesser abrasive of the first and second planarizing regions contacts a first area of the wafer where the relative velocity between the wafer and the polishing pad is relatively high, and the more abrasive of the first and second planarizing regions contacts a second area of the wafer where the relative velocity between the wafer and the polishing pad is relatively low. The different abrasivenesses of the first and second planarizing regions compensate for variations in relative velocities across the face of the wafer to more uniformly planarize the wafer.

2. 发明授权

US6090475A Polishing pad, methods of manufacturing and use 失效
标题翻译：抛光垫，制造和使用方法
公开(公告)号：US6090475A
公开(公告)日：2000-07-18
申请号：US832979
申请日：1997-04-04
申请人： Karl M. Robinson , Michael A. Walker , John K. Skrovan
发明人： Karl M. Robinson , Michael A. Walker , John K. Skrovan
IPC分类号： B24B37/22 , B24B37/24 , B24B37/26 , B24D3/34 , B24D11/00 , B24D13/14 , B32B3/00 , B32B3/26 , B32B27/06 , B32B27/20
CPC分类号： B24B37/245 , B24B37/22 , B24B37/24 , B24B37/26 , B24D11/00 , B24D3/34 , Y10S451/921 , Y10T428/21 , Y10T428/213 , Y10T428/24802 , Y10T428/24893 , Y10T428/24942
摘要： The present invention is directed to polishing pads useful in determining an end to the useful wear life thereof. In a simple embodiment of the present invention, a polishing pad that is used with slurries is dyed on one side in a manner that causes the dye to permeate the pad to a limited depth that does not cause total coloring. Another embodiment of the present invention involves a fixed abrasive pad that has fixed abrasives embedded into the pad to a selected depth where at least one color level is within the portion of the pad that contains the fixed abrasives. After dyeing the pad, the pad is attached to the polishing platen. During the polishing operation, a color change signals a time to stop the polishing operation and change the pad. With multiple colors in the pad, limited only by the ability to dye the pad with uniform depth levels, characteristic wear patterns can be observed and adjustments made accordingly to prolong and optimize pad life. A pad having voids and optional abrasives incorporated therein is also disclosed. The contents of each void facilitates the detection of the degree to which the polishing pad has been worn during a polishing operation. Substances may be stored within voids that are released by the breach of the voids caused abrasion during the polishing operation. Visual or audible diagnostics resulting from the breaching of voids are useful to control the polishing operation and thus increase yield.
摘要翻译：本发明涉及用于确定其有用磨损寿命结束的抛光垫。在本发明的一个简单实施例中，与浆料一起使用的抛光垫在一侧被染色，使得染料渗透到不会引起全部着色的有限深度的方式。本发明的另一个实施例涉及一种固定研磨垫，其具有嵌入到垫中的固定研磨剂至选定深度，其中至少一个颜色水平位于包含固定磨料的垫的部分内。在对该垫进行染色之后，该垫被附着到该研磨台板上。在抛光操作期间，颜色变化发出指示停止抛光操作并改变垫的时间。在衬垫中具有多种颜色，仅受到具有均匀深度水平染色垫的能力的限制，可以观察到特征磨损图案并相应地进行调整以延长并优化垫寿命。还公开了一种具有空隙的衬垫和其中并入的任选的研磨剂。每个空隙的内容有助于在抛光操作期间检测抛光垫已磨损的程度。物质可以存储在通过在抛光操作期间由于空隙引起磨损而释放的空隙中。由于破裂导致的视觉或听觉诊断有助于控制抛光操作，从而提高产量。

3. 发明授权

US6062958A Variable abrasive polishing pad for mechanical and chemical-mechanical planarization 失效
标题翻译：用于机械和化学机械平面化的可变研磨抛光垫
公开(公告)号：US6062958A
公开(公告)日：2000-05-16
申请号：US834524
申请日：1997-04-04
申请人： David Q. Wright , John K. Skrovan
发明人： David Q. Wright , John K. Skrovan
IPC分类号： B24B37/11 , B24B37/24 , B24D7/14 , B24B5/00 , B24B29/00
CPC分类号： B24B37/11 , B24B37/24 , B24D7/14
摘要： An abrasive polishing pad for planarizing a substrate. In one embodiment, the abrasive polishing pad has a planarizing surface with a first planarizing region and a second planarizing region. The first planarizing region has a first abrasiveness and the second planarizing region has a second abrasiveness different than the first abrasiveness of the first region. The polishing pad preferably has a plurality of abrasive elements at the planarizing surface in at least one of the first or second planarizing regions. The abrasive elements may be abrasive particles fixedly suspended in a suspension medium, contact/non-contact regions on the pad, or other elements that mechanically remove material from the wafer. In operation of a preferred embodiment, the lesser abrasive of the first and second planarizing regions contacts a first area of the wafer where the relative velocity between the wafer and the polishing pad is relatively high, and the more abrasive of the first and second planarizing regions contacts a second area of the wafer where the relative velocity between the wafer and the polishing pad is relatively low. The different abrasivenesses of the first and second planarizing regions compensate for variations in relative velocities across the face of the wafer to more uniformly planarize the wafer.
摘要翻译：用于平坦化基板的研磨抛光垫。在一个实施例中，研磨抛光垫具有带有第一平坦化区域和第二平坦化区域的平坦化表面。第一平坦化区域具有第一磨蚀性，第二平坦化区域具有与第一区域的第一磨蚀性不同的第二磨损性。抛光垫优选地在第一或第二平坦化区域中的至少一个中的平坦化表面处具有多个研磨元件。研磨元件可以是固定地悬挂在悬浮介质中的磨料颗粒，垫上的接触/非接触区域或机械地从晶片上去除材料的其它元件。在优选实施例的操作中，第一和第二平坦化区域的较小磨料接触晶片的第一区域，其中晶片和抛光垫之间的相对速度相对较高，并且第一和第二平坦化区域接触晶片的第二区域，其中晶片和抛光垫之间的相对速度相对较低。第一和第二平坦化区域的不同的磨损性补偿横跨晶片表面的相对速度的变化，以使晶片更均匀地平坦化。

4. 发明授权

US06186870B1 Variable abrasive polishing pad for mechanical and chemical-mechanical planarization 有权
标题翻译：用于机械和化学机械平面化的可变研磨抛光垫
公开(公告)号：US06186870B1
公开(公告)日：2001-02-13
申请号：US09378243
申请日：1999-08-19
申请人： David Q. Wright , John K. Skrovan
发明人： David Q. Wright , John K. Skrovan
IPC分类号： B24B100
CPC分类号： B24B37/11 , B24B37/24 , B24D7/14
摘要： An abrasive polishing pad for planarizing a substrate. In one embodiment, the abrasive polishing pad has a planarizing surface with a first planarizing region and a second planarizing region. The first planarizing region has a first abrasiveness and the second planarizing region has a second abrasiveness different than the first abrasiveness of the first region. The polishing pad preferably has a plurality of abrasive elements at the planarizing surface in at least one of the first or second planarizing regions. The abrasive elements may be abrasive particles fixedly suspended in a suspension medium, contact/non-contact regions on the pad, or other elements that mechanically remove material from the wafer. In operation of a preferred embodiment, the lesser abrasive of the first and second planarizing regions contacts a first area of the wafer where the relative velocity between the wafer and the polishing pad is relatively high, and the more abrasive of the first and second planarizing regions contacts a second area of the wafer where the relative velocity between the wafer and the polishing pad is relatively low. The different abrasivenesses of the first and second planarizing regions compensate for variations in relative velocities across the face of the wafer to more uniformly planarize the wafer.
摘要翻译：用于平坦化基板的研磨抛光垫。在一个实施例中，研磨抛光垫具有带有第一平坦化区域和第二平坦化区域的平坦化表面。第一平坦化区域具有第一磨蚀性，第二平坦化区域具有与第一区域的第一磨蚀性不同的第二磨损性。抛光垫优选地在第一或第二平坦化区域中的至少一个中的平坦化表面处具有多个研磨元件。研磨元件可以是固定地悬挂在悬浮介质中的磨料颗粒，垫上的接触/非接触区域或机械地从晶片上去除材料的其它元件。在优选实施例的操作中，第一和第二平坦化区域的较小磨料接触晶片的第一区域，其中晶片和抛光垫之间的相对速度相对较高，并且第一和第二平坦化区域接触晶片的第二区域，其中晶片和抛光垫之间的相对速度相对较低。第一和第二平坦化区域的不同的磨损性补偿横跨晶片表面的相对速度的变化，以使晶片更均匀地平坦化。

5. 发明授权

US07276765B2 Buried transistors for silicon on insulator technology 有权
标题翻译：埋入晶体管用于绝缘体上硅技术
公开(公告)号：US07276765B2
公开(公告)日：2007-10-02
申请号：US11085018
申请日：2005-03-21
申请人： Theodore M. Taylor , Won-Joo Kim , John K. Skrovan
发明人： Theodore M. Taylor , Won-Joo Kim , John K. Skrovan
IPC分类号： H01L29/72
CPC分类号： H01L29/66772 , H01L29/78621 , H01L29/78654
摘要： A buried transistor particularly suitable for SOI technology, where the transistor is fabricated within a trench in a substrate and the resulting transistor incorporates completely isolated active areas. The resulting substrate has a decreased topography and there is no need for polysilicon (or other) plugs to connect to the transistor, unless desired. With this invention, better control is achieved in processing, particularly of gate length. The substrate having the buried transistor can be silicon oxide bonded to another substrate to form an SOI structure.
摘要翻译：特别适用于SOI技术的埋入式晶体管，其中晶体管制造在衬底中的沟槽内，并且所得晶体管包含完全隔离的有源区。所得到的衬底具有减小的形貌，除非需要，否则不需要多晶硅（或其它）插头来连接晶体管。利用本发明，在特别是栅极长度的处理中实现更好的控制。具有埋入晶体管的衬底可以是氧化硅结合到另一衬底以形成SOI结构。

6. 发明授权

US06900500B2 Buried transistors for silicon on insulator technology 有权
标题翻译：埋入晶体管用于绝缘体上硅技术
公开(公告)号：US06900500B2
公开(公告)日：2005-05-31
申请号：US10224341
申请日：2002-08-21
申请人： Theodore M. Taylor , Won-Joo Kim , John K. Skrovan
发明人： Theodore M. Taylor , Won-Joo Kim , John K. Skrovan
IPC分类号： H01L21/336 , H01L29/786 , H01L29/72
CPC分类号： H01L29/66772 , H01L29/78621 , H01L29/78654
摘要： A buried transistor particularly suitable for SOI technology, where the transistor is fabricated within a trench in a substrate and the resulting transistor incorporates completely isolated active areas. The resulting substrate has a decreased topography and there is no need for polysilicon (or other) plugs to connect to the transistor, unless desired. With this invention, better control is achieved in processing, particularly of gate length. The substrate having the buried transistor can be silicon oxide bonded to another substrate to form an SOI structure.
摘要翻译：特别适用于SOI技术的埋入式晶体管，其中晶体管制造在衬底中的沟槽内，并且所得晶体管包含完全隔离的有源区。所得到的衬底具有减小的形貌，除非需要，否则不需要多晶硅（或其它）插头来连接晶体管。利用本发明，在特别是栅极长度的处理中实现更好的控制。具有埋入晶体管的衬底可以是氧化硅结合到另一衬底以形成SOI结构。

7. 发明授权

US6136043A Polishing pad methods of manufacture and use 有权
标题翻译：抛光垫的制造和使用方法
公开(公告)号：US6136043A
公开(公告)日：2000-10-24
申请号：US294908
申请日：1999-04-20
申请人： Karl M. Robinson , Michael A. Walker , John K. Skrovan
发明人： Karl M. Robinson , Michael A. Walker , John K. Skrovan
IPC分类号： B24B37/22 , B24B37/24 , B24B37/26 , B24D3/34 , B24D11/00 , B24D13/14 , D06P5/00 , B24B1/00 , D06P3/24 , D06P3/80 , D06P3/87
CPC分类号： B24B37/245 , B24B37/22 , B24B37/24 , B24B37/26 , B24D11/00 , B24D3/34 , Y10S451/921 , Y10T428/21 , Y10T428/213 , Y10T428/24802 , Y10T428/24893 , Y10T428/24942
摘要： The present invention is directed to polishing pads useful in determining an end to the useful wear life thereof. In a simple embodiment of the present invention, a polishing pad that is used with slurries is dyed on one side in a manner that causes the dye to permeate the pad to a limited depth that does not cause total coloring. Another embodiment of the present invention involves a fixed abrasive pad that has fixed abrasives embedded into the pad to a selected depth where at least one color level is within the portion of the pad that contains the fixed abrasives. After dyeing the pad, the pad is attached to the polishing platen. During the polishing operation, a color change signals a time to stop the polishing operation and change the pad. With multiple colors in the pad, limited only by the ability to dye the pad with uniform depth levels, characteristic wear patterns can be observed and adjustments made accordingly to prolong and optimize pad life. A pad having voids and optional abrasives incorporated therein is also disclosed. The contents of each void facilitates the detection of the degree to which the polishing pad has been worn during a polishing operation. Substances may be stored within voids that are released by the breach of the voids caused abrasion during the polishing operation. Visual or audible diagnostics resulting from the breaching of voids are useful to control the polishing operation and thus increase yield.
摘要翻译：本发明涉及用于确定其有用磨损寿命结束的抛光垫。在本发明的一个简单实施例中，与浆料一起使用的抛光垫在一侧被染色，使得染料渗透到不会引起全部着色的有限深度的方式。本发明的另一个实施例涉及一种固定研磨垫，其具有嵌入到垫中的固定研磨剂至选定深度，其中至少一个颜色水平位于包含固定磨料的垫的部分内。在对该垫进行染色之后，该垫被附着到该研磨台板上。在抛光操作期间，颜色变化发出指示停止抛光操作并改变垫的时间。在衬垫中具有多种颜色，仅受到具有均匀深度水平染色垫的能力的限制，可以观察到特征磨损图案并相应地进行调整以延长并优化垫寿命。还公开了一种具有空隙的衬垫和其中并入的任选的研磨剂。每个空隙的内容有助于在抛光操作期间检测抛光垫已磨损的程度。物质可以存储在通过在抛光操作期间由于空隙引起磨损而释放的空隙中。由于破裂导致的视觉或听觉诊断有助于控制抛光操作，从而提高产量。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式