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1. 发明授权

US06790129B2 Method for polishing angular substrates 有权
标题翻译：抛光角基底的方法
公开(公告)号：US06790129B2
公开(公告)日：2004-09-14
申请号：US10214114
申请日：2002-08-08
申请人： Jiro Moriya , Masataka Watanabe , Satoshi Okazaki , Hidekazu Ozawa , You Ishii , Shunichiro Kojima
发明人： Jiro Moriya , Masataka Watanabe , Satoshi Okazaki , Hidekazu Ozawa , You Ishii , Shunichiro Kojima
IPC分类号： B24B700
CPC分类号： B24B37/042
摘要： An angular substrate polishing method includes the steps of holding an angular substrate having a surface to be polished within a guide ring of a substrate holding head; pressing the substrate surface to be polished, and also one surface of the guide ring, against a polishing pad; and independently rotating the polishing pad and the substrate-holding head together with the substrate it holds while pressing the polishing pad-contacting surface of the guide ring against the polishing pad, to thereby polish the substrate surface. During the polishing step, a pressing force is applied to the guide ring which is separate from the pressing force applied to the substrate, enhancing the flatness of the polished substrate.
摘要翻译：角度衬底抛光方法包括以下步骤：将具有待抛光表面的角度衬底保持在衬底保持头的引导环内; 将抛光的基板表面以及引导环的一个表面压在抛光垫上; 并且在将导向环的抛光垫接触表面压靠在抛光垫上的同时，将抛光垫和基板保持头一起与其保持的基板一起旋转，从而抛光基板表面。在抛光步骤期间，对导向环施加压力，该导向环与施加到基板上的按压力分开，提高抛光基板的平整度。

2. 再颁专利

USRE38878E1 Polishing apparatus 失效
标题翻译：抛光设备
公开(公告)号：USRE38878E1
公开(公告)日：2005-11-15
申请号：US08993893
申请日：1997-12-18
申请人： Masayoshi Hirose , Manabu Tsujimura , Seiji Ishikawa , Norio Kimura , You Ishii
发明人： Masayoshi Hirose , Manabu Tsujimura , Seiji Ishikawa , Norio Kimura , You Ishii
IPC分类号： B24B7/22 , B24B37/04
CPC分类号： B24B37/107 , B24B37/30
摘要： A workpiece such as a semiconductor wafer is supported on a top ring and polished by an abrasive cloth on a turntable while the top ring is being pressed against the turntable and the turntable and the top ring are being rotated. The top ring is coupled to a top ring drive shaft, coupled to a pressure cylinder for pressing the top ring, and to a motor for rotating the top ring. A spherical bearing is interposed between the top ring and the top ring drive shaft for allowing the top ring to align with the upper surface of the moving turntable. A torque transmitting mechanism is operatively coupled between the top ring and the top ring drive shaft for rotating the top ring in synchronization with the top ring drive shaft.
摘要翻译：诸如半导体晶片的工件被支撑在顶环上并且通过研磨布在转盘上抛光，同时顶环被压靠在转台上，并且转台和顶环正在旋转。顶环联接到顶环驱动轴，联接到用于按压顶环的压力缸，以及用于旋转顶环的电动机。在顶环和顶环驱动轴之间插入有球面轴承，用于允许顶环与活动转台的上表面对准。扭矩传递机构可操作地联接在顶环和顶环驱动轴之间，用于与顶环驱动轴同步地旋转顶环。

3. 发明授权

US5398459A Method and apparatus for polishing a workpiece 失效
标题翻译：抛光工件的方法和设备
公开(公告)号：US5398459A
公开(公告)日：1995-03-21
申请号：US156641
申请日：1993-11-24
申请人： Katsuya Okumura , Tohru Watanabe , Riichirou Aoki , Hiroyuki Yano , Masako Kodera , Atsushi Shigeta , You Ishii , Norio Kimura , Masayoshi Hirose , Yukio Ikeda
发明人： Katsuya Okumura , Tohru Watanabe , Riichirou Aoki , Hiroyuki Yano , Masako Kodera , Atsushi Shigeta , You Ishii , Norio Kimura , Masayoshi Hirose , Yukio Ikeda
IPC分类号： B24B37/10 , B24B37/30 , B24B1/00
CPC分类号： B24B37/102 , B24B37/30
摘要： A workpiece such as a semiconductor wafer is positioned between a turntable and a top ring and polished by an abrasive cloth on the turntable while the top ring is being pressed against the turntable. The top ring has a retaining ring for preventing the workpiece from deviating from the lower surface of the top ring, and the retaining ring has an inside diameter larger than an outside diameter of the workpiece. The rotation of the turntable imparts a pressing force in a direction parallel to the upper surface of the turntable to the workpiece so that an outer periphery of the workpiece contacts an inner periphery of the retaining ring, and the rotation of the retaining ring imparts a rotational force to the workpiece so that the workpiece performs a planetary motion relative to the top ring in the retaining ring.
摘要翻译：诸如半导体晶片的工件位于转盘和顶环之间，并且当顶环被压靠在转盘上时，其通过研磨布在转盘上抛光。顶环具有用于防止工件偏离顶环的下表面的保持环，并且保持环的内径大于工件的外径。转台的转动使平台于转台上表面的方向向工件施加压力，使得工件的外周与保持环的内周接触，并且保持环的旋转赋予转动使工件相对于保持环中的顶环执行行星运动。

4. 发明授权

US5384986A Polishing apparatus 失效
标题翻译：抛光设备
公开(公告)号：US5384986A
公开(公告)日：1995-01-31
申请号：US124648
申请日：1993-09-22
申请人： Masayoshi Hirose , Seiji Ishikawa , Norio Kimura , Kiyotaka Kawashima , You Ishii
发明人： Masayoshi Hirose , Seiji Ishikawa , Norio Kimura , Kiyotaka Kawashima , You Ishii
IPC分类号： B24B37/26 , B24B53/007 , B24B53/017 , B41J11/62
CPC分类号： B24B53/017 , B24B37/26
摘要： A turntable with an abrasive cloth mounted thereon and a top ring positioned above the turntable are independently rotatably provided. The top ring holds a workpiece to be polished and presses the workpiece against the abrasive cloth. The turntable and the top ring are rotated to polish the surface of the workpiece to a flat mirror finish on the abrasive cloth. A rotatable brush pressed against the abrasive cloth is rotated about an axis substantially perpendicularly to the plane of the abrasive cloth, and oscillated substantially radially between radially inner and outer positions over the abrasive cloth. A cleaning solution is sprayed from a nozzle onto the abrasive cloth. The turntable has a bank along an outer circumferential edge thereof for preventing a protective solution, which is supplied to the abrasive cloth to keep the abrasive cloth wet and prevent it, from flowing off the turntable when the turntable is stationary.
摘要翻译：安装有研磨布的转盘和位于转盘上方的顶环可独立地可旋转地设置。顶环保持要抛光的工件，并将工件压在研磨布上。转盘和顶环旋转以将工件的表面抛光到研磨布上的平整镜面上。压在研磨布上的可旋转刷子围绕基本上垂直于研磨布平面的轴线旋转，并且在磨料布的径向内部和外部位置之间基本径向摆动。将清洁溶液从喷嘴喷射到研磨布上。转台沿其外圆周边缘具有一个堤，用于防止当转台静止时供给磨料以保持磨料湿润并防止磨损的保护溶液流出转台。

5. 发明授权

US06935932B2 Polishing apparatus and method 失效
公开(公告)号：US06935932B2
公开(公告)日：2005-08-30
申请号：US10784945
申请日：2004-02-25
申请人： Norio Kimura , Mitsuhiko Shirakashi , Katsuya Okumura , You Ishii , Junji Kunisawa , Hiroyuki Yano
发明人： Norio Kimura , Mitsuhiko Shirakashi , Katsuya Okumura , You Ishii , Junji Kunisawa , Hiroyuki Yano
IPC分类号： B24B9/06 , B24B37/12 , B24B37/34 , H01L21/00 , B24B1/00
CPC分类号： B24B37/345 , B24B9/065 , B24B37/12 , H01L21/67046
摘要： A polishing apparatus and method has a function of polishing a surface of a film formed on a substrate to a flat mirror finish and a function of polishing unnecessary metal film such as copper film deposited on an outer peripheral portion of the substrate to remove such unnecessary metal film. The polishing apparatus comprises a surface polishing mechanism comprising a polishing table having a polishing surface and a top ring for holding the substrate and pressing the substrate against the polishing surface of the polishing table to thereby polish a surface of the substrate, and an outer periphery polishing mechanism for polishing an outer peripheral portion of the substrate.

6. 发明授权

US06905400B2 Method and apparatus for dressing polishing cloth 有权
标题翻译：抛光布修整方法和装置
公开(公告)号：US06905400B2
公开(公告)日：2005-06-14
申请号：US10060366
申请日：2002-02-01
申请人： Norio Kimura , You Ishii , Toyomi Nishi , Takayoshi Kawamoto , Takeshi Sakurai
发明人： Norio Kimura , You Ishii , Toyomi Nishi , Takayoshi Kawamoto , Takeshi Sakurai
IPC分类号： B24B49/00 , B24B53/00 , B24B1/00
CPC分类号： B24B53/017 , B24B37/005 , B24B49/00
摘要： A polishing cloth mounted on a turntable is dressed by bringing a dresser in contact with the polishing cloth for restoring the polishing capability of the polishing cloth. The dressing is performed by measuring heights of a surface of the polishing cloth at radial positions of the polishing cloth in a radial direction thereof determining a rotational speed of the dresser with respect to a rotational speed of the turntable on the basis of the measured heights, and dressing the polishing cloth by pressing the dresser are rotating. The dresser has an annular diamond grain layer or an annular SiC layer.
摘要翻译：通过使修整器与抛光布接触来修整安装在转台上的抛光布，以恢复抛光布的抛光能力。通过在抛光布的径向位置处测量抛光布的表面的高度来确定修整器相对于转盘的转速基于测量的高度的转速来进行修整，并且通过按下梳妆台来修整抛光布正在旋转。修整器具有环形金刚石颗粒层或环形SiC层。

7. 发明授权

US5651725A Apparatus and method for polishing workpiece 失效
标题翻译：抛光工件的设备和方法
公开(公告)号：US5651725A
公开(公告)日：1997-07-29
申请号：US628990
申请日：1996-04-10
申请人： Ritsuo Kikuta , You Ishii , Tamami Takahashi
发明人： Ritsuo Kikuta , You Ishii , Tamami Takahashi
IPC分类号： B24B37/20 , B24B37/24 , B24B53/00 , B24B53/007 , B24B53/017 , H01L21/304 , B24B1/00 , B24B7/19 , B24B7/30
CPC分类号： B24B53/017 , B24B53/00
摘要： An apparatus and method for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The workpiece is held by a top ring, and a surface of the workpiece is polished by pressing the workpiece against an abrasive cloth mounted on a turntable while applying an abrasive solution onto the abrasive cloth. While the workpiece is being polished, a surface of the abrasive cloth is dressed while applying a dressing liquid onto the abrasive cloth. A polishing operation and a dressing operation are performed in such a state that the abrasive solution and the dressing liquid do not interfere with each other.
摘要翻译：用于将诸如半导体晶片的工件抛光到平面镜面的装置和方法。工件由顶环保持，并且通过将安装在转盘上的研磨布压在研磨布上而将工件压在研磨布上的同时将工件的表面抛光。在抛光工件的同时，将研磨布的表面修整，同时将修整液施加到研磨布上。在研磨液和敷料液不会相互干扰的状态下进行研磨操作和修整操作。

8. 发明申请

US20080188167A1 Substrate processing apparatus 审中-公开
公开(公告)号：US20080188167A1
公开(公告)日：2008-08-07
申请号：US12078560
申请日：2008-04-01
申请人： You Ishii , Masayuki Nakanishi , Kenro Nakamura
发明人： You Ishii , Masayuki Nakanishi , Kenro Nakamura
IPC分类号： B24B5/00
CPC分类号： B24B9/065 , B24B21/002
摘要： A substrate processing apparatus has a polishing tape and a polishing head for pressing the polishing tape against a peripheral portion of a semiconductor wafer. The substrate processing apparatus polishes the wafer due to sliding contact of the polishing tape and the wafer. The polishing head has an elastic body for supporting the polishing tape. The substrate processing apparatus has an air cylinder for pressing the polishing head so that the elastic body of the polishing head presses the polishing tape against the predetermined portion of the wafer under a constant force.

9. 发明授权

US06722964B2 Polishing apparatus and method 有权
标题翻译：抛光设备和方法
公开(公告)号：US06722964B2
公开(公告)日：2004-04-20
申请号：US09824644
申请日：2001-04-04
申请人： Norio Kimura , Mitsuhiko Shirakashi , Katsuya Okumura , You Ishii , Junji Kunisawa , Hiroyuki Yano
发明人： Norio Kimura , Mitsuhiko Shirakashi , Katsuya Okumura , You Ishii , Junji Kunisawa , Hiroyuki Yano
IPC分类号： B24B100
CPC分类号： B24B37/345 , B24B9/065 , B24B37/12 , H01L21/67046
摘要： A polishing apparatus and method has a function of polishing a surface of a film formed on a substrate to a flat mirror finish and a function of polishing unnecessary metal film such as copper film deposited on an outer peripheral portion of the substrate to remove such unnecessary metal film. The polishing apparatus comprises a surface polishing mechanism comprising a polishing table having a polishing surface and a top ring for holding the substrate and pressing the substrate against the polishing surface of the polishing table to thereby polish a surface of the substrate, and an outer periphery polishing mechanism for polishing an outer peripheral portion of the substrate.
摘要翻译：抛光装置和方法具有将形成在基板上的膜的表面抛光至平面镜面的功能，以及抛光沉积在基板的外周部分上的不需要的金属膜如铜膜的功能，以去除这种不必要的金属电影。抛光装置包括表面抛光机构，其包括具有抛光表面的抛光台和用于保持基板的顶环，并将基板压靠在抛光台的抛光表面上，从而抛光基板的表面，以及外周抛光用于抛光衬底的外周部分的机构。

10. 发明授权

US06645053B1 Polishing apparatus 有权
标题翻译：抛光设备
公开(公告)号：US06645053B1
公开(公告)日：2003-11-11
申请号：US09622638
申请日：2000-11-08
申请人： Norio Kimura , You Ishii , Yoshikuni Tateyama
发明人： Norio Kimura , You Ishii , Yoshikuni Tateyama
IPC分类号： B24B100
CPC分类号： B24B53/017 , B24B53/02
摘要： A polishing apparatus has a turntable with a polishing cloth attached thereto and a top ring for holding and pressing a workpiece to be polished against the polishing cloth under a certain pressure. The polishing apparatus also has a first dressing unit having a contact-type dresser for dressing the polishing cloth by bringing the contact-type dresser in contact with the polishing cloth, and a second dressing unit having a noncontact-type dresser for dressing the polishing cloth with a fluid jet applied therefrom to the polishing cloth. The contact-type dresser comprises a diamond dresser or an SiC dresser.
摘要翻译：抛光装置具有安装有抛光布的转台和用于在一定压力下将待抛光的工件保持并压在抛光布上的顶环。抛光装置还具有第一修整单元，其具有接触型修整器，用于通过使接触型修整器与抛光布接触来修整抛光布;以及第二修整单元，具有用于修整抛光布的非接触式修整器其中流体喷射从其施加到抛光布上。接触式修整器包括钻石修整器或SiC修整器。

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