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    • 6. 发明申请
    • ELECTROWETTING DEVICE
    • 电镀设备
    • US20120200939A1
    • 2012-08-09
    • US13499918
    • 2010-09-29
    • Stein KuiperJohannes Wilhelmus Weekamp
    • Stein KuiperJohannes Wilhelmus Weekamp
    • G02B3/12C25D11/02
    • G02B3/14G02B26/005
    • The invention relates to an electrowetting-on-dielectric device (200). This is an electro wetting device comprising one or more cells, wherein each cell comprises an electrowetting composition of first and second immiscible fluids, the first fluid being an electrolytic solution (240), a first electrode (230), separated from the electrowetting composition by a dielectric (231), and a voltage source (260) for applying an operating voltage difference between the first electrode (230) and the electrolytic solution to operate the electrowetting device. According to the invention, the first electrode (230) of the electrowetting-on-dielectric device (200) comprises a valve metal, and the electrolytic solution (240) is capable of anodizing the valve metal to form a metal oxide at the operating voltage difference. This provides the electrowetting-on-dielectric device (200) with self-repairing properties thereby preventing breakdown of the dielectric. As a result, the electrowetting device can be operated at a low voltage, and it has an improved reliability.
    • 本发明涉及一种电润湿介电装置(200)。 这是一种包含一个或多个电池的电润湿装置,其中每个电池包括第一和第二不混溶流体的电润湿组合物,第一流体是电解溶液(240),第一电极(230),其与电润湿组合物分离, 电介质(231)和用于在第一电极(230)和电解液之间施加工作电压差以操作电润湿装置的电压源(260)。 根据本发明,电介质电介质器件(200)的第一电极(230)包括阀金属,并且电解溶液(240)能够在操作电压下阳极氧化阀金属以形成金属氧化物 区别。 这提供了具有自修复性能的电介质电介质器件(200),从而防止电介质的破坏。 结果,电润湿装置可以在低电压下操作,并且其可靠性提高。
    • 9. 发明申请
    • METHOD FOR MANUFACTURING A MICROELECTRONIC PACKAGE COMPRISING A SILICON MEMS MICROPHONE
    • 制造包含硅MEMS麦克风的微电子封装的方法
    • US20100155863A1
    • 2010-06-24
    • US12063117
    • 2006-08-04
    • Johannes Wilhelmus Weekamp
    • Johannes Wilhelmus Weekamp
    • H01L29/84H01L21/02H04R25/00
    • B81C1/0023B81B2201/0257B81C2203/0154H01L2224/48091H01L2224/49171H01L2924/00014
    • A method for manufacturing a microelectronic package comprising a silicon MEMS microphone comprises the following steps: providing a basic panel (100) having several rows of interconnected substrates (90), wherein the substrates (90) are provided with electrically conductive connection pads (31), electrically conductive tracks (33), and a grid (40) comprising tiny holes (41); arranging an IC chip (50), a silicon MEMS microphone (60) and a ring-shaped element (95) on the substrates (90), wherein the ring-shaped element (95) is arranged around the microphone (60); and folding the substrates (90) in three, wherein an open side of the ring-shaped element (95) is closed. The IC chip (50) and the microphone (60) are safely accommodated in the package (5) that is obtained in this way. The connection pads (31) allow for easy connection of the package (5) to another device, while 32 electrical connections to the IC chip (50) are also easily realized through these connection pads (31). An electrical connection of the microphone (60) to the IC chip (50) is realized through the electrically conductive tracks (33).
    • 一种用于制造包括硅MEMS麦克风的微电子封装的方法包括以下步骤:提供具有多行互连基板(90)的基板(100),其中所述基板(90)设置有导电连接焊盘(31) ,导电轨道(33)和包括微小孔(41)的格栅(40); 在所述基板(90)上布置IC芯片(50),硅MEMS麦克风(60)和环形元件(95),其中所述环形元件(95)围绕所述麦克风(60)布置; 并将基板(90)折叠成三个,其中环形元件(95)的开放侧被封闭。 IC芯片(50)和麦克风(60)被安全地容纳在以这种方式获得的封装(5)中。 连接焊盘(31)允许将封装(5)容易地连接到另一个器件,而通过这些连接焊盘(31)也容易实现与IC芯片(50)的32个电连接。 通过导电轨道(33)实现麦克风(60)与IC芯片(50)的电连接。