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    • 3. 发明申请
    • Low-noise semiconductor photodetectors
    • 低噪声半导体光电探测器
    • US20080128849A1
    • 2008-06-05
    • US11978276
    • 2007-10-29
    • Conor S. RaffertyClifford A. King
    • Conor S. RaffertyClifford A. King
    • H01L31/0352H01L21/331
    • H01L31/0352H01L27/14649H01L31/03529H01L31/101H01L2924/0002Y02E10/50H01L2924/00
    • A photodetector is formed from a body of semiconductor material substantially surrounded by dielectric surfaces. A passivation process is applied to at least one surface to reduce the rate of carrier generation and recombination on that surface. Photocurrent is read out from at least one electrical contact, which is formed on a doped region whose surface lies entirely on a passivated surface. Unwanted leakage current from un-passivated surfaces is reduced through one of the following methods. (a) The un-passivated surface is separated from the photo-collecting contact by at least two junctions (b) The un-passivated surface is doped to a very high level, at least equal to the conduction band or valence band density of states of the semiconductor (c) An accumulation or inversion layer is formed on the un-passivated surface by the application of an electric field. Electrical contacts are made to all doped regions, and bias is applied so that a reverse bias is maintained across all junctions.
    • 光电检测器由基本上被电介质表面包围的半导体材料体形成。 钝化过程被应用于至少一个表面以降低载体在该表面上的产生和重组的速率。 从至少一个电触点读出光电流,该电触点形成在其表面完全位于钝化表面上的掺杂区域上。 通过以下方法之一减少未钝化表面的不需要的泄漏电流。 (a)未钝化的表面通过至少两个结与光电收集接触分离(b)未钝化的表面被掺杂到非常高的水平,至少等于状态的导带或价带密度 的半导体(c)通过施加电场在未钝化的表面上形成堆积或反转层。 对所有掺杂区域进行电触点,并且施加偏压,使得跨所有接合部保持反向偏压。
    • 4. 发明授权
    • Silicon germanium heterostructure bipolar transistor with indium doped
base
    • 硅锗异质结双极晶体管掺杂铟基
    • US6087683A
    • 2000-07-11
    • US127373
    • 1998-07-31
    • Clifford A. KingIsik C. Kizilyalli
    • Clifford A. KingIsik C. Kizilyalli
    • H01L29/73H01L21/331H01L29/165H01L29/167H01L29/737H05B35/00
    • H01L29/167H01L29/7378
    • The present invention provides, in one embodiment, a method of fabricating a heterostructure bipolar transistor. This particular embodiment comprises forming a n-type doped region in a semiconductor substrate to form a collector, epitaxially forming a base on the collector, epitaxially doping the base with indium while forming the base, and forming an emitter on the base. The base is epitaxially formed, and at the same time the base is doped with indium. In other words, the indium is epitaxially incorporated within the base as the base is being formed. In addition to the indium, the base may also be epitaxially doped with boron. Since, indium is incorporated into the base with the same epitaxial process used to form the base, the damage typically associated with conventional implantation processes are not present, and thus, the high annealing temperatures to repair the damage are not required. The base can be doped and formed at the same time; thereby, saving processing time.
    • 本发明在一个实施例中提供了制造异质结双极晶体管的方法。 该特定实施例包括在半导体衬底中形成n型掺杂区以形成集电极,在集电极上外延形成基极,在形成基底的同时,用铟外延掺杂铟,并在基底上形成发射极。 基底是外延形成的,同时基底上掺杂有铟。 换句话说,当正在形成基底时,铟外延结合在基底内。 除了铟之外,碱也可以外延掺杂硼。 由于铟以与形成基底相同的外延工艺结合到基底中,所以不存在通常与常规注入工艺相关的损伤,因此不需要用于修复损伤的高退火温度。 碱可以同时掺杂并形成; 从而节省处理时间。