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    • 96. 发明申请
    • Thin film transistor array panel and method for manufacturing the same
    • 薄膜晶体管阵列面板及其制造方法
    • US20060091396A1
    • 2006-05-04
    • US11249500
    • 2005-10-14
    • Je-Hun LeeYang-Ho BaeBeom-Seok ChoChang-Oh Jeong
    • Je-Hun LeeYang-Ho BaeBeom-Seok ChoChang-Oh Jeong
    • H01L29/04
    • H01L27/3279H01L27/124H01L27/1288H01L51/0023H01L51/56
    • The invention provides a thin film transistor (TFT) array panel that includes an insulating substrate; a gate line formed on the insulating substrate and having a first layer of an Al containing metal, a second layer of a Cu containing metal that is thicker than the first layer, and a gate electrode; a gate insulating layer arranged on the gate line; a semiconductor arranged on the gate insulating layer; a data line having a source electrode and arranged on the gate insulating layer and the semiconductor; a drain electrode arranged on the gate insulating layer and the semiconductor and facing the source electrode; a passivation layer having a contact hole and arranged on the data line and the drain electrode; and a pixel electrode arranged on the passivation layer and coupled with the drain electrode through the contact hole.
    • 本发明提供一种薄膜晶体管(TFT)阵列面板,其包括绝缘基板; 形成在所述绝缘基板上并具有含有Al的金属的第一层,比所述第一层更厚的含Cu金属的第二层的栅极线和栅电极; 栅极绝缘层,布置在栅极线上; 布置在栅绝缘层上的半导体; 数据线,其具有源电极并且布置在所述栅极绝缘层和所述半导体上; 布置在所述栅绝缘层和所述半导体上并面对所述源电极的漏电极; 钝化层,其具有接触孔并且布置在所述数据线和所述漏电极上; 以及设置在钝化层上并通过接触孔与漏电极耦合的像素电极。
    • 100. 发明授权
    • Oxide semiconductor thin-film transistor
    • 氧化物半导体薄膜晶体管
    • US08841663B2
    • 2014-09-23
    • US13080413
    • 2011-04-05
    • Je-Hun LeeJae-Woo ParkByung-Du AhnSei-Yong ParkJun-Hyun Park
    • Je-Hun LeeJae-Woo ParkByung-Du AhnSei-Yong ParkJun-Hyun Park
    • H01L29/10H01L29/12H01L29/786H01L29/45
    • H01L29/45H01L29/78618H01L29/7869H01L29/78696
    • A thin-film transistor includes a gate electrode, a source electrode, a drain electrode, a gate insulation layer and an oxide semiconductor pattern. The source and drain electrodes include a first metal element with a first oxide formation free energy. The oxide semiconductor pattern has a first surface making contact with the gate insulation layer and a second surface making contact with the source and drain electrodes to be positioned at an opposite side of the first surface. The oxide semiconductor pattern includes an added element having a second oxide formation free energy having an absolute value greater than or equal to an absolute value of the first oxide formation free energy, wherein an amount of the added element included in a portion near the first surface is zero or smaller than an amount of the added element included in a portion near the second surface.
    • 薄膜晶体管包括栅电极,源电极,漏电极,栅极绝缘层和氧化物半导体图案。 源极和漏极包括具有第一氧化物形成自由能的第一金属元件。 氧化物半导体图案具有与栅极绝缘层接触的第一表面和与源极和漏极电极接触以与第一表面相对的第二表面。 氧化物半导体图案包括具有绝对值大于或等于第一氧化物形成自由能的绝对值的第二氧化物形成自由能的添加元素,其中包括在第一表面附近的部分中的添加元素的量 为零或小于包含在靠近第二表面的部分中的添加元素的量。