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91. 发明申请

US20140029181A1 INTERLAYER INTERCONNECTS AND ASSOCIATED TECHNIQUES AND CONFIGURATIONS 审中-公开
标题翻译：中间层互连及相关技术和配置
公开(公告)号：US20140029181A1
公开(公告)日：2014-01-30
申请号：US13560930
申请日：2012-07-27
申请人： Florian Gstrein , Hui Jae Yoo , Jacob M. Faber , James S. Clarke
发明人： Florian Gstrein , Hui Jae Yoo , Jacob M. Faber , James S. Clarke
IPC分类号： H01L23/522 , G06F1/16 , H01L21/768
CPC分类号： H01L23/53233 , H01L23/53238 , H01L23/5329 , H01L23/53295 , H01L2924/0002 , H01L2924/00
摘要： Embodiments of the present disclosure are directed towards interlayer interconnects and associated techniques and configurations. In one embodiment, an apparatus includes a semiconductor substrate, one or more device layers disposed on the semiconductor substrate, and one or more interconnect layers disposed on the one or more device layers, the one or more interconnect layers including interconnect structures configured to route electrical signals to or from the one or more device layers, the interconnect structures comprising copper (Cu) and germanium (Ge). Other embodiments may be described and/or claimed.
摘要翻译：本公开的实施例涉及层间互连和相关联的技术和配置。在一个实施例中，一种装置包括半导体衬底，设置在半导体衬底上的一个或多个器件层，以及设置在该一个或多个器件层上的一个或多个互连层，所述一个或多个互连层包括被配置为布线信号到或来自一个或多个器件层，包括铜（Cu）和锗（Ge）的互连结构。可以描述和/或要求保护其他实施例。

92. 发明申请

US20130292645A1 HIGH EFFICIENCY LIGHT EMITTING DIODE 有权
标题翻译：高效发光二极管
公开(公告)号：US20130292645A1
公开(公告)日：2013-11-07
申请号：US13997873
申请日：2011-12-06
申请人： Jun Ho Yun , Ki Bum Nam , Joon Hee Lee , Chang Youn Kim , Hong Jae Yoo , Sung Hoon Hong
发明人： Jun Ho Yun , Ki Bum Nam , Joon Hee Lee , Chang Youn Kim , Hong Jae Yoo , Sung Hoon Hong
IPC分类号： H01L33/14
CPC分类号： H01L33/14 , H01L33/0079 , H01L33/22 , H01L33/38 , H01L33/405 , H01L33/44
摘要： Disclosed herein is a high efficiency light emitting diode. The light emitting diode includes: a semiconductor stack positioned over a support substrate; a reflective metal layer positioned between the support substrate and the semiconductor stack to ohmic-contact a p-type compound semiconductor layer of the semiconductor stack and having a groove exposing the semiconductor stack; a first electrode pad positioned on an n-type compound semiconductor layer of the semiconductor stack; an electrode extension extending from the first electrode pad and positioned over the groove region; and an upper insulating layer interposed between the first electrode pad and the semiconductor stack. In addition, the n-type compound semiconductor layer includes an n-type contact layer, and the n-type contact layer has a Si doping concentration of 5 to 7×1018/cm3 and a thickness in the range of 5 to 10 um.
摘要翻译：本文公开了一种高效率发光二极管。发光二极管包括：位于支撑衬底上的半导体堆叠; 反射金属层，位于所述支撑基板和所述半导体堆叠之间，以与所述半导体堆叠的p型化合物半导体层欧姆接触并具有暴露所述半导体叠层的沟槽; 位于所述半导体叠层的n型化合物半导体层上的第一电极焊盘; 电极延伸部，其从所述第一电极焊盘延伸并定位在所述沟槽区域上; 以及介于所述第一电极焊盘和所述半导体堆叠之间的上绝缘层。此外，n型化合物半导体层包括n型接触层，n型接触层的Si掺杂浓度为5〜7×1018 / cm3，厚度为5〜10μm。

93. 发明申请

US20130260553A1 SELF-FORMING, SELF-ALIGNED BARRIERS FOR BACK-END INTERCONNECTS AND METHODS OF MAKING SAME 审中-公开
标题翻译：自成型，后端互连的自对准障碍及其制造方法
公开(公告)号：US20130260553A1
公开(公告)日：2013-10-03
申请号：US13893143
申请日：2013-05-13
申请人： Hui Jae Yoo , Jeffrey D. Bielefeld , Sean W. King , Sridhar Balakrishnan
发明人： Hui Jae Yoo , Jeffrey D. Bielefeld , Sean W. King , Sridhar Balakrishnan
IPC分类号： H01L21/768
CPC分类号： H01L21/76834 , H01L21/2855 , H01L21/32053 , H01L21/76832 , H01L21/76835 , H01L21/76843 , H01L21/76846 , H01L21/76849 , H01L21/76855 , H01L21/76864 , H01L21/76867 , H01L21/76897 , H01L23/485 , H01L23/53223 , H01L23/53238 , H01L23/53266 , H01L2924/0002 , Y10S438/927 , H01L2924/00
摘要： Processes of forming an insulated wire into an interlayer dielectric layer (ILD) of a back-end metallization includes thermally treating a metallic barrier precursor under conditions to cause at least one alloying element in the barrier precursor to form a dielectric barrier between the wire and the ILD. The dielectric barrier is therefore a self-forming, self-aligned barrier. Thermal processing is done under conditions to cause the at least one alloying element to migrate from a zone of higher concentration thereof to a zone of lower concentration thereof to further form the dielectric barrier. Various apparatus are made by the process.
摘要翻译：在后端金属化的层间电介质层（ILD）中形成绝缘线的工艺包括在使阻挡前体中的至少一个合金元素引起的金属屏障前体之间形成电介质势垒 ILD。因此，介电阻挡层是自形成的自对准势垒。热处理在使至少一种合金元素从其较高浓度的区域迁移到其较低浓度的区域的条件下进行以进一步形成电介质阻挡层。通过该方法制造各种装置。

94. 发明申请

US20130141577A1 APPARATUS AND METHOD FOR DETECTING ROAD SURFACE PROPERTIES 有权
标题翻译：检测道路表面特性的装置和方法
公开(公告)号：US20130141577A1
公开(公告)日：2013-06-06
申请号：US13432527
申请日：2012-03-28
申请人： Hyun Jae Yoo
发明人： Hyun Jae Yoo
IPC分类号： G01B11/24 , H04N7/18
CPC分类号： G01S17/88 , G01N21/21 , G01N21/55 , G01S7/4802 , G01S7/499
摘要： Disclosed is a technique for detecting a road surface property. More specifically, the technique includes a reflectivity table that stores a degree of reflectivity of a rainy road relative to a reference reflectivity and a degree of reflectivity of a snowy road relative to the reference reflectivity. A reflection measurement unit measures a reflection which is the amount of a laser beam that is emitted through a light emitting unit of a laser sensor, reflected from the road surface, and received by a light receiving unit, and a reflectivity calculation unit calculates a degree of reflectivity for the road in front of the vehicle via a ratio of the measured reflection and the reference reflectivity. A road surface property determination unit then detects the corresponding road surface property based on the reflectivity table.
摘要翻译：公开了一种用于检测路面特性的技术。更具体地，该技术包括反射率表，其相对于参考反射率相对于参考反射率和雪道的反射率存储下雨道的反射率。反射测量单元测量作为激光传感器的发光单元从路面反射并由光接收单元接收的激光束的量的反射，反射率计算单元计算度数通过测量的反射和参考反射率的比例，对车辆前方道路的反射率。然后，路面特性确定单元基于反射率表检测相应的路面特性。

95. 发明授权

US08368344B2 Refrigerator and operating method thereof 有权
标题翻译：冰箱及其操作方法
公开(公告)号：US08368344B2
公开(公告)日：2013-02-05
申请号：US12593528
申请日：2008-01-26
申请人： Jae Yoo Yoo , Chang Oh Kim
发明人： Jae Yoo Yoo , Chang Oh Kim
IPC分类号： H02P27/00 , H02P7/00 , G05D17/00
CPC分类号： F25B49/025 , F25B2600/021 , F25B2700/15 , H02M1/10 , H02P27/18 , H02P2201/03 , Y02B30/741
摘要： A refrigerator and a method of operating the same are disclosed. In the refrigerator and the method of operating the same, a voltage of an electric power input is measured and rectified through the half wave rectification or the full wave rectification in correspondence with the measured voltage, so that the refrigerator can be used without a voltage converting device when a voltage of the input power is changed. Therefore, the change or the modification of the circuit is not needed in order to use the refrigerator in other regions. Since components are compatible and utility of the components is improved, manufacturing costs can be reduced.
摘要翻译：公开了一种冰箱及其操作方法。在冰箱及其操作方法中，电压输入的电压通过与所测量的电压对应的半波整流或全波整流进行测量和整流，从而可以在没有电压转换的情况下使用冰箱当输入功率的电压变化时，因此，为了在其他区域使用冰箱，不需要改变或修改电路。由于部件兼容并且部件的实用性得到改善，所以可以降低制造成本。

96. 发明授权

US08197220B2 Driving control apparatus and method for linear compressor 有权
标题翻译：线性压缩机驱动控制装置及方法
公开(公告)号：US08197220B2
公开(公告)日：2012-06-12
申请号：US12297423
申请日：2007-04-18
申请人： Ji-Won Sung , Jae-Yoo Yoo , Kyung-Bum Heo
发明人： Ji-Won Sung , Jae-Yoo Yoo , Kyung-Bum Heo
IPC分类号： F04B49/06
CPC分类号： H02P25/06 , F04B35/045 , F04B49/065 , F04B49/12 , F04B2201/0206 , F04B2203/0401 , F04B2203/0402 , H02P25/032
摘要： An apparatus for controlling an operation of a reciprocating compressor, includes: a control unit for detecting a current pushed amount of a piston when a TDC is detected as an inflection point of a phase difference between stroke and current, comparing the current pushed amount with a pushed amount reference value, and applying a DC voltage applied to a linear motor based on the comparison result. An AC voltage and a DC voltage are applied to the linear motor to increase the stroke, and when the TDC is detected, the current pushed amount is calculated and compared with the pushed amount reference value, and then, the DC voltage or a DC current applied to the linear motor is varied based on the comparison result, thereby obtaining a maximum compression volume without collision of the piston.
摘要翻译：一种用于控制往复式压缩机的操作的装置，包括：控制单元，用于当TDC被检测为行程和电流之间的相位差的拐点时检测活塞的当前推动量，将当前推动量与推定量参考值，并且基于比较结果施加施加到线性电动机的DC电压。交流电压和直流电压被施加到线性电动机以增加行程，并且当检测到TDC时，计算当前推动量并将其与推压量参考值进行比较，然后将直流电压或直流电流基于比较结果，施加到直线电动机的方式变化，从而获得最大压缩体积而没有活塞碰撞。

97. 发明申请

US20120126889A1 Low Distortion Variable Gain Amplifier (VGA) 有权
标题翻译：低失真可变增益放大器（VGA）
公开(公告)号：US20120126889A1
公开(公告)日：2012-05-24
申请号：US13291782
申请日：2011-11-08
申请人： Steve Fang , Qiang Tang , Myung Jae Yoo
发明人： Steve Fang , Qiang Tang , Myung Jae Yoo
IPC分类号： H03F1/34 , H03F1/56
CPC分类号： H03F3/45071 , H03F1/303 , H03F1/3211 , H03F3/45475 , H03F2200/234 , H03F2203/45116 , H03F2203/45588 , H03F2203/45591 , H03F2203/45594 , H03F2203/45616 , H03F2203/45618 , H03G1/0023 , H03G3/004
摘要： In one embodiment, an apparatus an amplifier configured to receive an asymmetric signal. A first resistance is coupled between an input node and an output node of the amplifier, the input node receiving the asymmetric signal. A second resistance is coupled to the input node of the amplifier. The second resistance includes a linear resistor. A third resistance is coupled to the second resistance. The third resistance is varied to adjust an amount of asymmetric correction provided by the amplifier to correct the asymmetric signal at the output node. The amount of asymmetric correction is a function of the first resistance and a combination of the second resistance and the third resistance.
摘要翻译：在一个实施例中，一种被配置为接收不对称信号的放大器的装置。第一电阻耦合在放大器的输入节点和输出节点之间，输入节点接收不对称信号。第二电阻耦合到放大器的输入节点。第二个电阻包括一个线性电阻。第三电阻耦合到第二电阻。改变第三电阻以调整由放大器提供的非对称校正量，以校正输出节点处的不对称信号。非对称校正的量是第一电阻和第二电阻和第三电阻的组合的函数。

98. 发明授权

US08109736B2 Apparatus and method for controlling operation of a linear compressor using a phase difference inflection point detecting unit 有权
标题翻译：用于使用相位差拐点检测单元来控制线性压缩机的操作的装置和方法
公开(公告)号：US08109736B2
公开(公告)日：2012-02-07
申请号：US12087772
申请日：2006-12-28
申请人： Jae-Yoo Yoo , Ji-Won Sung , Chel-Woong Lee
发明人： Jae-Yoo Yoo , Ji-Won Sung , Chel-Woong Lee
IPC分类号： F04B49/06 , H02P1/00
CPC分类号： H02P25/06 , F04B35/045 , F04B49/06 , F04B49/065 , F04B2201/0206 , F04B2203/0401 , F04B2203/0402 , H02P25/032
摘要： An apparatus and method for controlling an operation of a linear compressor by detecting a phase difference inflection point at a time point when a phase difference between a current and a stroke is placed within a certain region, and by recognizing the phase difference infection point as a top dead center (TDC)=O. The apparatus for controlling an operation of a linear compressor, comprises: a controlling unit for detecting a phase difference between a current and a stroke, and outputting a frequency varying signal or a phase difference inflection point detecting signal based on the detected phase difference; a phase difference inflection point detecting unit for judging whether to detect a phase difference inflection point or not by the phase difference inflection point detecting signal, and outputting a stroke command value controlling signal based on a result of the judgement; and a stroke command value determining unit for determining a stroke command value based on the stroke command value controlling signal.
摘要翻译：一种线性压缩机的操作控制装置和方法，该方法通过在当前和行程之间的相位差放置在特定区域内的时间点检测相位差拐点，并将相位差感测点识别为上死点（TDC）= O。用于控制线性压缩机的操作的装置包括：用于检测电流和行程之间的相位差的控制单元，并且基于检测到的相位差输出频率变化信号或相位差拐点检测信号; 相位差拐点检测单元，用于通过相位差拐点检测信号判断是否检测相位差拐点，并根据判断结果输出行程指令值控制信号; 以及行程命令值确定单元，用于基于行程命令值控制信号来确定行程命令值。

99. 发明申请

US20110298102A1 SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE 有权
标题翻译：半导体封装和制造半导体封装的方法
公开(公告)号：US20110298102A1
公开(公告)日：2011-12-08
申请号：US12892032
申请日：2010-09-28
申请人： Do-Jae Yoo , Young-Do Kweon , Joon-Seok Kang , Chang-Bae Lee
发明人： Do-Jae Yoo , Young-Do Kweon , Joon-Seok Kang , Chang-Bae Lee
IPC分类号： H01L23/552 , H01L21/02
CPC分类号： H01L23/3121 , H01L23/49811 , H01L23/50 , H01L23/552 , H01L24/48 , H01L24/73 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73257 , H01L2924/00014 , H01L2924/181 , H01L2924/19105 , H01L2924/19107 , H01L2924/3025 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor package and a method of manufacturing the semiconductor package are disclosed. A semiconductor package in accordance with an embodiment of the present invention includes a substrate, which is formed with a ground circuit and mounted with a semiconductor chip on one surface, a conductive ground layer, which is formed on the other surface of the substrate and connected with the ground circuit, a molding, which seals up the ground layer and the substrate having the semiconductor chip mounted thereon, and a conductive shield, which covers the molding and is connected with the ground layer. With a semiconductor package in accordance with an embodiment of the present invention, grounding for shielding is possible even in an entirely molded structure, and a double shielding structure to improve the shielding property.
摘要翻译：公开了一种半导体封装和半导体封装的制造方法。根据本发明的实施例的半导体封装包括形成有接地电路并且在一个表面上安装有半导体芯片的基板，形成在基板的另一表面上并连接的导电接地层接地电路，密封接地层和其上安装有半导体芯片的基板的模制件和覆盖模制件并与接地层连接的导电屏蔽件。利用根据本发明的实施例的半导体封装，即使在完全模制的结构中也可以进行屏蔽的接地，以及用于提高屏蔽性的双重屏蔽结构。

100. 发明申请

US20110254039A1 LIGHT EMITTING DIODE PACKAGE, LIGHTING APPARATUS HAVING THE SAME, AND METHOD FOR MANUFACTURING LIGHT EMITTING DIODE PACKAGE 审中-公开
标题翻译：发光二极管封装，具有该发光二极管封装的照明装置，以及制造发光二极管封装的方法
公开(公告)号：US20110254039A1
公开(公告)日：2011-10-20
申请号：US13087799
申请日：2011-04-15
申请人： Kyu Sang KIM , Jin Ha Kim , Jae Yoo Jeong , Moo Youn Park , Chung Bae Jeon
发明人： Kyu Sang KIM , Jin Ha Kim , Jae Yoo Jeong , Moo Youn Park , Chung Bae Jeon
IPC分类号： H01L33/50
CPC分类号： H01L33/50 , H01L24/97 , H01L25/0753 , H01L33/44 , H01L33/46 , H01L33/56 , H01L2224/14 , H01L2224/48091 , H01L2224/48465 , H01L2224/49107 , H01L2224/73265 , H01L2224/8592 , H01L2924/12041 , H01L2924/15787 , H01L2924/181 , H01L2933/0091 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A light emitting diode (LED) package, a lighting apparatus including the same, and a method for manufacturing an LED package are disclosed. The LED package includes: a package substrate; an LED chip mounted on the package substrate; and a wavelength conversion layer formed to cover at least a portion of an upper surface of the LED chip when a surface formed by the LED chip when viewed from above is defined as the upper surface of the LED chip, wherein the wavelength conversion layer is formed so as not to exceed the area of the upper surface of the LED chip and includes a flat surface parallel to the upper surface of the LED chip and curved surfaces connecting the corners of the upper surface of the LED chip.
摘要翻译：公开了一种发光二极管（LED）封装，包括该发光二极管（LED）封装的照明装置以及制造LED封装的方法。 LED封装包括：封装基板; 安装在封装基板上的LED芯片; 以及波长转换层，形成为当从上方观察由LED芯片形成的表面时，将LED芯片的上表面的至少一部分覆盖为LED芯片的上表面，形成波长转换层以便不超过LED芯片的上表面的面积，并且包括平行于LED芯片的上表面的平坦表面和连接LED芯片的上表面的拐角的曲面。

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