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    • 3. 发明申请
    • Methods of forming electrically conductive plugs and method of forming resistance variable elements
    • 形成导电插塞的方法和形成电阻可变元件的方法
    • US20070173060A1
    • 2007-07-26
    • US11728492
    • 2007-03-26
    • Zhaoli SunJun LiuDapeng Wang
    • Zhaoli SunJun LiuDapeng Wang
    • H01L21/44
    • H01L21/76849H01L45/085H01L45/1233H01L45/1253H01L45/143H01L45/16
    • A method of forming an electrically conductive plug includes providing an opening within electrically insulative material over a node location on a substrate. An electrically conductive material is formed within the opening and elevationally over the insulative material. Some of the conductive material is removed effective to recess an outermost surface of the conductive material to from about 100 Angstroms to about 200 Angstroms from an outermost surface of the insulative material after said removing of some of the conductive material. After removing some of the conductive material, remaining volume of the opening over the conductive material is overfilled with an electrically conductive metal material different from that of the conductive material. The metal material is polished effective to form an electrically conductive plug within the opening comprising the conductive material and the metal material. Other aspects and implementations are contemplated.
    • 一种形成导电插塞的方法包括在电绝缘材料上提供在衬底上的节点位置上的开口。 导电材料形成在开口内并且在绝缘材料的正上方形成。 在去除一些导电材料之后,一些导电材料被去除有效地将导电材料的最外表面从绝缘材料的最外表面离开约100埃至约200埃。 在去除一些导电材料之后,在导电材料上的开口的剩余容积用不同于导电材料的导电金属材料填满。 金属材料被抛光有效以在包括导电材料和金属材料的开口内形成导电塞。 考虑了其他方面和实现。
    • 4. 发明授权
    • Planarizing pads, planarizing machines and methods for making and using planarizing pads in mechanical and chemical-mechanical planarization of microelectronic device substrate assemblies
    • 用于制造和使用平面化焊盘的平面化焊盘,平面化机器以及在微电子器件衬底组件的机械和化学机械平面化中的方法
    • US06498101B1
    • 2002-12-24
    • US09514578
    • 2000-02-28
    • Dapeng Wang
    • Dapeng Wang
    • H01L2100
    • B24B37/11
    • Planarizing pads and methods for making or using planarizing pads to polish or planarize semiconductor wafers, field emission displays, or other microelectronic substrates and substrate assemblies. In one embodiment, the planarizing pad comprises a compressible body and a plurality of discrete contact elements. The compressible body can comprise a base having a backside facing a support surface of a table and a front side facing away from the support surface. The contact elements can comprise raised sections of a single layer or separate plates. The contact elements have a bottom surface attached to the front side of the base and a top surface configured to contact a microelectronic substrate facing away from the base. The compressible body has a first hardness and the contact elements have a second hardness greater than the first hardness, and/or the body has a first compressibility and the contact elements have a second compressibility less than the first compressibility. The compressible body can be a compressible foam (e.g., foamed polyurethane), and the contact elements can be a hard, rigid material (e.g., polycarbonate, resin, polyester or high density polyurethane). In operation, the contact elements can move independently from one another in a direction transverse to the substrate.
    • 平面化焊盘和制造或使用平坦化焊盘来抛光或平面化半导体晶片,场发射显示器或其它微电子基板和基板组件的平板化焊盘和方法。 在一个实施例中,平坦化焊盘包括可压缩主体和多个离散接触元件。 可压缩体可以包括具有面向桌子的支撑表面的背面和背离支撑表面的前侧的底座。 接触元件可以包括单层的凸起部分或单独的板。 接触元件具有附接到基座的前侧的底表面和被配置为接触面向远离基座的微电子基板的顶表面。 可压缩体具有第一硬度,并且接触元件具有大于第一硬度的第二硬度,和/或主体具有第一可压缩性,并且接触元件具有小于第一可压缩性的第二压缩率。 可压缩体可以是可压缩泡沫(例如发泡聚氨酯),并且接触元件可以是硬质刚性材料(例如聚碳酸酯,树脂,聚酯或高密度聚氨酯)。 在操作中,接触元件可以在横向于衬底的方向上彼此独立地移动。
    • 5. 发明申请
    • METHODS FOR FORMING A DOPED AMORPHOUS SILICON OXIDE LAYER FOR SOLAR CELL DEVICES
    • 用于形成用于太阳能电池装置的掺杂的非晶硅氧化物层的方法
    • US20130112264A1
    • 2013-05-09
    • US13291288
    • 2011-11-08
    • Dapeng WangYong Kee Chae
    • Dapeng WangYong Kee Chae
    • H01L31/0376H01L21/20
    • H01L21/02532H01L21/02579H01L21/0262H01L31/03762H01L31/076H01L31/202Y02E10/548Y02P70/521
    • Embodiments of the present invention relate to methods for forming a doped amorphous silicon oxide layer utilized in thin film solar cells. In one embodiment, a method for forming a doped p-type amorphous silicon containing layer on a substrate includes providing a substrate in a processing chamber, supplying a gas mixture having a hydrogen-based gas, a silicon-based gas and a carbon and oxygen containing gas into the processing chamber, the gas mixture having a volumetric flow ratio of the hydrogen-based gas to the silicon-based gas between about 5 and about 15, wherein a volumetric flow ratio of the carbon and oxygen containing gas to the total combined flow of hydrogen-based gas and the silicon-based gas is between about 10 percent and about 50 percent; and maintaining a process pressure of the gas mixture within the processing chamber at between about 1 Torr and about 10 Torr while forming a doped p-type amorphous silicon containing layer.
    • 本发明的实施例涉及用于形成薄膜太阳能电池中使用的掺杂的非晶氧化硅层的方法。 在一个实施例中,在衬底上形成掺杂的p型非晶硅层的方法包括在处理室中提供衬底,提供具有氢基气体,硅基气体和碳和氧的气体混合物 所述气体混合物具有约5至约15的所述氢基气体与所述硅基气体的体积流量比,其中所述含碳和含氧气体的体积流量比与所述总体组合 氢基气体和硅基气体的流动在约10%至约50%之间; 以及在处理室内的气体混合物的处理压力保持在约1托和约10托之间,同时形成掺杂的p型非晶硅含硅层。
    • 10. 发明授权
    • Chemical mechanical polishing pads
    • 化学机械抛光垫
    • US07568970B2
    • 2009-08-04
    • US11447741
    • 2006-06-05
    • Dapeng Wang
    • Dapeng Wang
    • B24B7/22
    • B24B37/22B24B37/24B24B37/26H01L21/30625
    • The present invention provides a deformable pad useful for chemical mechanical polishing (“CMP”), a CMP apparatus incorporating the deformable pad of the present invention, and methods for using the deformable pad and CMP apparatus of the present invention. The deformable pad of the present invention includes a plurality of solid supports which substantially eliminate the nonuniform polishing rates in known CMP processes and may be tailored to optimize a wide array of CMP processes. The CMP apparatus of the present invention incorporates a deformable pad of the present invention and may include several other known features, such as a polishing pad, a substrate carrier, mechanical assemblies for agitating the polishing pad or substrate carrier, etc. The methods falling within the scope of the present invention include providing a CMP polishing apparatus, providing a deformable pad of the present invention, providing a polishing pad attached to the deformable pad of the present invention, and bringing a substrate having a material layer to be polished in contact with the polishing pad. As will be appreciated by one of skill in the art, the CMP apparatus and the methods of the present invention may be easily adapted for use in virtually all CMP processes.
    • 本发明提供了一种可用于化学机械抛光(“CMP”)的可变形焊盘,包括本发明的可变形焊盘的CMP装置,以及使用本发明的可变形焊盘和CMP装置的方法。 本发明的可变形焊盘包括多个固体支撑件,其基本上消除了已知CMP工艺中的不均匀抛光速率,并且可以被调整以优化广泛的CMP工艺阵列。 本发明的CMP装置包括本发明的可变形焊盘,并且可以包括几个其他已知的特征,例如抛光垫,衬底载体,用于搅动抛光垫或衬底载体的机械组件等。 本发明的范围包括提供CMP抛光装置,提供本发明的可变形焊盘,提供附接到本发明的可变形焊盘的抛光垫,以及将具有待抛光材料层的基板与 抛光垫。 如本领域技术人员将理解的,CMP装置和本发明的方法可以容易地适用于几乎所有CMP工艺中。