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1. 发明授权

US06503427B1 Heat-resistant polymer foam, process for producing the same, and foam substrate 有权
标题翻译：耐热聚合物泡沫，其制造方法和泡沫基材
公开(公告)号：US06503427B1
公开(公告)日：2003-01-07
申请号：US09588240
申请日：2000-06-06
申请人： Takayuki Yamamoto , Amane Mochizuki , Takami Hikita , Tomohiro Taruno , Tomohide Banba , Mitsuhiro Kanada
发明人： Takayuki Yamamoto , Amane Mochizuki , Takami Hikita , Tomohiro Taruno , Tomohide Banba , Mitsuhiro Kanada
IPC分类号： B32B1508
CPC分类号： C08J9/12 , B29C44/348 , C08J2201/032 , C08J2203/06 , C08J2203/08 , C08J2379/08 , Y10T428/31681
摘要： A heat-resistant polymer foam is disclosed which has excellent heat resistance, a fine cellular structure, and a low apparent density. The heat-resistant polymer foam comprises a heat-resistant polymer having a glass transition point of 120° C. or higher, e.g., a polyimide or polyether imide, and has an average cell diameter of from 0.01 &mgr;m to less than 10 &mgr;m. This heat-resistant polymer foam can be produced by, for example, impregnating a heat-resistant polymer under pressure with an non-reactive gas such as carbon dioxide, which is in, e.g., a supercritical state, reducing the pressure, and then heating the polymer at a temperature exceeding 120° C. to foam the polymer.
摘要翻译：公开了一种耐热聚合物泡沫体，其具有优异的耐热性，细微结构和低表观密度。耐热聚合物泡沫体包含玻璃化转变点为120℃以上的耐热聚合物，例如聚酰亚胺或聚醚酰亚胺，平均泡孔直径为0.01〜10μm。该耐热性聚合物泡沫体可以通过例如在耐压聚合物中用非反应性气体如二氧化碳浸渍，例如二氧化碳，例如超临界状态，降低压力，然后加热聚合物在超过120℃的温度下使聚合物发泡。

2. 发明授权

US06387969B1 Porous article and process for producing porous article 有权
标题翻译：多孔制品和多孔制品生产工艺
公开(公告)号：US06387969B1
公开(公告)日：2002-05-14
申请号：US09655441
申请日：2000-09-05
申请人： Takayuki Yamamoto , Amane Mochizuki , Takahiro Fukuoka , Tomohiro Taruno , Mitsuhiro Kanada
发明人： Takayuki Yamamoto , Amane Mochizuki , Takahiro Fukuoka , Tomohiro Taruno , Mitsuhiro Kanada
IPC分类号： C08J926
CPC分类号： H05K3/0011 , C08J9/26 , C08J2201/042 , C08J2201/046 , C08J2203/08 , H05K2201/0116 , H05K2203/0773 , H05K2203/0783 , H05K2203/083 , Y02P20/544
摘要： A porous article having excellent heat resistance, a finely cellular structure, and a low dielectric constant; and a process for producing the porous article which comprises subjecting a polymer composition having a micro-domain structure comprising a continuous polymer phase and dispersed therein a discontinuous phase having an average diameter smaller than 10 &mgr;m to a treatment for removing the ingredient constituting the discontinuous phase by at least one operation selected from vaporization and decomposition and by an extraction operation to thereby make the polymer porous. The ingredient constituting the discontinuous phase has a weight average molecular weight of, e.g., 10,000 or lower. Liquefied carbon dioxide, supercritical carbon dioxide, or the like can be used as an extraction solvent for the ingredient constituting the discontinuous phase.
摘要翻译：具有优异的耐热性，细孔结构和低介电常数的多孔制品; 以及一种制造多孔制品的方法，该方法包括使包含连续聚合物相的微结构结构的聚合物组合物分散在平均直径小于10μm的不连续相中，以除去构成不连续相的成分通过选自蒸发和分解的至少一种操作和通过萃取操作，从而使聚合物多孔。构成不连续相的成分的重均分子量例如为10,000以下。可以使用液化二氧化碳，超临界二氧化碳等作为构成不连续相的成分的提取溶剂。

3. 发明授权

US07115673B2 Photosensitive resin composition, porous resin, circuit board, and wireless suspension board 失效
标题翻译：感光树脂组合物，多孔树脂，电路板和无线悬挂板
公开(公告)号：US07115673B2
公开(公告)日：2006-10-03
申请号：US10736529
申请日：2003-12-17
申请人： Amane Mochizuki , Takahiro Fukuoka , Mitsuhiro Kanada , Takayuki Yamamoto , Tomohiro Taruno
发明人： Amane Mochizuki , Takahiro Fukuoka , Mitsuhiro Kanada , Takayuki Yamamoto , Tomohiro Taruno
IPC分类号： C08J3/24 , C08J9/26 , C08J99/00 , B32B27/16 , B32B27/42
CPC分类号： H05K1/056 , G03F7/037 , H05K1/024 , H05K1/0346 , H05K3/0023 , H05K3/28 , H05K3/4676 , H05K2201/0116 , H05K2201/0154 , Y10S522/903 , Y10S522/915 , Y10T428/31721
摘要： The present photosensitive resin composition 2 comprises a polyamic acid resin 4, a photosensitive agent, a dispersible compound 3 dispersible in the polyamic acid resin 4, and a solvent. The porous resin is obtained by removing the solvent from the photosensitive resin composition 2 to form a composition in which the dispersible compound 3 is dispersed in the polyamic acid resin 4, removing the dispersible compound to make the composition porous, and curing the porous photosensitive resin composition. The porous resin enables forming a fine circuit pattern and has a low dielectric constant and, when used as an insulating layer of a circuit board, brings about improved high frequency characteristics.
摘要翻译：本发明的感光性树脂组合物2包含聚酰胺酸树脂4，光敏剂，分散在聚酰胺酸树脂4中的分散性化合物3和溶剂。多孔树脂通过从感光性树脂组合物2中除去溶剂而形成分散性化合物3分散在聚酰胺酸树脂4中的组合物，除去分散性化合物，使组合物多孔，并使多孔感光性树脂组成。多孔树脂能够形成精细电路图案并且具有低介电常数，并且当用作电路板的绝缘层时，会带来改善的高频特性。

4. 发明授权

US06696529B1 Photosensitive resin composition, porous resin, circuit board, and wireless suspension board 失效
公开(公告)号：US06696529B1
公开(公告)日：2004-02-24
申请号：US09721666
申请日：2000-11-27
申请人： Amane Mochizuki , Takahiro Fukuoka , Mitsuhiro Kanada , Takayuki Yamamoto , Tomohiro Taruno
发明人： Amane Mochizuki , Takahiro Fukuoka , Mitsuhiro Kanada , Takayuki Yamamoto , Tomohiro Taruno
IPC分类号： C08G6948
CPC分类号： H05K1/056 , G03F7/037 , H05K1/024 , H05K1/0346 , H05K3/0023 , H05K3/28 , H05K3/4676 , H05K2201/0116 , H05K2201/0154 , Y10S522/903 , Y10S522/915 , Y10T428/31721
摘要： The present photosensitive resin composition 2 comprises a polyamic acid resin 4, a photosensitive agent, a dispersible compound 3 dispersible in the polyamic acid resin 4, and a solvent. The porous resin is obtained by removing the solvent from the photosensitive resin composition 2 to form a composition in which the dispersible compound 3 is dispersed in the polyamic acid resin 4, removing the dispersible compound to make the composition porous, and curing the porous photosensitive resin composition. The porous resin enables forming a fine circuit pattern and has a low dielectric constant and, when used as an insulating layer of a circuit board, brings about improved high frequency characteristics.

5. 发明授权

US06376633B1 Acrylic pressure-sensitive adhesive composition and process for producing the same 有权
标题翻译：丙烯酸类压敏粘合剂组合物及其制造方法
公开(公告)号：US06376633B1
公开(公告)日：2002-04-23
申请号：US09472870
申请日：1999-12-28
申请人： Takayuki Yamamoto , Tomohiro Taruno , Tomohide Bamba , Mitsuhiro Kanada , Yoshihiro Minamizaki
发明人： Takayuki Yamamoto , Tomohiro Taruno , Tomohide Bamba , Mitsuhiro Kanada , Yoshihiro Minamizaki
IPC分类号： C08F12018
CPC分类号： C08F220/18 , C08F20/12
摘要： An acrylic pressure-sensitive adhesive composition which contains a high molecular weight polymer, is excellent in cohesive force and adhesive strength and can be prepared without using an organic solvent. The acrylic pressure-sensitive adhesive composition is produced by a process which comprises radical-polymerizing monomers containing an alkyl (meth)acrylate using carbon dioxide as a diluent to thereby prepare a pressure-sensitive adhesive composition containing an acrylic polymer having a weight average molecular weight of 400,000 or more. The polymerization pressure ranges from, for example, about 5.7 to 40 MPa, AND the polymerization temperature ranges from, for example, about 20 to 100° C.
摘要翻译：含有高分子量聚合物的丙烯酸类压敏粘合剂组合物的内聚力和粘合强度优异，可以在不使用有机溶剂的情况下制备。丙烯酸类压敏粘合剂组合物通过包括自由基聚合使用二氧化碳作为稀释剂的含有（甲基）丙烯酸烷基酯的单体，由此制备含有重均分子量为40万以上的丙烯酸类聚合物的压敏粘合剂组合物。聚合压力范围为例如约5.7〜40MPa，聚合温度为例如约20〜100℃。

6. 发明授权

US06224938B1 Method for producing foamed pressure-sensitive adhesive tape or sheet 有权
标题翻译：生产泡沫压敏粘合带或片材的方法
公开(公告)号：US06224938B1
公开(公告)日：2001-05-01
申请号：US09456910
申请日：1999-12-07
申请人： Tomohide Bamba , Takayuki Yamamoto , Tomohiro Taruno , Mitsuhiro Kanada , Yoshihiro Minamizaki
发明人： Tomohide Bamba , Takayuki Yamamoto , Tomohiro Taruno , Mitsuhiro Kanada , Yoshihiro Minamizaki
IPC分类号： B05D100
CPC分类号： C09J7/385 , Y02P20/544
摘要： A method and apparatus for producing a foamed pressure-sensitive adhesive tape or sheet having a fine cell structure with a good production efficiency without through complicated steps are provided. The method comprises subjecting a mixture containing monomers of a polymer constituting a foamed pressure-sensitive adhesive layer to polymerization in an inert fluid in a supercritical state or a liquid state under pressure, and ejecting the polymerized composition obtained on a substrate under a pressure lower than the pressure in the polymerization to form a foamed pressure-sensitive adhesive layer applied on the substrate. The apparatus comprises a pressure vessel for polymerizing monomers of a polymer constituting a foamed pressure-sensitive adhesive layer under pressure, an inert fluid supplying means for supplying an inert fluid in a supercritical state or a liquid state to the pressure vessel, and an ejection means for ejecting the polymerized composition obtained by polymerizing the monomers.
摘要翻译：提供了一种不经过复杂步骤生产具有良好生产效率的细胞结构的泡沫压敏粘合带或片材的方法和装置。该方法包括使构成发泡压敏粘合剂的聚合物的混合物在超临界状态或压力状态的惰性流体中进行聚合，并在低于聚合反应压力的压力下喷射在基材上得到的聚合组合物，形成施加在基材上的发泡压敏粘合剂层该装置包括用于在压力下聚合构成发泡压敏粘合剂层的聚合物的单体的压力容器，用于将超临界状态或液态的惰性流体供应到压力容器的惰性流体供给装置，以及喷射用于喷射通过聚合得到的聚合组合物的方法单体。

7. 发明申请

US20070149630A1 Composition for polyolefin resin foam and foam thereof, and method for producing foam 审中-公开
标题翻译：聚烯烃树脂发泡体及其泡沫体用组合物及其制造方法
公开(公告)号：US20070149630A1
公开(公告)日：2007-06-28
申请号：US11711777
申请日：2007-02-28
申请人： Takayuki Yamamoto , Katsuhiko Tachibana , Tomohiro Taruno , Mitsuhiro Kanada
发明人： Takayuki Yamamoto , Katsuhiko Tachibana , Tomohiro Taruno , Mitsuhiro Kanada
IPC分类号： B29C44/34
CPC分类号： C08J9/0061 , C08J9/0066 , C08J9/122 , C08J2203/08 , C08J2323/02 , C08J2421/00
摘要： A composition for a polyolefin resin foam, which comprises a polymer component comprising a polyolefin resin, and at least one of a rubber and a thermoplastic olefin elastomer, and powdery particles, wherein said composition has a melt tension of at least 20 cN when measured in a range between a first temperature at a melting point of said composition and a second temperature that is 20 degrees Celsius higher than said first temperature.
摘要翻译：一种用于聚烯烃树脂泡沫的组合物，其包含聚烯烃树脂的聚合物组分和橡胶和热塑性烯烃弹性体中的至少一种和粉末颗粒，其中所述组合物在熔体张力为至少20cN时测量所述组合物的熔点的第一温度和比所述第一温度高20摄氏度的第二温度之间的范围。

8. 发明授权

US06461725B1 Finely foamed pressure-sensitive adhesive tape or sheet and method for producing the same 有权
标题翻译：精细发泡压敏粘合带或片材及其制造方法
公开(公告)号：US06461725B1
公开(公告)日：2002-10-08
申请号：US09456911
申请日：1999-12-07
申请人： Mitsuhiro Kanada , Takayuki Yamamoto , Tomohiro Taruno , Tomohide Bamba , Yoshihiro Minamizaki
发明人： Mitsuhiro Kanada , Takayuki Yamamoto , Tomohiro Taruno , Tomohide Bamba , Yoshihiro Minamizaki
IPC分类号： C09J702
CPC分类号： B29C44/3453 , B29C44/3446 , C09J7/383 , C09J7/385 , C09J2421/00 , C09J2423/00 , Y02P20/544 , Y10T428/1462 , Y10T428/249982 , Y10T428/249983 , Y10T428/249984 , Y10T428/249985 , Y10T428/2852
摘要： A finely foamed pressure-sensitive adhesive tape or sheet possessing a pressure-sensitive adhesive layer having a fine cell size and cell wall thickness is disclosed. The tape or sheet is obtained by impregnating the pressure-sensitive adhesive tape or sheet with carbon dioxide in a liquid state or a supercritical state, and reducing the pressure to foam the pressure-sensitive adhesive layer. The main component of the pressure-sensitive adhesive layer is, for example, an acrylic resin or a rubber-based resin. The method provides a finely foamed pressure-sensitive adhesive tape or resin possessing a pressure-sensitive adhesive layer having a fine cell structure such that an average cell size d is from 0.01 to 1000 &mgr;m, an average cell wall thickness t is from 0.01 to 2000 &mgr;m, and the ratio t/d is in the range of from 0.5 to 3.5.
摘要翻译：公开了具有细孔尺寸和细胞壁厚度的压敏粘合剂层的精细发泡的压敏粘合带或片。通过用液态或超临界状态的二氧化碳浸渍压敏粘合带或片而获得胶带或片，并降低压力以使压敏粘合剂层发泡。粘合剂层的主要成分例如为丙烯酸树脂或橡胶类树脂。该方法提供具有细孔结构使得平均泡孔尺寸d为0.01-1000μm，平均泡孔壁厚t为0.01-2000μm的压敏粘合剂层的精细发泡压敏粘合带或树脂妈妈，比例t / d在0.5-3.5的范围内。

9. 发明授权

US06451965B1 Method of removing low molecular weight substance from polyimide precursor or polyimide containing low molecular weight substance 有权
标题翻译：从含有低分子量物质的聚酰亚胺前体或聚酰亚胺中除去低分子量物质的方法
公开(公告)号：US06451965B1
公开(公告)日：2002-09-17
申请号：US09987050
申请日：2001-11-13
申请人： Mitsuhiro Kanada , Takayuki Yamamoto , Amane Mochizuki , Takahiro Fukuoka
发明人： Mitsuhiro Kanada , Takayuki Yamamoto , Amane Mochizuki , Takahiro Fukuoka
IPC分类号： C08F600
CPC分类号： H05K1/0346 , C08J9/26 , C08J2201/032 , C08J2201/042 , C08J2203/08 , C08J2379/08 , Y02P20/544
摘要： A method of efficiently removing a low molecular weight substance from a polyimide precursor or polyimide in which the low molecular weight substance is dispersed as micro-domains, without using a large amount of an organic solvent. The method of removing a low molecular weight substance comprises subjecting either a polymer composition having a micro-domain structure made up of a continuous phase comprising a polyimide precursor and, dispersed therein, a discontinuous phase comprising a low molecular weight substance or a polyimide composition obtained from the polymer composition by converting the polyimide precursor into a polyimide to extraction with a combination of supercritical carbon dioxide and a co-solvent to thereby remove the low molecular weight substance. The co-solvent is preferably an aprotic polar solvent, more preferably a nitrogen compound solvent or a sulfur compound solvent.
摘要翻译：从低分子量物质作为微区域分散的聚酰亚胺前体或聚酰亚胺有效地除去低分子量物质的方法，而不使用大量的有机溶剂。除去低分子量物质的方法包括使具有由包含聚酰亚胺前体的连续相构成的微区结构的聚合物组合物和分散在其中的包含低分子量物质的不连续相或获得的聚酰亚胺组合物通过将聚酰亚胺前体转变为聚酰亚胺，通过超临界二氧化碳和共溶剂的组合提取，从而从聚合物组合物中除去低分子量物质。共溶剂优选为非质子极性溶剂，更优选为氮化合物溶剂或硫化合物溶剂。

10. 发明授权

US06372808B1 Process for producing porous polyimide and porous polyimide 有权
标题翻译：生产多孔聚酰亚胺和多孔聚酰亚胺的方法
公开(公告)号：US06372808B1
公开(公告)日：2002-04-16
申请号：US09984416
申请日：2001-10-30
申请人： Mitsuhiro Kanada , Takayuki Yamamoto , Amane Mochizuki , Takahiro Fukuoka
发明人： Mitsuhiro Kanada , Takayuki Yamamoto , Amane Mochizuki , Takahiro Fukuoka
IPC分类号： C08J926
CPC分类号： C08J9/28 , C08J2201/0464 , C08J2379/08 , H05K1/0346 , Y02P20/544
摘要： A porous polyimide having a finely cellular structure and having a low dielectric constant and heat resistance. The porous polyimide can be produced by a process comprising adding a dispersible compound to a polyimide precursor to form a micro-domain structure in which the dispersible compound is dispersed in the polymer so as to have a size smaller than 10 &mgr;m and then removing the dispersible compound by extraction with supercritical carbon dioxide to thereby make the precursor porous, wherein the interaction parameter &khgr;AB between the polyimide precursor A and the dispersible compound B is larger than 3. This porous polyimide has an average cell diameter smaller than 5 &mgr;m and a dielectric constant of 3 or lower.
摘要翻译：具有微细结构并具有低介电常数和耐热性的多孔聚酰亚胺。多孔聚酰亚胺可以通过包括向聚酰亚胺前体中加入可分散化合物以形成其中可分散化合物分散在聚合物中以使其尺寸小于10μm的微畴结构，然后除去可分散的通过用超临界二氧化碳萃取，从而使前体多孔化，其中聚酰亚胺前体A和可分散化合物B之间的相互作用参数和AB均大于3.该多孔聚酰亚胺的平均泡孔直径小于5μm，介电常数为3以下。

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