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    • 98. 发明申请
    • NONVOLATILE SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD THEREOF
    • 非易失性半导体存储器件及其制造方法
    • US20110114912A1
    • 2011-05-19
    • US12867437
    • 2009-02-09
    • Takumi MikawaYoshio KawashimaKoji AritaTakeki Ninomiya
    • Takumi MikawaYoshio KawashimaKoji AritaTakeki Ninomiya
    • H01L45/00H01L21/02
    • H01L27/101H01L27/2436H01L45/04H01L45/1233H01L45/146H01L45/1675
    • A nonvolatile semiconductor memory device (100) comprises a substrate (102) provided with a transistor (101); a first interlayer insulating layer (103) formed over the substrate to cover the transistor; a first contact plug (104) formed in the first interlayer insulating layer and electrically connected to either of a drain electrode (101a) or a source electrode (101b) of the transistor, and a second contact plug (105) formed in the first interlayer insulating layer and electrically connected to the other of the drain electrode or the source electrode of the transistor; a resistance variable layer (106) formed to cover a portion of the first contact plug; a first wire (107) formed on the resistance variable layer; and a second wire (108) formed to cover a portion of the second contact plug; an end surface of the resistance variable layer being coplanar with an end surface of the first wire.
    • 非易失性半导体存储器件(100)包括设置有晶体管(101)的衬底(102); 形成在所述衬底上以覆盖所述晶体管的第一层间绝缘层(103) 形成在所述第一层间绝缘层中并电连接到所述晶体管的漏电极(101a)或源电极(101b)中的任一个的第一接触插塞(104)和形成在所述第一中间层 绝缘层并与晶体管的漏电极或源电极中的另一个电连接; 形成为覆盖所述第一接触插塞的一部分的电阻变化层(106) 形成在电阻变化层上的第一线(107) 以及形成为覆盖所述第二接触插塞的一部分的第二线(108) 所述电阻变化层的端面与所述第一线的端面共面。