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1. 发明授权

US09604340B2 Carrier head having abrasive structure on retainer ring 有权
公开(公告)号：US09604340B2
公开(公告)日：2017-03-28
申请号：US14105232
申请日：2013-12-13
申请人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
发明人： Chang-Sheng Lin
IPC分类号： B24B37/32 , B24B53/017 , B24B53/02
CPC分类号： B24B53/017 , B24B37/10 , B24B37/32 , B24B53/02 , H01L21/30625 , H01L21/67253
摘要： A carrier head includes a housing configured to enclose a wafer and a retainer ring attached to the housing. The retainer ring includes a body and an abrasive structure. The body includes an inner periphery configured to surround the wafer, an outer periphery, and a surface connecting the inner periphery and the outer periphery. The abrasive structure is attached to the surface of the body.

2. 发明申请

US20140256236A1 PAD CONDITIONING TOOL AND METHOD OF MANUFACTURING THE SAME 有权
标题翻译： PAD调节工具及其制造方法
公开(公告)号：US20140256236A1
公开(公告)日：2014-09-11
申请号：US14187048
申请日：2014-02-21
申请人： TERA XTAL TECHNOLOGY CORPORATION
发明人： Jun-Wen Chung , TZU-HSUAN DAI , Wen-Yen Shen , Kuang-Ling Wei , Chuan-Lang Lu
IPC分类号： B24B53/017 , B24D18/00
CPC分类号： B24B53/017 , B24B53/02 , B24B53/053 , B24D18/00
摘要： A pad conditioning tool includes a sapphire chip having a side surface defining a polishing surface and a plurality of sapphire grains formed on the polishing surface in an integral manner. Each of the sapphire grains had a three-dimensional geometric structure. The sapphire grains are arranged on the polishing surface in a specific form so as to possess a specific pattern.
摘要翻译：垫调节工具包括具有限定抛光表面的侧表面的蓝宝石芯片和以整体方式形成在抛光表面上的多个蓝宝石晶粒。每个蓝宝石颗粒都具有三维几何结构。蓝宝石晶粒以特定形式布置在抛光表面上，以具有特定的图案。

3. 发明授权

US08657650B2 Grinding wheel dressing system 有权
标题翻译：砂轮修整系统
公开(公告)号：US08657650B2
公开(公告)日：2014-02-25
申请号：US13909191
申请日：2013-06-04
申请人： White Drive Products, Inc.
发明人： Hollis N. White, Jr.
IPC分类号： B24B1/00
CPC分类号： B24B53/02 , B24B7/17
摘要： A grinding wheel dressing assembly includes a driving gear rotatable about a central axis and a dressing ring engaged with the driving gear. Rotation of the driving gear about the central axis results in rotation of the dressing ring about an offset axis, which is offset from the central axis. The dressing ring includes a contact surface generally normal to the offset axis and adapted to remove dull CBN particles from a substantially planar grinding surface of a grinding wheel that comes into contact with the contact surface.
摘要翻译：砂轮修整组件包括可围绕中心轴线旋转的驱动齿轮和与驱动齿轮啮合的修整环。驱动齿轮围绕中心轴的旋转导致修整环围绕偏离中心轴偏移的偏移轴线旋转。修整环包括大致垂直于偏移轴线的接触表面，并且适于从与接触表面接触的砂轮的基本平坦的研磨表面上去除钝的CBN颗粒。

4. 发明授权

US07544113B1 Apparatus for controlling the forces applied to a vacuum-assisted pad conditioning system 有权
标题翻译：用于控制施加到真空辅助垫调节系统的力的装置
公开(公告)号：US07544113B1
公开(公告)日：2009-06-09
申请号：US11283595
申请日：2005-11-18
申请人： Stephen J. Benner
发明人： Stephen J. Benner
IPC分类号： B24B49/00 , B24B51/00
CPC分类号： B24B53/017 , B24B53/00 , B24B53/013 , B24B53/02 , B24B57/00 , H01L21/30625
摘要： An apparatus for conditioning polishing pads that utilizes an apertured conditioning disk for introducing operation-specific slurries, without the need for additional tooling, platens, and materials handling. The apparatus utilizes a vacuum capability to pull waste material out of the polishing pad and through the apertured conditioning disk to evacuate the apparatus through an outlet port. The apparatus also includes a force adjustment system for providing measurement and control of the force applied by the conditioning disk to the polishing pad.
摘要翻译：一种用于调节抛光垫的装置，其利用有孔调节盘来引入特定操作的浆料，而不需要额外的模具，压板和材料处理。该设备利用真空能力将废料从抛光垫中拉出并通过孔径调节盘，以通过出口排出装置。该设备还包括力调节系统，用于提供由调理盘施加到抛光垫的力的测量和控制。

5. 发明授权

US07507143B2 Truing method for grinding wheel 有权
标题翻译：砂轮修整方法
公开(公告)号：US07507143B2
公开(公告)日：2009-03-24
申请号：US11474390
申请日：2006-06-26
申请人： Hirohisa Yamada
发明人： Hirohisa Yamada
IPC分类号： B24B49/00 , B24B51/00
CPC分类号： B24B53/001 , B24B7/17 , B24B7/228 , B24B37/08 , B24B53/017 , B24B53/02
摘要： In a grinding machine comprising conductive grinding wheels, the invention presents a truing technique capable of truing grindstone surfaces of grinding wheels at high precision in a short time.For example, in the case of truing flat annular grindstone surfaces (10a, 10a) of a pair of mutually opposite grinding wheels (1, 2) simultaneously, an electro-discharge truing electrode (20) is disposed oppositely between the grindstone surfaces (10a, 10a) of the two grinding wheels (1, 2), and while traversing relatively parallel along the both grindstone surfaces (10a, 10a), the grindstone surfaces (10a, 10a) are trued without making contact by the electro-discharge action between the electro-discharge truing electrode (20) and both grindstone surfaces (10a, 10a).
摘要翻译：在包括导电磨轮的研磨机中，本发明提供了一种能够在短时间内以高精度修整砂轮的磨石表面的修整技术。例如，在同时研磨一对相对的砂轮（1,2）的平面环形砂轮表面（10a，10a）的情况下，将电抛光电极（20）相对设置在磨石表面（10a），10a），并且沿着两个砂轮表面（10a，10a）相对平行地移动，并且通过两个砂轮表面（10a，10a）之间的电放电动作电镀研磨电极（20）和磨石表面（10a，10a）。

6. 发明授权

US07108579B2 Method and device for polishing 失效
标题翻译：抛光方法和装置
公开(公告)号：US07108579B2
公开(公告)日：2006-09-19
申请号：US10485273
申请日：2003-02-20
申请人： Yutaka Wada , Tomohiko Akatsuka , Tatsuya Sasaki
发明人： Yutaka Wada , Tomohiko Akatsuka , Tatsuya Sasaki
IPC分类号： B24B49/00 , B24B1/00
CPC分类号： B24B53/017 , B24B7/228 , B24B37/04 , B24B37/044 , B24B49/12 , B24B53/02 , C09G1/00 , H01L21/31053
摘要： The present invention relates to a polishing method for polishing a workpiece by pressing the workpiece, to be polished, against a fixed abrasive and bringing the workpiece into sliding contact with the fixed abrasive. The polishing method includes a first step of polishing the workpiece while supplying a polishing liquid which contains an anionic surface-active agent and does not contain abrasive particles, and a second step of polishing the workpiece while supplying a polishing liquid which contains a cationic surface-active agent and does not contain abrasive particles.
摘要翻译：抛光方法技术领域本发明涉及一种用于通过将待磨削的工件压在固定磨料上并使工件与固定磨料滑动接触来抛光工件的抛光方法。抛光方法包括：在提供含有阴离子表面活性剂并且不含磨料颗粒的抛光液的同时抛光工件的第一步骤;以及第二步骤，在提供包含阳离子表面活性剂的抛光液的同时抛光工件，活性剂，不含磨料颗粒。

7. 发明申请

US20040248415A1 Polishing method and polishing liquid 审中-公开
标题翻译：抛光方法和抛光液
公开(公告)号：US20040248415A1
公开(公告)日：2004-12-09
申请号：US10485349
申请日：2004-07-08
发明人： Yutaka Wada , Tomohiko Akatsuka , Tatsuya Sasaki , Toshiya Hagihara
IPC分类号： H01L021/302 , H01L021/461
CPC分类号： B24B53/017 , B24B7/228 , B24B37/04 , B24B37/044 , B24B49/12 , B24B53/02 , C09G1/00 , H01L21/31053
摘要： The present invention relates to a polishing method and a polishing liquid for polishing a workpiece such as a semiconductor wafer with a fixed abrasive. In the polishing method for polishing a workpiece by pressing the workpiece to be polished against a fixed abrasive and bringing the workpiece in sliding contact with the fixed abrasive, the workpiece is polished while supplying a polishing liquid which contains an anionic surface-active agent and does not contain abrasive particles.
摘要翻译：本发明涉及一种用固定磨料抛光诸如半导体晶片的工件的抛光方法和抛光液。在通过将待研磨的工件压靠固定的研磨剂并使工件与固定的研磨剂滑动接触来研磨工件的抛光方法中，在供给包含阴离子表面活性剂的抛光液的同时对工件进行抛光不含磨粒。

8. 发明申请

US20040235301A1 Method and device for polishing 失效
标题翻译：抛光方法和装置
公开(公告)号：US20040235301A1
公开(公告)日：2004-11-25
申请号：US10485273
申请日：2004-01-30
发明人： Yutaka Wada , Tomohiko Akatsuka , Tatsuya Sasaki
IPC分类号： H01L021/302 , H01L021/461
CPC分类号： B24B53/017 , B24B7/228 , B24B37/04 , B24B37/044 , B24B49/12 , B24B53/02 , C09G1/00 , H01L21/31053
摘要： The present invention relates to a polishing method for polishing a workpiece by pressing the workpiece to be polished against a fixed abrasive and bringing the workpiece in sliding contact with the fixed abrasive. The polishing method includes a first step of polishing the workpiece while supplying a polishing liquid which contains an anionic surface-active agent and does not contain abrasive particles, and a second step of polishing the workpiece while supplying a polishing liquid which contains a cationic surface-active agent and does not contain abrasive particles.
摘要翻译：本发明涉及一种用于通过将待研磨的工件压靠固定的磨料并使工件与固定的磨料滑动接触来抛光工件的抛光方法。抛光方法包括：在提供含有阴离子表面活性剂并且不含磨料颗粒的抛光液的同时抛光工件的第一步骤;以及第二步骤，在提供包含阳离子表面活性剂的抛光液的同时抛光工件，活性剂，不含磨料颗粒。

9. 发明申请

US20030190873A1 Chemical-mechanical polishing platform 审中-公开
标题翻译：化学机械抛光平台
公开(公告)号：US20030190873A1
公开(公告)日：2003-10-09
申请号：US09829221
申请日：2001-04-09
发明人： Jiun-Fang Wang , Ming-Cheng Yang , Hao-Ming Lien , Sam Chou
IPC分类号： B24B053/00
CPC分类号： H01L21/6835 , B24B53/017 , B24B53/02
摘要： A chemical-mechanical polishing platform that comprises a polishing table, a wafer carrier, a polishing pad, a slurry supplier, a conditioner, and a means for cleaning the polishing pad. With respect to in-situ or ex-situ chemical-mechanical polishing, the wafer carrier, conditioner, and means for cleaning the polishing pad are adequately disposed above the polishing pad. The chemical-mechanical polishing is performed by rotation of the polishing pad; the region of the polishing pad that has polished the wafer then passes sequentially through the conditioner, the means for cleaning that removes diamond particles that may drop on the polishing pad, and through the slurry supplier that provides adequate slurry such that the polishing process can be repeated without scraping damage of the wafer. The means for cleaning of the present invention can have any shapes adapted to remove diamond particles on the polishing pad, such as circular or cylindrical brush sweeper.
摘要翻译：一种化学机械抛光平台，包括抛光台，晶片载体，抛光垫，浆料供应器，调理剂和用于清洁抛光垫的装置。关于原位或非原位化学机械抛光，晶片载体，调理剂和用于清洁抛光垫的装置适当地设置在抛光垫的上方。化学机械抛光通过抛光垫的旋转进行; 抛光晶片的抛光垫的区域然后依次通过调节器，用于清洁的装置去除可能落在抛光垫上的金刚石颗粒，并且通过提供足够浆料的浆料供应商，使得抛光过程可以重复而不刮擦晶片的损坏。用于清洁本发明的装置可以具有适于去除抛光垫上的金刚石颗粒的任何形状，例如圆形或圆柱形刷清扫机。

10. 发明申请

US20030148707A1 Dressing apparatus and polishing apparatus 有权
标题翻译：敷料装置和抛光装置
公开(公告)号：US20030148707A1
公开(公告)日：2003-08-07
申请号：US10204600
申请日：2003-01-24
发明人： Tetsuji Togawa , Ikutaro Noji , Shunichiro Kojima , Nobuyuki Takada
IPC分类号： B24B049/00 , B24B001/00
CPC分类号： B24B53/017 , B24B41/047 , B24B49/16 , B24B53/02 , B24B53/12
摘要： A dressing apparatus dresses a polishing surface of a polishing table used for polishing a workpiece such as a semiconductor wafer in a polishing apparatus. The dressing apparatus comprises a dresser body (31) connected to a dresser drive shaft (23) which is vertically movable, a dresser plate (32) which is vertically movable with respect to the dresser body (31), and a dressing member (22) held by the dresser plate (32) for dressing the polishing surface (1a).
摘要翻译：修整装置用于抛光抛光装置中用于抛光诸如半导体晶片的工件的抛光台的抛光表面。该修整装置包括连接到可上下移动的修整器驱动轴（23）的修整器主体（31），相对于修整器主体（31）可垂直移动的修整器板（32）和修整构件（22）），用于修整抛光表面（1a）。

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