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1. 发明授权

US10057993B2 Manufacturing method of power-module substrate 有权
公开(公告)号：US10057993B2
公开(公告)日：2018-08-21
申请号：US14652554
申请日：2013-12-03
申请人： MITSUBISHI MATERIALS CORPORATION
发明人： Hiroya Ishizuka
IPC分类号： B23K1/00 , H05K3/20 , H01L23/373 , H01L21/48 , C04B37/02 , B23K1/19
CPC分类号： H05K3/20 , B23K1/0016 , B23K1/19 , C04B37/026 , C04B2237/121 , C04B2237/128 , C04B2237/365 , C04B2237/366 , C04B2237/402 , C04B2237/407 , C04B2237/52 , C04B2237/704 , H01L21/4871 , H01L23/3735 , H01L2924/0002 , H05K2203/04 , H01L2924/00
摘要： A manufacturing method of power-module substrate (10), the power-module substrate (10) being obtained by joining a circuit layer (12) made of copper to one surface of a ceramic substrate (11) and joining a heat-radiation layer (13) made of aluminum to the other surface of the ceramic substrate (11), including: a circuit layer bonding step in which the circuit layer (12) is brazed on the ceramic substrate (11), a surface treatment step after the circuit layer bonding step in which a thickness of an oxide film on the other surface of the ceramic substrate (11) is made 3.2 nm or less at least at a peripheral part of an intended bonding area between the ceramic substrate (11) and the heat-radiation layer (13), and a heat-radiation layer bonding step in which the heat-radiation layer (13) is brazed on the other surface of the ceramic substrate (11) after the surface treatment step.

2. 发明授权

US09661793B2 Electronic component mounting system and electronic component mounting method 有权
公开(公告)号：US09661793B2
公开(公告)日：2017-05-23
申请号：US14443691
申请日：2013-11-15
申请人： Panasonic Intellectual Property Management Co., Ltd.
发明人： Katsuhiko Itoh , Mitsuo Nakamura , Daisuke Nagai , Kenji Okamoto
IPC分类号： B23K31/02 , H05K13/00 , H05K13/08 , B23K1/00 , B23K1/20 , B23K31/12 , B23K37/04 , H05K3/34 , B23K1/008 , B23K3/06 , B23K3/08 , H05K13/04 , H05K3/30 , B23K101/42
CPC分类号： H05K13/0015 , B23K1/0016 , B23K1/008 , B23K1/20 , B23K3/0638 , B23K3/087 , B23K31/12 , B23K37/04 , B23K2101/42 , H05K3/303 , H05K3/34 , H05K13/0465 , H05K13/08 , H05K13/0812 , H05K13/0817 , H05K2201/10636 , H05K2203/04 , H05K2203/163 , H05K2203/166 , Y02P70/611
摘要： In mounting position correction of detecting a position of printed solder, calculating a positional-shift amount between a position of an electrode and the position of the printed solder, and correcting a mounting position based on the calculated positional-shift amount, when a correction amount based on the calculated positional-shift amount exceeds a limit value which indicates an upper limit of the correction amount which is defined and allowed in mounting information, the electronic component is mounted on the mounting position which is corrected by considering the limit value as the correction amount. Accordingly, it is possible to appropriately employ mounting position correction by considering a solder printing position as a reference in accordance with the degree of printing position shift, and to obtain an expected joint quality improvement effect.

3. 发明申请

US20160316571A1 AUTOMATIC POWER DISCONNECT METHOD 有权
标题翻译：自动断电方式
公开(公告)号：US20160316571A1
公开(公告)日：2016-10-27
申请号：US15202226
申请日：2016-07-05
申请人： Western Digital Technologies, Inc.
发明人： ALAN P. RICE , ANDRE PRATAMA , JEFFREY ALAN WILSON , FIROUZ FELFELI
IPC分类号： H05K3/34 , H01R12/72 , H01R43/20
CPC分类号： H05K3/3405 , H01R4/027 , H01R12/722 , H01R43/205 , H05K1/0263 , H05K1/181 , H05K2201/10189 , H05K2203/04
摘要： Coupling an electrical connector to a printed circuit board (PCB) involves disposing forms of conductive bonding agent on the PCB, pressing spring-loaded power pins of an electrical connector towards a surface of the PCB, heating the forms of conductive bonding agent, thereby at least partially melting the forms, pressing the spring-loaded power pins into the melted forms of conductive bonding agent, and holding the power pins in the forms until the forms have cooled enough to form a bond that holds the power pins, thereby forming an electrical connection between the one or more pins and the PCB. The spring-loaded power pins are configured to automatically lift away from the surface of the PCB when the bond is weakened.
摘要翻译：将电连接器耦合到印刷电路板（PCB）包括在PCB上布置导电粘合剂的形式，将电连接器的弹簧加载的电源引脚压向PCB的表面，加热导电粘合剂的形式，从而至少部分地熔化形式，将弹簧加载的电源销压入熔融形式的导电粘合剂中，并且将电源销保持为形式，直到形式已经足够冷却以形成保持电源销的接合，从而形成电一个或多个引脚和PCB之间的连接。弹簧加载的电源引脚配置为在焊接弱化时自动从PCB的表面离开。

4. 发明申请

US20160221098A1 INTELLIGENT SOLDERING CARTRIDGE FOR AUTOMATIC SOLDERING CONNECTION VALIDATION 有权
标题翻译：智能焊接用于自动焊接连接验证
公开(公告)号：US20160221098A1
公开(公告)日：2016-08-04
申请号：US15096035
申请日：2016-04-11
申请人： OK INTERNATIONAL, INC.
发明人： Kenneth D. Marino , Hoa Nguyen
IPC分类号： B23K3/06 , B23K3/03 , B23K3/02 , B23K1/00
CPC分类号： H05K3/34 , B23K1/0016 , B23K3/02 , B23K3/025 , B23K3/03 , B23K3/033 , B23K3/0353 , B23K3/0471 , B23K3/0478 , B23K3/0615 , B23K3/08 , B23K31/125 , B23K2101/42 , G01B21/08 , H05K1/0268 , H05K1/0269 , H05K3/306 , H05K3/341 , H05K3/3442 , H05K3/3484 , H05K2203/04 , H05K2203/163
摘要： An intelligent soldering cartridge that includes: a housing; a solder tip; a heater for heating the solder tip; a storage device for storing information about characteristics of the cartridge; a processor for retrieving the information about characteristics of the cartridge, monitoring the power level delivered to the solder tip to detect liquidus occurrence at a solder joint, determining a thickness of an intermetallic compound (IMC) of the solder joint using some of the retrieved information, determining whether the thickness of the IMC is within a predetermined range, and generating an indication signal indicating that a reliable solder joint connection is formed when the thickness of the IMC is within the predetermined range; and an interface for transmitting the indication signal.
摘要翻译：一种智能型软管，包括：壳体; 焊头; 用于加热焊料尖端的加热器; 存储装置，用于存储关于盒的特性的信息; 用于检索关于盒的特性的信息的处理器，监测传送到焊料尖端的功率水平以检测焊点处的液相线发生，使用一些检索到的信息确定焊点的金属间化合物（IMC）的厚度确定IMC的厚度是否在预定范围内，并且当IMC的厚度在预定范围内时，产生指示形成可靠的焊点连接的指示信号; 以及用于发送指示信号的接口。

5. 发明授权

US09402321B2 Soldering method using a low-temperature solder paste 有权
标题翻译：焊接方法采用低温焊膏
公开(公告)号：US09402321B2
公开(公告)日：2016-07-26
申请号：US14435333
申请日：2012-10-15
申请人： SENJU METAL INDUSTRY CO, LTD.
发明人： Masato Shimamura , Ken Tachibana , Takayuki Hori
IPC分类号： B23K31/02 , H05K3/34 , B23K35/24 , B23K35/26 , B23K35/40 , B23K35/02 , B23K1/00 , C22C12/00 , C22C13/02
CPC分类号： H05K3/3484 , B23K1/0016 , B23K35/0244 , B23K35/025 , B23K35/24 , B23K35/26 , B23K35/262 , B23K35/264 , B23K35/40 , C22C12/00 , C22C13/02 , H05K3/3463 , H05K2203/04 , H05K2203/12
摘要： Even if the strength of a solder composition close to a SnBi eutectic composition was improved, it was brittle, so when it was used for small electronic devices such as mobile phones or notebook computers, the resistance to drop impacts when the small electronic equipment was dropped was low. Therefore, interface peeling often took place between the soldered surface and a printed circuit board, resulting in the devices being destroyed. As disclosed, when soldering using a solder paste containing a SnBi-based low-temperature solder, at least one type of solder composition selected from a Sn—Ag, a Sn—Cu, and a Sn—Ag—Cu solder composition is diffused into the solder paste by simultaneously supplying at least one type of preform selected from a Sn—Ag, a Sn—Cu, and a Sn—Ag—Cu solder composition, whereby resistance to drop impacts is improved.
摘要翻译：即使接近SnBi共晶组合物的焊料组合物的强度提高，因此易碎，因此当用于诸如手机或笔记本电脑的小型电子设备时，当小型电子设备掉落时，其耐跌落影响是低的因此，通常在焊接表面和印刷电路板之间发生界面剥离，导致器件被破坏。如所公开的，当使用含有SnBi基低温焊料的焊膏进行焊接时，将选自Sn-Ag，Sn-Cu和Sn-Ag-Cu焊料组合物中的至少一种焊料组分扩散到通过同时供给选自Sn-Ag，Sn-Cu和Sn-Ag-Cu焊料组合物中的至少一种类型的预成型体，从而提高了耐跌落冲击的焊膏。

6. 发明申请

US20160113111A1 CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF 审中-公开
标题翻译：电路板及其制造方法
公开(公告)号：US20160113111A1
公开(公告)日：2016-04-21
申请号：US14977658
申请日：2015-12-22
申请人： Wistron Corporation
发明人： Jui-Yun Fan , Hui-Lin Lu , Howard Huang , Zheng-Wei Wu
IPC分类号： H05K1/02 , H05K3/34 , H05K3/46 , H05K1/11 , H05K3/00
CPC分类号： H05K1/0298 , H05K1/115 , H05K3/0073 , H05K3/341 , H05K3/3447 , H05K3/3452 , H05K3/3484 , H05K3/4664 , H05K2201/09909 , H05K2203/04 , H05K2203/0588 , Y10T29/49165
摘要： A circuit board includes a circuit board plate, a conductive ring, a solder mask and at least one insulating pad. The circuit board plate includes a surface and a conductive through hole passing through the surface and the circuit board plate, wherein the conductive through hole have a conductive layer disposed on a wall thereof. The conductive ring on the surface surrounds an opening of the conductive through hole on the surface and electrically connects to the conductive layer. The solder mask is disposed on the surface. The conductive ring is exposed outside of the solder mask. The insulating pad has a thickness. The first surface of the insulating pad is adapted to contact the solder mask or the surface and sited at periphery of the conductive ring. The second surface of the insulating pad is adapted for spacing a distance between a solder coating tool and the solder mask.
摘要翻译：电路板包括电路板板，导电环，焊接掩模和至少一个绝缘垫。电路板板包括表面和穿过表面的导电通孔和电路板板，其中导电通孔具有布置在其壁上的导电层。表面上的导电环围绕表面上的导电通孔的开口并与导电层电连接。焊接掩模设置在表面上。导电环暴露在焊料掩模的外部。绝缘垫具有厚度。绝缘垫的第一表面适于接触焊料掩模或表面并位于导电环的周边。绝缘垫的第二表面适于间隔焊料涂覆工具和焊接掩模之间的距离。

7. 发明授权

US09301403B2 Method of soldering electronic part 有权
标题翻译：电子部件焊接方法
公开(公告)号：US09301403B2
公开(公告)日：2016-03-29
申请号：US14606305
申请日：2015-01-27
申请人： Fuji Electric Co., Ltd. , Nihon Handa Co., Ltd.
发明人： Mitsuo Yamashita , Tomoaki Goto , Takeshi Asagi
IPC分类号： H05K3/34 , B23K1/00 , B23K35/02 , B23K35/26 , C22C1/04 , C22C12/00 , C22C13/00 , C22C28/00
CPC分类号： H05K3/341 , B23K1/0016 , B23K35/0244 , B23K35/025 , B23K35/262 , B23K2101/36 , B23K2101/42 , C22C1/0483 , C22C12/00 , C22C13/00 , C22C28/00 , H01L2924/0132 , H01L2924/0133 , H05K3/3484 , H05K2201/0266 , H05K2201/0272 , H05K2203/04 , H05K2203/12 , H01L2924/01047 , H01L2924/0105 , H01L2924/01029
摘要： A cream solder obtained by kneading an Sn—Ag—Cu alloy together with a flux, wherein the Sn—Ag—Cu alloy includes a mixture of a first powdery alloy and a second powdery alloy, the first powdery alloy is represented by an Sn—Ag phase diagram having a solid-liquid coexistence region and has a given silver amount which is larger than that in the eutectic composition (3.5 wt. % silver), and the second powdery alloy has a silver amount which is that in the eutectic composition (3.5 wt. % silver) or which is close to that in the eutectic composition and is smaller than that in the first powdery alloy. This cream solder has excellent strength and thermal stability, and satisfactory bonding properties. It is based on an inexpensive Sn—Ag—Cu solder alloy. It is suitable for use as a high-temperature-side lead-free solder material conformable to temperature gradation bonding. Also provided is a method of soldering.
摘要翻译：通过将Sn-Ag-Cu合金与助熔剂捏合而获得的膏状焊料，其中，Sn-Ag-Cu合金包括第一粉末合金和第二粉末合金的混合物，第一粉末合金由Sn- Ag相图具有固液共存区域，并且具有大于共晶组合物（3.5重量％银）中的银量的给定银量，第二粉末合金的银量为共晶组合物中的银量 3.5重量％的银），或者接近于共晶组合物中的银，并且小于第一粉末合金中的银。这种膏状焊料具有优异的强度和热稳定性，并且具有令人满意的粘合性能。它基于廉价的Sn-Ag-Cu焊料合金。适用于符合温度梯度键合的高温侧无铅焊料。还提供了一种焊接方法。

8. 发明申请

US20160001388A1 MANUFACTURING METHOD OF POWER-MODULE SUBSTRATE 有权
标题翻译：功率模块基板的制造方法
公开(公告)号：US20160001388A1
公开(公告)日：2016-01-07
申请号：US14768041
申请日：2014-02-28
申请人： MITSUBISHI MATERIALS CORPORATION
发明人： Tomoya Oohiraki , Sotaro Oi , Kimihito Nishikawa , Hiromasa Hayashi
IPC分类号： B23K1/00 , H05K3/20 , H01L21/48 , B23K31/02
CPC分类号： B23K1/0016 , B23K31/02 , C04B35/645 , C04B37/026 , C04B2237/121 , C04B2237/125 , C04B2237/126 , C04B2237/127 , C04B2237/128 , C04B2237/343 , C04B2237/366 , C04B2237/368 , C04B2237/402 , C04B2237/407 , C04B2237/62 , C04B2237/704 , C04B2237/706 , C04B2237/708 , C04B2237/86 , H01L21/4846 , H01L21/4882 , H01L23/3735 , H01L2924/0002 , H05K1/0263 , H05K3/202 , H05K3/207 , H05K2203/04 , H05K2203/06 , H01L2924/00
摘要： A method of manufacturing power-module substrates, after bonding copper-circuit plates 30 at intervals on a ceramic plate 21 having an area in which ceramic substrates can be formed abreast, by dividing the ceramic plate 21 between the copper-circuit plates 30, in which: bonding-material layers 71 of active-metal brazing material having same shapes as outer shapes of the copper-circuit plates 30 are formed on the ceramic plate 21; temporal-stick material 72 including polyethylene glycol as a major ingredient is spread on the copper-circuit plates 30, the bonding-material layers 71 and the copper-circuit plates 30 are temporarily fixed on the ceramic plate 21 in a state of laminating with positioning by the temporal-stick material 72; and a laminated assembly thereof is pressurized in a laminating direction and heated, so that the ceramic plate and the copper-circuit plates are bonded.
摘要翻译：一种制造功率模块基板的方法，在通过将铜电路板30之间的陶瓷板21分隔在铜电路板30之间的陶瓷板21上，间隔地连接在具有可以形成陶瓷基板的区域的陶瓷板21上，在陶瓷板21上形成有与铜电路板30的外形相同形状的活性金属钎焊材料的接合材料层71; 包含聚乙二醇作为主要成分的temporal棒材料72扩散在铜电路板30上，接合材料层71和铜电路板30以层压定位的状态临时固定在陶瓷板21上通过temporal棒材料72; 并且其层压组件在层叠方向上加压并加热，使得陶瓷板和铜电路板接合。

9. 发明申请

US20150382482A1 GAS-BLOWING-HOLE ARRAY STRUCTURE AND SOLDERING APPARATUS 有权
标题翻译：气体喷射阵列结构和焊接设备
公开(公告)号：US20150382482A1
公开(公告)日：2015-12-31
申请号：US14654956
申请日：2013-12-20
申请人： SENJU METAL INDUSTRY CO., LTD.
发明人： Tsutomu HIYAMA
IPC分类号： H05K3/34 , B23K3/04 , B23K3/08 , B23K1/00
CPC分类号： H05K3/3494 , B23K1/0016 , B23K1/008 , B23K1/012 , B23K3/04 , B23K3/082 , B23K2101/42 , H05K2203/04 , H05K2203/081
摘要： In a gas-blowing-hole array structure, which enables gas to be blown to the whole surface of the conveyed member such as a printed circuit board, a semiconductor wafer or the like almost concentrically and allows the whole surface of conveyed member to be very uniformly heated or cooled, a nozzle pattern P2 of blowing nozzles 2 is arranged to be line symmetry with a nozzle pattern P1 of the blowing nozzles 2 in upper and lower divided sections of one side of the nozzle cover 3 relative to a center portion thereof that is orthogonal to a conveying direction, as shown in FIG. 1. In order for the arrangement patterns diagonally arranged in the nozzle cover 3 to become identical, the nozzle pattern P1 is arranged to be line symmetry with the nozzle pattern P2 of the blowing nozzles 2 in upper and lower divided sections of the other side of the nozzle cover 3.
摘要翻译：在气体吹出孔阵列结构中，能够将气体吹送到诸如印刷电路板，半导体晶片等的输送部件的整个表面，几乎同心地被吹送，并且允许被输送部件的整个表面非常均匀地加热或冷却，喷嘴2的喷嘴图案P2被布置成与喷嘴盖3的一侧的上分离部分和下分割部分相对于其中心部分与喷嘴2的喷嘴图案P1线对称，与输送方向正交，如图1所示。为了使喷嘴盖3中对角地配置的排列图形变得相同，喷嘴图案P1配置成与喷嘴2的喷嘴图案P2在另一侧的上下分割部分的线对称喷嘴盖3。

10. 发明申请

US20150342061A1 Vacuum Pallet Reflow 有权
标题翻译：真空托盘回流
公开(公告)号：US20150342061A1
公开(公告)日：2015-11-26
申请号：US14820025
申请日：2015-08-06
申请人： IMI USA, INC.
发明人： Timothy P. Patterson , William Lutap , Roger Nguyen
IPC分类号： H05K3/34 , B23K1/20 , B23K3/08 , B23K1/00
CPC分类号： H05K3/34 , B23K1/0016 , B23K1/008 , B23K1/203 , B23K3/08 , H01L2924/0002 , H05K3/3494 , H05K2203/04 , H05K2203/085 , H01L2924/00
摘要： A soldering device and method of soldering are disclosed. The device may include at least one soldering pallet assembly. The pallet assembly may be subjected to a first atmosphere configured within the soldering pallet assembly and a second atmosphere configured external to the pallet assembly, the second atmosphere is an ambient atmosphere. At least one solder element may be positioned within the first atmosphere, and the solder element may be configured to attach an electrical component to an integrated circuit chip that is positioned within the pallet assembly.
摘要翻译：公开了焊接装置和焊接方法。该装置可以包括至少一个焊接托盘组件。托盘组件可以经受配置在焊接托盘组件内的第一气氛和构造在托盘组件外部的第二气氛，第二大气是环境气氛。至少一个焊料元件可以位于第一大气中，并且焊料元件可以被配置为将电气部件附接到定位在托盘组件内的集成电路芯片。

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