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    • 2. 发明授权
    • Process and apparatus for semiconductor device fabrication
    • 用于半导体器件制造的工艺和装置
    • US5472516A
    • 1995-12-05
    • US228336
    • 1994-04-15
    • Karrie J. HansonGregg S. HigashiJoseph M. Rosamilia
    • Karrie J. HansonGregg S. HigashiJoseph M. Rosamilia
    • B08B3/08H01L21/304H01L21/306B08B7/04
    • H01L21/02052
    • A method and apparatus for cleaning substrates in a process for device fabrication is disclosed. An aqueous solution of hydrogen peroxide and ammonium hydroxide is used to clean the substrates. The concentration of hydrogen peroxide and ammonium hydroxide in the cleaning solution is maintained at a certain level. The life of the cleaning solution is extended by the process. By maintaining the concentrations of the hydrogen peroxide and ammonium hydroxide in the solution within a desired range, the process also provides a cleaning solution that effectively cleans the substates throughout the entire time the solution is used to clean the substrates. The apparatus monitors certain solution parameters such as the pH and the conductivity of the cleaning solution and adds hydrogen peroxide and/or ammonium hydroxide to the cleaning solution to maintain the parameters, and thus the concentration of hydrogen peroxide and ammonium hydroxide, at desired levels.
    • 公开了一种用于在器件制造过程中清洁衬底的方法和设备。 使用过氧化氢和氢氧化铵的水溶液来清洗底物。 清洗液中过氧化氢和氢氧化铵的浓度保持在一定水平。 清洁液的使用寿命延长了。 通过将溶液中的过氧化氢和氢氧化铵的浓度保持在所需范围内,该方法还提供了清洁溶液,其在整个溶液用于清洁基底的整个时间内有效地清洗了子状态。 该装置监测某些溶液参数,例如清洁溶液的pH和电导率,并向清洗溶液中加入过氧化氢和/或氢氧化铵,以保持所需参数,从而将过氧化氢和氢氧化铵的浓度保持在所需的水平。
    • 5. 发明授权
    • Apparatus for continuously controlling the peroxide and ammonia
concentration in a bath
    • 用于连续控制浴中的过氧化物和氨浓度的装置
    • US5578273A
    • 1996-11-26
    • US516712
    • 1995-08-18
    • Karrie J. HansonGregg S. HigashiJoseph M. Rosamilia
    • Karrie J. HansonGregg S. HigashiJoseph M. Rosamilia
    • B08B3/08H01L21/304H01L21/306G05D7/00
    • H01L21/02052
    • A method and apparatus for cleaning substrates in a process for device fabrication is disclosed. An aqueous solution of hydrogen peroxide and ammonium hydroxide is used to clean the substrates. The concentration of hydrogen peroxide and ammonium hydroxide in the cleaning solution is maintained at a certain level. The life of the cleaning solution is extended by the process. By maintaining the concentrations of the hydrogen peroxide and ammonium hydroxide in the solution within a desired range, the process also provides a cleaning solution that effectively cleans the substates throughout the entire time the solution is used to clean the substrates. The apparatus monitors certain solution parameters such as the pH and the conductivity of the cleaning solution and adds hydrogen peroxide and/or ammonium hydroxide to the cleaning solution to maintain the parameters, and thus the concentration of hydrogen peroxide and ammonium hydroxide, at desired levels.
    • 公开了一种用于在器件制造过程中清洁衬底的方法和设备。 使用过氧化氢和氢氧化铵的水溶液来清洗底物。 清洗液中过氧化氢和氢氧化铵的浓度保持在一定水平。 清洁液的使用寿命延长了。 通过将溶液中的过氧化氢和氢氧化铵的浓度保持在所需范围内,该方法还提供了清洁溶液,其在整个溶液用于清洁基底的整个时间内有效地清洗了子状态。 该装置监测某些溶液参数,例如清洁溶液的pH和电导率,并向清洗溶液中加入过氧化氢和/或氢氧化铵,以保持参数,从而将过氧化氢和氢氧化铵的浓度保持在所需的水平。